TLV2450AIP Equivalent & Substitute Parts

Part Overview

The TLV2450AIP is a general-purpose operational amplifier manufactured by Texas Instruments, designed for rail-to-rail applications in low-voltage systems. This device integrates a single amplifier circuit in an 8-pin DIP package with through-hole mounting configuration. The TLV2450AIP is classified as Last Time Buy, indicating discontinued production status. Identifying equivalent substitute parts is essential for ongoing design support, production continuity, and long-term component availability in applications where this amplifier is currently deployed.

Substiute Parts

TLV2450AIP
Texas InstrumentsIn Stock: 765TLV2450AIP Datasheet
TLV2450AIP
Current Part
TLV2450AIDR
Texas InstrumentsIn Stock: 5214TLV2450AIDR Datasheet
TLV2450AIDR
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type General Purpose
Number of Circuits 1
Output Type Rail-to-Rail
Slew Rate 0.11 V/µs
Gain Bandwidth Product 220 kHz
Current - Input Bias 500 pA
Voltage - Input Offset 300 µV
Current - Supply 23 µA
Current - Output / Channel 10 mA
Voltage - Supply Span (Min) 2.7 V
Voltage - Supply Span (Max) 6 V
Operating Temperature Range -40 to 125 °C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)

Substitute Part Grouping Explanation

Substitution of the TLV2450AIP is determined by electrical and functional equivalence across the following critical parameters:

Electrical Equivalence Criteria:

  • Amplifier Type: General Purpose
  • Number of Circuits: 1
  • Output Type: Rail-to-Rail
  • Slew Rate: 0.11 V/µs
  • Gain Bandwidth Product: 220 kHz
  • Current - Input Bias: 500 pA
  • Voltage - Input Offset: 300 µV
  • Current - Supply: 23 µA
  • Current - Output / Channel: 10 mA
  • Voltage - Supply Span: 2.7 V to 6 V
  • Operating Temperature Range: -40°C to 125°C

Functional Equivalence: The TLV2450AIP and its substitute must share identical electrical performance characteristics, enabling direct functional replacement in circuit applications. The base product number TLV2450 identifies the core device family; variants differ only in packaging and mounting technology.

Packaging Consideration: While the TLV2450AIP uses through-hole 8-DIP packaging, substitute parts may employ surface-mount packaging (such as 8-SOIC) provided the electrical specifications remain unchanged. Packaging substitution requires board-level design modification and is not a pin-for-pin replacement without adapter solutions.

Parameter Comparison

Parameter TLV2450AIP (Main Part) TLV2450AIDR (Substitute) Match Status
Manufacturer Texas Instruments Texas Instruments Identical
Amplifier Type General Purpose General Purpose Identical
Number of Circuits 1 1 Identical
Output Type Rail-to-Rail Rail-to-Rail Identical
Slew Rate 0.11 V/µs 0.11 V/µs Identical
Gain Bandwidth Product 220 kHz 220 kHz Identical
Current - Input Bias 500 pA 500 pA Identical
Voltage - Input Offset 300 µV 300 µV Identical
Current - Supply 23 µA 23 µA Identical
Current - Output / Channel 10 mA 10 mA Identical
Voltage - Supply Span (Min) 2.7 V 2.7 V Identical
Voltage - Supply Span (Max) 6 V 6 V Identical
Operating Temperature Range -40°C to 125°C -40°C to 125°C Identical
Mounting Type Through Hole Surface Mount Different
Package / Case 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width) Different
Product Status Last Time Buy Active Different
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
REACH Status REACH Unaffected REACH Unaffected Identical

Engineering Selection Recommendations

Electrical Compatibility: The TLV2450AIDR provides complete electrical equivalence to the TLV2450AIP across all specified performance parameters. Both devices operate within identical voltage supply ranges (2.7 V to 6 V), temperature ranges (-40°C to 125°C), and deliver equivalent amplification characteristics. Selection between these parts is determined by packaging and mounting requirements rather than electrical performance.

Product Status Consideration: The TLV2450AIP carries Last Time Buy status, indicating production discontinuation. The TLV2450AIDR maintains Active product status with Texas Instruments, ensuring ongoing availability and supply chain continuity. For new designs or production planning beyond existing TLV2450AIP inventory, the TLV2450AIDR is the appropriate selection.

Packaging and Mounting: The primary distinction between these parts is packaging technology. The TLV2450AIP uses through-hole 8-DIP mounting suitable for conventional PCB assembly. The TLV2450AIDR employs surface-mount 8-SOIC packaging optimized for automated assembly processes. Substitution requires corresponding changes to PCB layout and assembly methodology.

Compliance and Regulatory: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying equivalent regulatory requirements for industrial and commercial applications.

Frequently Asked Questions (FAQ)

Q: Can the TLV2450AIDR directly replace the TLV2450AIP in existing circuit boards?

A: Electrical substitution is complete; however, physical replacement requires PCB modification. The TLV2450AIP uses through-hole 8-DIP packaging while the TLV2450AIDR uses surface-mount 8-SOIC packaging. Direct socket replacement is not possible without adapter hardware or PCB redesign.

Q: Are the electrical specifications identical between TLV2450AIP and TLV2450AIDR?

A: Yes. Both devices share identical electrical parameters including slew rate (0.11 V/µs), gain bandwidth product (220 kHz), input bias current (500 pA), input offset voltage (300 µV), supply current (23 µA), output current (10 mA), and operating temperature range (-40°C to 125°C).

Q: Why is the TLV2450AIP marked as Last Time Buy?

A: Last Time Buy status indicates Texas Instruments has discontinued production of this part number. The TLV2450AIDR, with identical electrical performance and Active status, represents the current production equivalent.

Q: What is the difference between 8-DIP and 8-SOIC packaging?

A: 8-DIP (Dual In-line Package) is a through-hole package with 0.300" (7.62mm) width, suitable for conventional PCB assembly. 8-SOIC (Small Outline Integrated Circuit) is a surface-mount package with 0.154" (3.90mm) width, optimized for automated assembly and higher-density PCB layouts.

Q: Are both parts RoHS and REACH compliant?

A: Yes. Both the TLV2450AIP and TLV2450AIDR are ROHS3 compliant and REACH unaffected, meeting equivalent environmental and regulatory standards.

Q: Can I use the TLV2450AIDR in a design originally specified for the TLV2450AIP?

A: Electrical substitution is valid for circuit-level design. However, physical implementation requires PCB layout modification to accommodate 8-SOIC surface-mount footprint instead of 8-DIP through-hole footprint. Schematic-level compatibility is complete.

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