TLV2451CP Equivalent & Substitute Parts

Part Overview

The TLV2451CP is a general-purpose operational amplifier manufactured by Texas Instruments, designed for rail-to-rail applications in low-voltage environments. This device integrates a single amplifier circuit in an 8-pin DIP package with through-hole mounting configuration. The TLV2451CP is classified as Last Time Buy, indicating discontinued production status. Identifying equivalent substitute parts is necessary to maintain design continuity and ensure component availability for new production runs and field replacements.

Substiute Parts

TLV2451CP

Texas InstrumentsIn Stock: 4150TLV2451CP Datasheet

Current PartRFQ

TLV2451CDR

Texas InstrumentsIn Stock: 781TLV2451CDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2451CP is determined by electrical and mechanical parameter equivalence. The critical parameters that define substitutability are:

Electrical Parameters (Must Match):

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 0.11 V/µs
• Gain Bandwidth Product: 220 kHz
• Current - Input Bias: 500 pA
• Voltage - Input Offset: 300 µV
• Current - Supply: 23 µA
• Current - Output / Channel: 10 mA
• Voltage - Supply Span: 2.7 V to 6 V
• Operating Temperature: 0°C to 70°C

Mechanical Parameters (Package Compatibility):

• Mounting Type: Through Hole or Surface Mount
• Package / Case: 8-pin configuration (DIP or SOIC variants)
• Pin count and functional pinout equivalence

The TLV2451CDR qualifies as a direct substitute based on identical electrical specifications. The primary difference is packaging format: the TLV2451CP uses through-hole 8-DIP mounting, while the TLV2451CDR uses surface-mount 8-SOIC configuration. Both share the same base product number (TLV2451) and maintain full electrical parameter compatibility.

Parameter Comparison

Engineering Selection Recommendations

For Through-Hole PCB Designs: The TLV2451CP remains the appropriate choice for existing through-hole circuit board layouts. However, due to Last Time Buy status, inventory depletion is expected. Designs should transition to surface-mount alternatives for long-term production sustainability.

For New Designs and Production Continuity: The TLV2451CDR is the recommended substitute for the TLV2451CP. This device maintains complete electrical equivalence while offering Active product status from Texas Instruments. The transition from through-hole to surface-mount packaging aligns with current manufacturing standards and ensures sustained component availability.

Compliance Considerations: Both parts maintain ROHS3 compliance and REACH Unaffected status, satisfying regulatory requirements for industrial and commercial applications. No additional compliance verification is required when substituting between these parts.

Inventory and Availability: The TLV2451CP has 4,063 units in stock (Last Time Buy status). The TLV2451CDR has 719 units in stock with Active product status. For applications requiring immediate component procurement, both options are currently available; however, long-term sourcing should prioritize the TLV2451CDR.

Frequently Asked Questions (FAQ)

Q: Can the TLV2451CDR directly replace the TLV2451CP in existing circuit designs?

A: Electrical substitution is complete. The TLV2451CDR provides identical amplifier performance, gain-bandwidth characteristics, and supply voltage specifications. However, physical board layout modification is required due to packaging differences: the TLV2451CP uses through-hole 8-DIP mounting while the TLV2451CDR uses surface-mount 8-SOIC configuration. PCB redesign is necessary for mechanical compatibility.

Q: What are the key differences between these two parts?

A: The primary differences are packaging format and product status. The TLV2451CP is a through-hole DIP package in Last Time Buy status. The TLV2451CDR is a surface-mount SOIC package with Active product status. All electrical parameters, including slew rate, gain-bandwidth product, input bias current, and supply voltage range, are identical.

Q: Why is the TLV2451CP classified as Last Time Buy?

A: Last Time Buy designation indicates that Texas Instruments has discontinued production of this part number. Existing inventory will be depleted, and no future manufacturing runs are planned. This status necessitates transition to alternative part numbers for sustained production.

Q: Are there any thermal or performance differences between the TLV2451CP and TLV2451CDR?

A: No thermal or performance differences exist. Both parts operate within the same temperature range (0°C to 70°C) and deliver identical electrical specifications. Package format differences do not affect amplifier performance characteristics.

Q: What is the moisture sensitivity level difference between these parts?

A: The TLV2451CP has Not Applicable moisture sensitivity level. The TLV2451CDR has MSL 1 (Unlimited), which is the least restrictive moisture sensitivity classification. This difference does not impact substitutability and does not impose additional handling requirements for the surface-mount variant.

Q: Can I use the TLV2451CDR in a through-hole socket designed for the TLV2451CP?

A: No. The TLV2451CDR is a surface-mount component and cannot be physically installed in through-hole sockets. PCB redesign with surface-mount pads and appropriate soldering equipment is required for implementation.

Q: What is the base product number for both parts?

A: Both the TLV2451CP and TLV2451CDR share the base product number TLV2451. The suffix designates packaging and configuration: CP indicates through-hole DIP packaging, while CDR indicates surface-mount SOIC with tape-and-reel delivery.