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TLV2450AIP Equivalent & Substitute Parts
Part Overview
The TLV2450AIP is a general-purpose operational amplifier manufactured by Texas Instruments, designed for rail-to-rail applications in low-voltage systems. This device integrates a single amplifier circuit in an 8-pin DIP package with through-hole mounting configuration. The TLV2450AIP is classified as Last Time Buy, indicating discontinued production status. Identifying equivalent substitute parts is essential for ongoing design support, production continuity, and long-term component availability in applications where this amplifier is currently deployed.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Amplifier Type | General Purpose | — |
| Number of Circuits | 1 | — |
| Output Type | Rail-to-Rail | — |
| Slew Rate | 0.11 | V/µs |
| Gain Bandwidth Product | 220 | kHz |
| Current - Input Bias | 500 | pA |
| Voltage - Input Offset | 300 | µV |
| Current - Supply | 23 | µA |
| Current - Output / Channel | 10 | mA |
| Voltage - Supply Span (Min) | 2.7 | V |
| Voltage - Supply Span (Max) | 6 | V |
| Operating Temperature Range | -40 to 125 | °C |
| Mounting Type | Through Hole | — |
| Package / Case | 8-DIP (0.300", 7.62mm) | — |
Substitute Part Grouping Explanation
Substitution of the TLV2450AIP is determined by electrical and functional equivalence across the following critical parameters:
Electrical Equivalence Criteria:
- Amplifier Type: General Purpose
- Number of Circuits: 1
- Output Type: Rail-to-Rail
- Slew Rate: 0.11 V/µs
- Gain Bandwidth Product: 220 kHz
- Current - Input Bias: 500 pA
- Voltage - Input Offset: 300 µV
- Current - Supply: 23 µA
- Current - Output / Channel: 10 mA
- Voltage - Supply Span: 2.7 V to 6 V
- Operating Temperature Range: -40°C to 125°C
Functional Equivalence: The TLV2450AIP and its substitute must share identical electrical performance characteristics, enabling direct functional replacement in circuit applications. The base product number TLV2450 identifies the core device family; variants differ only in packaging and mounting technology.
Packaging Consideration: While the TLV2450AIP uses through-hole 8-DIP packaging, substitute parts may employ surface-mount packaging (such as 8-SOIC) provided the electrical specifications remain unchanged. Packaging substitution requires board-level design modification and is not a pin-for-pin replacement without adapter solutions.
Parameter Comparison
| Parameter | TLV2450AIP (Main Part) | TLV2450AIDR (Substitute) | Match Status |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Identical |
| Amplifier Type | General Purpose | General Purpose | Identical |
| Number of Circuits | 1 | 1 | Identical |
| Output Type | Rail-to-Rail | Rail-to-Rail | Identical |
| Slew Rate | 0.11 V/µs | 0.11 V/µs | Identical |
| Gain Bandwidth Product | 220 kHz | 220 kHz | Identical |
| Current - Input Bias | 500 pA | 500 pA | Identical |
| Voltage - Input Offset | 300 µV | 300 µV | Identical |
| Current - Supply | 23 µA | 23 µA | Identical |
| Current - Output / Channel | 10 mA | 10 mA | Identical |
| Voltage - Supply Span (Min) | 2.7 V | 2.7 V | Identical |
| Voltage - Supply Span (Max) | 6 V | 6 V | Identical |
| Operating Temperature Range | -40°C to 125°C | -40°C to 125°C | Identical |
| Mounting Type | Through Hole | Surface Mount | Different |
| Package / Case | 8-DIP (0.300", 7.62mm) | 8-SOIC (0.154", 3.90mm Width) | Different |
| Product Status | Last Time Buy | Active | Different |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| REACH Status | REACH Unaffected | REACH Unaffected | Identical |
Engineering Selection Recommendations
Electrical Compatibility: The TLV2450AIDR provides complete electrical equivalence to the TLV2450AIP across all specified performance parameters. Both devices operate within identical voltage supply ranges (2.7 V to 6 V), temperature ranges (-40°C to 125°C), and deliver equivalent amplification characteristics. Selection between these parts is determined by packaging and mounting requirements rather than electrical performance.
Product Status Consideration: The TLV2450AIP carries Last Time Buy status, indicating production discontinuation. The TLV2450AIDR maintains Active product status with Texas Instruments, ensuring ongoing availability and supply chain continuity. For new designs or production planning beyond existing TLV2450AIP inventory, the TLV2450AIDR is the appropriate selection.
Packaging and Mounting: The primary distinction between these parts is packaging technology. The TLV2450AIP uses through-hole 8-DIP mounting suitable for conventional PCB assembly. The TLV2450AIDR employs surface-mount 8-SOIC packaging optimized for automated assembly processes. Substitution requires corresponding changes to PCB layout and assembly methodology.
Compliance and Regulatory: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying equivalent regulatory requirements for industrial and commercial applications.
Frequently Asked Questions (FAQ)
Q: Can the TLV2450AIDR directly replace the TLV2450AIP in existing circuit boards?
A: Electrical substitution is complete; however, physical replacement requires PCB modification. The TLV2450AIP uses through-hole 8-DIP packaging while the TLV2450AIDR uses surface-mount 8-SOIC packaging. Direct socket replacement is not possible without adapter hardware or PCB redesign.
Q: Are the electrical specifications identical between TLV2450AIP and TLV2450AIDR?
A: Yes. Both devices share identical electrical parameters including slew rate (0.11 V/µs), gain bandwidth product (220 kHz), input bias current (500 pA), input offset voltage (300 µV), supply current (23 µA), output current (10 mA), and operating temperature range (-40°C to 125°C).
Q: Why is the TLV2450AIP marked as Last Time Buy?
A: Last Time Buy status indicates Texas Instruments has discontinued production of this part number. The TLV2450AIDR, with identical electrical performance and Active status, represents the current production equivalent.
Q: What is the difference between 8-DIP and 8-SOIC packaging?
A: 8-DIP (Dual In-line Package) is a through-hole package with 0.300" (7.62mm) width, suitable for conventional PCB assembly. 8-SOIC (Small Outline Integrated Circuit) is a surface-mount package with 0.154" (3.90mm) width, optimized for automated assembly and higher-density PCB layouts.
Q: Are both parts RoHS and REACH compliant?
A: Yes. Both the TLV2450AIP and TLV2450AIDR are ROHS3 compliant and REACH unaffected, meeting equivalent environmental and regulatory standards.
Q: Can I use the TLV2450AIDR in a design originally specified for the TLV2450AIP?
A: Electrical substitution is valid for circuit-level design. However, physical implementation requires PCB layout modification to accommodate 8-SOIC surface-mount footprint instead of 8-DIP through-hole footprint. Schematic-level compatibility is complete.
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