TLV2352IP Equivalent & Substitute Parts

Part Overview

The TLV2352IP is a dual differential comparator IC manufactured by Texas Instruments, housed in an 8-pin DIP package for through-hole mounting. This LinCMOS™ series component operates across a 2V to 8V supply voltage range and features CMOS/MOS open-drain TTL output configuration. The TLV2352IP is currently in Last Time Buy status, indicating discontinued production. Identifying qualified substitute parts is necessary to ensure design continuity and maintain component availability for new production runs and field replacements.

Substiute Parts

TLV2352IP

Texas InstrumentsIn Stock: 1819TLV2352IP Datasheet

Current PartRFQ

TLV2352IDR

Texas InstrumentsIn Stock: 2566TLV2352IDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2352IP is determined by electrical and mechanical parameter equivalence within the LinCMOS™ comparator family. The critical parameters governing substitutability are:

• Dual differential comparator topology (2 elements)
• CMOS/MOS open-drain TTL output configuration
• Supply voltage range: 2V ~ 8V
• Input offset voltage: 5mV @ 5V maximum
• Input bias current: 5pA @ 5V maximum
• Output current capability: 20mA typical
• Quiescent current: 400µA maximum
• Operating temperature range: -40°C ~ 85°C
• Base product number: TLV2352

The TLV2352IDR qualifies as a direct electrical substitute, maintaining identical electrical specifications while differing only in package format and mounting technology. Both parts share the same base product number and functional characteristics, ensuring pin-compatible operation in equivalent circuit applications.

Parameter Comparison

Engineering Selection Recommendations

The TLV2352IDR is the qualified substitute for the TLV2352IP based on electrical parameter equivalence and active product status. Both components maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements for new designs and production transitions.

Selection between these parts depends on board-level design constraints:

• TLV2352IP (8-DIP Through Hole): Suitable for through-hole PCB designs, legacy board layouts, and applications requiring DIP package form factor.
• TLV2352IDR (8-SOIC Surface Mount): Recommended for new designs, surface-mount PCB assemblies, and applications prioritizing compact board footprint and automated assembly processes.

The TLV2352IDR is the preferred choice for new production due to its Active product status, ensuring long-term availability and supply chain stability compared to the Last Time Buy status of the TLV2352IP.

Frequently Asked Questions (FAQ)

Q: Can TLV2352IDR directly replace TLV2352IP in existing designs?

A: Electrical substitution is direct. Pin configuration and functional behavior are identical. Physical board integration differs due to package format: TLV2352IP uses through-hole DIP mounting while TLV2352IDR requires surface-mount SOIC footprint. PCB redesign is necessary if changing package types.

Q: What are the key differences between these parts?

A: Electrical specifications are identical. Differences are limited to packaging format (8-DIP vs. 8-SOIC), mounting technology (through-hole vs. surface-mount), and product lifecycle status (Last Time Buy vs. Active).

Q: Why is TLV2352IP in Last Time Buy status?

A: Last Time Buy status indicates Texas Instruments has discontinued production of the 8-DIP package variant. The TLV2352IDR in 8-SOIC format remains in active production, providing continuity for the TLV2352 comparator family.

Q: Are there any electrical performance differences between the packages?

A: No. Both parts maintain identical electrical specifications including supply voltage range, input offset voltage, input bias current, output current, quiescent current, and operating temperature range.

Q: What compliance certifications apply to both parts?

A: Both TLV2352IP and TLV2352IDR are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards for electronic components.

Q: Which part should be selected for new PCB designs?

A: TLV2352IDR is recommended for new designs due to Active product status, ensuring sustained availability and supply chain reliability. Surface-mount SOIC packaging also aligns with modern PCB assembly processes.