TLV2432ID Equivalent & Substitute Parts

Part Overview

The TLV2432ID is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, housed in an 8-SOIC surface mount package. This device features rail-to-rail output capability and is designed for low-power analog signal processing applications. The TLV2432ID is classified as Last Time Buy, indicating that the original tube packaging variant is being phased out. Identifying equivalent and substitute parts is necessary to ensure design continuity, maintain supply chain flexibility, and support long-term production requirements.

Substiute Parts

TLV2432ID

Texas InstrumentsIn Stock: 1147TLV2432ID Datasheet

Current PartRFQ

TLV2432IDR

Texas InstrumentsIn Stock: 3528TLV2432IDR Datasheet

MFR RecommendedRFQ

ALD2711SAL

Advanced Linear Devices Inc.In Stock: 797ALD2711SAL Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2432ID is determined by strict equivalence across the following critical parameters:

Primary Substitution Criteria:

• Amplifier Type: CMOS
• Number of Circuits: 2
• Output Type: Rail-to-Rail
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Mounting Type: Surface Mount

Secondary Compatibility Parameters:

• Slew Rate: 0.25 V/µs (minimum acceptable)
• Gain Bandwidth Product: 550 kHz (minimum acceptable)
• Current - Input Bias: 1 pA (maximum acceptable)
• Voltage - Input Offset: 300 µV (maximum acceptable)
• Current - Supply: 100 µA per channel (maximum acceptable)
• Current - Output / Channel: 50 mA (minimum acceptable)
• Voltage - Supply Span: 2.7 V to 10 V (operating range must encompass or match)
• Operating Temperature: -40°C to 85°C (minimum acceptable range)

Two substitute parts are identified:

1. TLV2432IDR (Texas Instruments, Tape & Reel packaging): Identical electrical specifications and package. Differs only in packaging format and product status (Active vs. Last Time Buy).

2. ALD2711SAL (Advanced Linear Devices Inc., Tube packaging): Functionally superior specifications in slew rate, gain bandwidth product, and input bias current. Operates within a reduced temperature range (0°C to 70°C) and has lower output current capability (1 mA vs. 50 mA).

Parameter Comparison

Engineering Selection Recommendations

TLV2432IDR Selection: The TLV2432IDR is the direct equivalent to TLV2432ID. Both devices share identical electrical specifications, package geometry, and compliance certifications (ROHS3, MSL 1). The TLV2432IDR differs only in packaging format (Tape & Reel vs. Tube) and maintains Active product status, ensuring long-term availability. This part is suitable for direct substitution in all applications where the TLV2432ID was originally specified.

ALD2711SAL Selection: The ALD2711SAL is a functionally enhanced alternative manufactured by Advanced Linear Devices Inc. This device provides superior performance in slew rate (1 V/µs vs. 0.25 V/µs), gain bandwidth product (1 MHz vs. 550 kHz), and input bias current (0.01 pA vs. 1 pA). However, the ALD2711SAL has the following constraints:

• Operating temperature range limited to 0°C to 70°C (vs. -40°C to 85°C for TLV2432ID)
• Output current per channel reduced to 1 mA (vs. 50 mA for TLV2432ID)
• Input offset voltage increased to 800 µV (vs. 300 µV for TLV2432ID)
• Supply current doubled to 200 µA per channel (vs. 100 µA for TLV2432ID)

The ALD2711SAL is suitable only for applications that do not require the full output current capability of the TLV2432ID and operate within the narrower temperature range.

Both substitute parts maintain ROHS3 compliance and MSL 1 rating, ensuring compatibility with standard manufacturing and storage requirements.

Frequently Asked Questions (FAQ)

Q1: Can TLV2432IDR be used as a direct replacement for TLV2432ID?

A: Yes. The TLV2432IDR is electrically and mechanically identical to the TLV2432ID. The only difference is the packaging format: TLV2432IDR is supplied in Tape & Reel format, while TLV2432ID is supplied in Tube format. Both devices are housed in 8-SOIC packages with identical pin configurations and electrical characteristics. The TLV2432IDR is recommended for new designs and high-volume production due to its Active product status.

Q2: Under what conditions can ALD2711SAL substitute for TLV2432ID?

A: The ALD2711SAL can substitute for TLV2432ID only when all of the following conditions are met:

• The application operates within the temperature range of 0°C to 70°C
• The output current requirement per channel does not exceed 1 mA
• The application can tolerate an input offset voltage of 800 µV (vs. 300 µV)
• The application can tolerate increased supply current of 200 µA per channel (vs. 100 µA)

If any of these constraints conflict with the design requirements, the ALD2711SAL is not suitable.

Q3: What is the significance of the 8-SOIC package specification?

A: The 8-SOIC (Small Outline Integrated Circuit) package is a surface mount package with 8 pins, measuring 0.154 inches (3.90 mm) in width. All three parts (TLV2432ID, TLV2432IDR, and ALD2711SAL) use this identical package geometry, ensuring mechanical compatibility on printed circuit boards. Pin-to-pin compatibility is guaranteed across all three devices.

Q4: Why is TLV2432ID classified as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments is discontinuing production of the TLV2432ID in Tube packaging format. Customers requiring this specific packaging variant should transition to the TLV2432IDR (Tape & Reel format) or complete their inventory purchases before the Last Time Buy deadline. The electrical functionality remains unchanged.

Q5: Are all three parts RoHS3 compliant?

A: Yes. The TLV2432ID, TLV2432IDR, and ALD2711SAL are all ROHS3 compliant and carry Moisture Sensitivity Level 1 (Unlimited), indicating they meet current environmental and reliability standards for industrial and commercial applications.

Q6: What is the difference between Tube and Tape & Reel packaging?

A: Tube packaging supplies components in plastic tubes, typically used for lower-volume orders and manual assembly. Tape & Reel packaging supplies components on continuous tape wound on reels, optimized for automated pick-and-place assembly in high-volume manufacturing. Both formats contain identical components; the difference is in handling and assembly methodology.