TLV2375IN Equivalent & Substitute Parts

Part Overview

The TLV2375IN is a general-purpose operational amplifier manufactured by Texas Instruments, featuring four independent circuits in a 16-pin DIP package. This device is classified as a Last Time Buy product, indicating discontinued production with limited remaining inventory. The TLV2375IN provides rail-to-rail output capability, making it suitable for low-voltage analog signal processing applications requiring compact through-hole mounting.

Identification of equivalent and substitute parts is necessary due to the Last Time Buy status of the TLV2375IN. Organizations requiring this component for ongoing production or maintenance applications must evaluate functionally compatible alternatives to ensure long-term supply chain continuity.

Substiute Parts

TLV2375IN

Texas InstrumentsIn Stock: 1094TLV2375IN Datasheet

Current PartRFQ

TLV2375IDR

Texas InstrumentsIn Stock: 24068TLV2375IDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2375IN is determined by electrical parameter equivalence and functional compatibility. The following criteria establish valid substitution relationships:

Electrical Equivalence Requirements:

• Amplifier Type: General Purpose
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 2.1 V/µs
• Gain Bandwidth Product: 3 MHz
• Current - Input Bias: 1 pA
• Voltage - Input Offset: 2 mV
• Current - Supply: 750 µA (x4 Channels)
• Current - Output per Channel: 16 mA
• Voltage - Supply Span: 2.7 V to 16 V
• Operating Temperature Range: -40°C to 125°C

Mechanical and Packaging Considerations: Substitute parts may differ in mounting type and package configuration while maintaining electrical equivalence. Through-hole and surface-mount variants of the same base product number (TLV2375) are considered functionally interchangeable when all electrical parameters remain identical.

Parameter Comparison

Engineering Selection Recommendations

TLV2375IDR as Primary Substitute:

The TLV2375IDR is the manufacturer-recommended substitute for the TLV2375IN. Both devices share identical electrical specifications across all operational parameters, including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current capability, and supply voltage range.

The TLV2375IDR differs from the TLV2375IN in package configuration and mounting technology. The TLV2375IDR uses a 16-SOIC surface-mount package, whereas the TLV2375IN uses a 16-DIP through-hole package. This distinction requires PCB layout modification and assembly process changes.

Product Status Consideration:

The TLV2375IN carries a Last Time Buy status, indicating production discontinuation. The TLV2375IDR maintains Active product status with significantly higher inventory availability (24,043 pieces versus 1,044 pieces), supporting long-term supply chain reliability.

Compliance and Certification:

Both parts maintain ROHS3 compliance and REACH Unaffected status, satisfying regulatory requirements for electronics manufacturing and distribution in regulated markets.

Selection Criteria:

• Select TLV2375IDR when surface-mount assembly capability exists and long-term supply continuity is required
• Retain TLV2375IN only when through-hole mounting is mandated by existing PCB design constraints and immediate availability is prioritized over future supply assurance

Frequently Asked Questions (FAQ)

Q: Can the TLV2375IDR directly replace the TLV2375IN in existing circuit designs?

A: Electrical substitution is complete. The TLV2375IDR provides identical operational characteristics across all specified parameters. However, physical substitution requires PCB redesign due to package differences. The TLV2375IN uses through-hole DIP mounting, while the TLV2375IDR requires surface-mount SOIC footprints.

Q: What is the significance of the Last Time Buy status on the TLV2375IN?

A: Last Time Buy designation indicates that Texas Instruments has discontinued production of the TLV2375IN. Existing inventory will be depleted without replenishment. Organizations dependent on this component must transition to alternative parts, such as the TLV2375IDR, to maintain supply chain continuity.

Q: Are there electrical performance differences between the TLV2375IN and TLV2375IDR?

A: No. Both devices are manufactured to identical electrical specifications. Slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, and supply voltage range are equivalent across both parts.

Q: What packaging and inventory advantages does the TLV2375IDR offer?

A: The TLV2375IDR is supplied in Tape & Reel format suitable for automated assembly processes, whereas the TLV2375IN is supplied in Tube format for manual handling. The TLV2375IDR maintains significantly higher inventory levels (24,043 pieces available), supporting volume production requirements and reducing lead time risk.

Q: Are both parts compliant with current regulatory standards?

A: Yes. Both the TLV2375IN and TLV2375IDR are ROHS3 compliant and REACH Unaffected, meeting regulatory requirements for electronics manufacturing and distribution in regulated jurisdictions.

Q: What design considerations apply when transitioning from TLV2375IN to TLV2375IDR?

A: PCB layout modification is required. The 16-DIP through-hole footprint must be replaced with a 16-SOIC surface-mount footprint. Assembly process changes from through-hole insertion to surface-mount reflow soldering are necessary. All electrical circuit parameters remain unchanged.