TLV2373IN Equivalent & Substitute Parts

Part Overview

The TLV2373IN is a general-purpose operational amplifier featuring dual circuits with rail-to-rail output capability, manufactured by Texas Instruments. This device is packaged in a 14-pin DIP (Dual In-line Package) configuration suitable for through-hole mounting applications. The TLV2373IN is classified as Last Time Buy, indicating discontinued production status. Identifying equivalent substitute parts becomes necessary for ongoing design support, production continuity, and long-term component availability assurance.

Substiute Parts

TLV2373IN

Texas InstrumentsIn Stock: 818TLV2373IN Datasheet

Current PartRFQ

TLV2373IDR

Texas InstrumentsIn Stock: 2819TLV2373IDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2373IN is determined by electrical parameter equivalence and functional compatibility. The critical parameters defining substitutability are:

Electrical Equivalence Criteria:

• Amplifier Type: General Purpose
• Number of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 2.1 V/µs
• Gain Bandwidth Product: 3 MHz
• Current - Input Bias: 1 pA
• Voltage - Input Offset: 2 mV
• Current - Supply: 750 µA (x2 Channels)
• Current - Output / Channel: 16 mA
• Voltage - Supply Span: 2.7 V to 16 V
• Operating Temperature Range: -40°C to 125°C

Mechanical Compatibility Consideration: The TLV2373IN uses through-hole mounting in a 14-DIP package. Substitute parts may employ different mounting technologies (surface mount) provided all electrical parameters remain identical and the base product number (TLV2373) is maintained.

Parameter Comparison

Engineering Selection Recommendations

TLV2373IDR as Primary Substitute:

The TLV2373IDR is the manufacturer-recommended substitute for the TLV2373IN. All electrical parameters, performance specifications, and compliance certifications are identical. Both devices maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory equivalence.

The primary distinction is packaging and mounting technology. The TLV2373IDR employs surface-mount technology in a 14-SOIC package, whereas the TLV2373IN uses through-hole mounting in a 14-DIP package. This difference requires circuit board redesign if direct pin-for-pin replacement is required.

The TLV2373IDR carries Active product status, providing long-term availability assurance compared to the Last Time Buy status of the TLV2373IN. Current inventory of the TLV2373IDR (2723 pieces) exceeds that of the TLV2373IN (729 pieces), supporting production continuity planning.

Frequently Asked Questions (FAQ)

Q: Can the TLV2373IDR directly replace the TLV2373IN without circuit modification?

A: Electrical substitution is complete; all performance parameters are identical. However, physical replacement requires circuit board redesign due to different mounting technologies (surface mount versus through-hole) and package geometries (14-SOIC versus 14-DIP).

Q: What are the key electrical parameters that define substitutability for the TLV2373IN?

A: Substitutable parts must maintain identical values for: amplifier type (general purpose), circuit count (2), output type (rail-to-rail), slew rate (2.1 V/µs), gain bandwidth product (3 MHz), input bias current (1 pA), input offset voltage (2 mV), supply current (750 µA per channel), output current (16 mA per channel), supply voltage range (2.7 V to 16 V), and operating temperature range (-40°C to 125°C).

Q: Why is the TLV2373IDR recommended over the TLV2373IN?

A: The TLV2373IDR maintains Active product status, ensuring continued manufacturing and long-term availability. The TLV2373IN is Last Time Buy, indicating production discontinuation. Both devices are electrically equivalent; the choice depends on circuit board design constraints and manufacturing timeline requirements.

Q: Are there compliance differences between the TLV2373IN and TLV2373IDR?

A: No. Both devices are ROHS3 compliant and REACH unaffected. Regulatory and environmental compliance certifications are identical.

Q: What packaging options are available for the TLV2373 base product?

A: The TLV2373 base product is available in two package configurations: 14-DIP (through-hole, TLV2373IN) and 14-SOIC (surface mount, TLV2373IDR). Both maintain identical electrical specifications.