TLV2450CP Equivalent & Substitute Parts

Part Overview

The TLV2450CP is a general-purpose operational amplifier manufactured by Texas Instruments, designed for rail-to-rail applications in low-voltage environments. This device features a single amplifier circuit housed in an 8-DIP through-hole package and operates across a 2.7V to 6V supply voltage range. The TLV2450CP is currently designated as Last Time Buy, indicating discontinued production status. Identifying equivalent and substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and support ongoing production requirements for applications utilizing this component.

Substiute Parts

TLV2450CP

Texas InstrumentsIn Stock: 1091TLV2450CP Datasheet

Current PartRFQ

TLV2450CDBVR

Texas InstrumentsIn Stock: 8478TLV2450CDBVR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2450CP is determined by electrical and mechanical parameter equivalence. The critical parameters that define substitutability are:

Electrical Parameters:

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 0.11 V/µs
• Gain Bandwidth Product: 220 kHz
• Current - Input Bias: 500 pA
• Voltage - Input Offset: 300 µV
• Current - Supply: 23 µA
• Current - Output / Channel: 10 mA
• Voltage - Supply Span: 2.7V to 6V
• Operating Temperature: 0°C to 70°C

Mechanical Parameters:

• Base Product Number: TLV2450
• RoHS and REACH Compliance

Substitute parts must maintain identical electrical specifications and compliance certifications. Packaging and mounting type may differ based on application requirements, provided the electrical performance remains unchanged.

Parameter Comparison

Engineering Selection Recommendations

The TLV2450CDBVR serves as the direct electrical equivalent to the TLV2450CP, sharing identical performance specifications across all measured parameters. Both devices are manufactured by Texas Instruments under the TLV2450 base product number and maintain full compliance with ROHS3 and REACH regulations.

The primary distinction between these parts is packaging and mounting technology. The TLV2450CP utilizes through-hole 8-DIP packaging suitable for breadboard prototyping and legacy PCB designs. The TLV2450CDBVR employs surface-mount SOT-23-6 packaging, appropriate for modern high-density PCB layouts and automated assembly processes.

The TLV2450CP is designated Last Time Buy, indicating production discontinuation. The TLV2450CDBVR maintains Active product status with significantly higher inventory availability (8393 units versus 1002 units), supporting long-term supply chain stability for new designs and ongoing production requirements.

Selection between these parts depends on PCB design requirements and assembly capabilities. Through-hole mounting is necessary for existing TLV2450CP designs without PCB modification. Surface-mount technology is preferred for new designs requiring compact form factors and automated manufacturing processes.

Frequently Asked Questions (FAQ)

Q: Are the TLV2450CP and TLV2450CDBVR electrically identical?

A: Yes. Both devices share identical electrical specifications including slew rate (0.11 V/µs), gain bandwidth product (220 kHz), input bias current (500 pA), input offset voltage (300 µV), supply current (23 µA), output current (10 mA), and supply voltage range (2.7V to 6V). Operating temperature range is identical at 0°C to 70°C.

Q: What is the primary difference between these two parts?

A: The TLV2450CP uses through-hole 8-DIP packaging for traditional PCB assembly, while the TLV2450CDBVR uses surface-mount SOT-23-6 packaging for modern automated assembly. Electrical performance is unchanged.

Q: Can I substitute the TLV2450CDBVR for the TLV2450CP in an existing design?

A: Electrical substitution is valid. However, PCB layout modification is required due to different package footprints. The through-hole 8-DIP footprint cannot be directly replaced with the surface-mount SOT-23-6 footprint without PCB redesign.

Q: Can I substitute the TLV2450CP for the TLV2450CDBVR?

A: Electrical substitution is valid. PCB layout modification is required. The surface-mount SOT-23-6 footprint cannot be directly replaced with the through-hole 8-DIP footprint without PCB redesign.

Q: Why is the TLV2450CP designated Last Time Buy?

A: Last Time Buy status indicates Texas Instruments has discontinued production of this part number. The TLV2450CDBVR represents the active continuation of this product line in surface-mount packaging.

Q: What compliance certifications apply to both parts?

A: Both the TLV2450CP and TLV2450CDBVR are ROHS3 Compliant and REACH Unaffected, meeting current environmental and regulatory requirements.

Q: Is pin-to-pin compatibility maintained between these packages?

A: No. The 8-DIP package has 8 pins in a through-hole configuration, while the SOT-23-6 package has 6 pins in a surface-mount configuration. Pin assignments differ between packages. Refer to device datasheets for specific pin mapping.

Q: Which part should I select for new designs?

A: The TLV2450CDBVR is recommended for new designs due to Active product status, higher inventory availability, and compatibility with modern surface-mount assembly processes.