TLV2451AIP Equivalent & Substitute Parts

Part Overview

The TLV2451AIP is a general-purpose operational amplifier manufactured by Texas Instruments, designed for rail-to-rail signal processing applications. This device integrates a single amplifier circuit in an 8-pin DIP package with through-hole mounting configuration. The TLV2451AIP is classified as Last Time Buy, indicating discontinued production status. Identifying equivalent substitute parts is essential for design continuity, procurement planning, and long-term product support when original inventory becomes unavailable.

Substiute Parts

TLV2451AIP
Texas InstrumentsIn Stock: 1152TLV2451AIP Datasheet
TLV2451AIP
Current Part
TLV2451AIDR
Texas InstrumentsIn Stock: 2009TLV2451AIDR Datasheet
TLV2451AIDR
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type General Purpose
Number of Circuits 1
Output Type Rail-to-Rail
Slew Rate 0.11 V/µs
Gain Bandwidth Product 220 kHz
Current - Input Bias 500 pA
Voltage - Input Offset 300 µV
Current - Supply 23 µA
Current - Output / Channel 10 mA
Voltage - Supply Span (Min) 2.7 V
Voltage - Supply Span (Max) 6 V
Operating Temperature Range -40 to 125 °C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the TLV2451AIP is determined by electrical and mechanical parameter equivalence within the operational amplifier category. The following criteria establish valid substitution relationships:

Electrical Parameter Equivalence: All substitute parts must maintain identical specifications for amplifier type (General Purpose), number of circuits (1), output type (Rail-to-Rail), slew rate (0.11 V/µs), gain bandwidth product (220 kHz), input bias current (500 pA), input offset voltage (300 µV), supply current (23 µA), output current per channel (10 mA), supply voltage range (2.7 V to 6 V), and operating temperature range (-40°C to 125°C).

Mechanical and Packaging Compatibility: Substitute parts must be manufactured by Texas Instruments under the same base product number (TLV2451) to ensure functional equivalence. Packaging format differences (DIP versus SOIC) are permitted when electrical parameters remain unchanged, as these represent alternative mounting technologies for the same silicon die.

Compliance and Status: All substitute parts must maintain ROHS3 compliance and REACH unaffected status. Product status transitions from Last Time Buy to Active are acceptable for forward compatibility.

Parameter Comparison

Parameter TLV2451AIP (Main Part) TLV2451AIDR (Substitute) Match Status
Manufacturer Texas Instruments Texas Instruments Identical
Base Product Number TLV2451 TLV2451 Identical
Amplifier Type General Purpose General Purpose Identical
Number of Circuits 1 1 Identical
Output Type Rail-to-Rail Rail-to-Rail Identical
Slew Rate 0.11 V/µs 0.11 V/µs Identical
Gain Bandwidth Product 220 kHz 220 kHz Identical
Current - Input Bias 500 pA 500 pA Identical
Voltage - Input Offset 300 µV 300 µV Identical
Current - Supply 23 µA 23 µA Identical
Current - Output / Channel 10 mA 10 mA Identical
Voltage - Supply Span (Min) 2.7 V 2.7 V Identical
Voltage - Supply Span (Max) 6 V 6 V Identical
Operating Temperature Range -40°C to 125°C -40°C to 125°C Identical
Mounting Type Through Hole Surface Mount Different
Package / Case 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width) Different
Packaging Format Tube Tape & Reel (TR) Different
Product Status Last Time Buy Active Different
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical

Engineering Selection Recommendations

TLV2451AIDR as Primary Substitute:

The TLV2451AIDR is the manufacturer-recommended substitute for the TLV2451AIP. Both devices share identical electrical specifications and are derived from the same base product platform (TLV2451). The TLV2451AIDR maintains full functional equivalence across all operational parameters including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current capability, and supply voltage range.

Packaging and Mounting Considerations:

The primary difference between these parts is the package format. The TLV2451AIP uses through-hole 8-DIP packaging, while the TLV2451AIDR uses surface-mount 8-SOIC packaging. This distinction requires PCB layout modification and assembly process changes. Selection between these formats depends on manufacturing capability and board design requirements.

Product Status and Availability:

The TLV2451AIP carries Last Time Buy status, indicating production discontinuation. The TLV2451AIDR maintains Active status with higher current inventory (1900 pieces versus 1056 pieces), providing superior long-term availability and supply chain stability.

Compliance Assurance:

Both parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment for current and future applications.

Frequently Asked Questions (FAQ)

Q: Can the TLV2451AIDR directly replace the TLV2451AIP in existing designs?

A: Electrical substitution is complete. The TLV2451AIDR provides identical operational performance across all specified parameters. However, physical substitution requires PCB redesign due to package format differences (8-DIP through-hole versus 8-SOIC surface-mount). Direct socket replacement is not possible without adapter hardware.

Q: What are the key electrical parameters that confirm substitution validity?

A: Substitution validity is confirmed by matching specifications in amplifier type, circuit count, output type, slew rate (0.11 V/µs), gain bandwidth product (220 kHz), input bias current (500 pA), input offset voltage (300 µV), supply current (23 µA), output current (10 mA per channel), supply voltage range (2.7 V to 6 V), and operating temperature range (-40°C to 125°C). All these parameters are identical between the TLV2451AIP and TLV2451AIDR.

Q: Why does the TLV2451AIDR use different packaging?

A: The TLV2451AIDR employs 8-SOIC surface-mount packaging with tape and reel distribution, reflecting modern manufacturing standards and automated assembly processes. The TLV2451AIP uses traditional 8-DIP through-hole packaging in tube format. Both packages contain the same silicon die with identical electrical characteristics.

Q: Is the TLV2451AIDR suitable for new product designs?

A: Yes. The TLV2451AIDR carries Active product status, ensuring ongoing manufacturer support, continued availability, and long-term supply chain reliability. This makes it the appropriate choice for new designs requiring general-purpose rail-to-rail amplification in the specified voltage and temperature ranges.

Q: What compliance certifications apply to both parts?

A: Both the TLV2451AIP and TLV2451AIDR maintain ROHS3 compliance and REACH unaffected status. These certifications confirm environmental and regulatory alignment for current manufacturing and end-of-life disposal requirements.

Q: Are there inventory considerations when selecting between these parts?

A: Current inventory for the TLV2451AIDR (1900 pieces) exceeds that of the TLV2451AIP (1056 pieces). Given the Last Time Buy status of the TLV2451AIP, the TLV2451AIDR provides superior availability for both immediate procurement and future replenishment cycles.

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