TLV2342IDRG4 Equivalent & Substitute Parts

Part Overview

The TLV2342IDRG4 is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, part of the LinCMOS™ series. This device integrates two independent amplifier circuits in an 8-SOIC surface mount package and is designed for low-power, general-purpose analog signal processing applications requiring rail-to-rail operation across a 2V to 8V supply range.

The TLV2342IDRG4 carries an Obsolete product status. Locating equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this amplifier topology.

Substiute Parts

TLV2342IDRG4

Texas InstrumentsIn Stock: 955TLV2342IDRG4 Datasheet

Current PartRFQ

TLV2342IPW

Texas InstrumentsIn Stock: 3244TLV2342IPW Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2342IDRG4 is determined by electrical and mechanical compatibility across the following critical parameters:

Electrical Compatibility Criteria:

• Amplifier Type: CMOS topology
• Number of Circuits: Dual-channel configuration (2 independent amplifiers)
• Slew Rate: 3.6 V/µs
• Gain Bandwidth Product: 1.7 MHz
• Input Bias Current: 0.6 pA
• Input Offset Voltage: 1.1 mV
• Supply Current: 1.4 mA per channel
• Output Current Capability: 30 mA per channel
• Supply Voltage Range: 2V to 8V
• Operating Temperature: −40°C to 85°C

Mechanical Compatibility Criteria:

• Mounting Type: Surface Mount
• Package Family: 8-pin SOIC or TSSOP variants
• Pin Configuration: Functionally equivalent pinout

Compliance Criteria:

• RoHS3 Compliance
• Moisture Sensitivity Level 1
• REACH Unaffected status

Substitute parts must match all electrical parameters and maintain functional pin compatibility while accommodating alternative package geometries within the 8-pin surface mount family.

Parameter Comparison

Engineering Selection Recommendations

TLV2342IPW (8-TSSOP Package)

The TLV2342IPW is the primary substitute for the TLV2342IDRG4. Both devices share identical electrical specifications, including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current capability, and operating temperature range. Both are manufactured by Texas Instruments under the LinCMOS™ series and maintain full compliance with ROHS3, REACH, and MSL 1 requirements.

The principal difference between these parts is the package geometry: the TLV2342IDRG4 uses an 8-SOIC package (0.154" width, 3.90mm), while the TLV2342IPW uses an 8-TSSOP package (0.173" width, 4.40mm). Both are surface mount packages with functionally equivalent pinouts. The TLV2342IPW carries a Last Time Buy product status, indicating limited future availability.

Selection of the TLV2342IPW requires PCB layout modification to accommodate the TSSOP package footprint. Pin-to-pin electrical functionality remains unchanged, ensuring circuit operation without modification to schematic design or firmware.

Frequently Asked Questions (FAQ)

Q: Can the TLV2342IPW directly replace the TLV2342IDRG4 without circuit modification?

A: The TLV2342IPW provides electrical equivalence to the TLV2342IDRG4 across all specified parameters. However, the package geometry differs: 8-SOIC versus 8-TSSOP. Direct PCB footprint substitution is not possible without layout redesign. Pin functionality and electrical performance remain identical.

Q: What is the primary difference between the 8-SOIC and 8-TSSOP packages?

A: The 8-SOIC package measures 0.154 inches (3.90mm) in width, while the 8-TSSOP package measures 0.173 inches (4.40mm) in width. Both are surface mount packages with eight pins. The TSSOP package provides a smaller pitch and more compact footprint suitable for space-constrained applications.

Q: Are there compliance or regulatory differences between these substitute parts?

A: No. Both the TLV2342IDRG4 and TLV2342IPW maintain identical compliance status: ROHS3 Compliant, REACH Unaffected, and Moisture Sensitivity Level 1 (Unlimited). Both carry EAR99 ECCN classification and identical HTSUS codes.

Q: What does the Last Time Buy status of the TLV2342IPW indicate?

A: Last Time Buy status indicates that Texas Instruments has announced limited future production of this part number. Existing inventory remains available, but no new manufacturing runs are planned. This status differs from the Obsolete designation of the TLV2342IDRG4, which indicates the part is no longer manufactured or supported.

Q: Are the electrical specifications identical between TLV2342IDRG4 and TLV2342IPW?

A: Yes. Both devices share identical specifications for slew rate (3.6 V/µs), gain bandwidth product (1.7 MHz), input bias current (0.6 pA), input offset voltage (1.1 mV), supply current (1.4 mA per channel), output current (30 mA per channel), supply voltage range (2V to 8V), and operating temperature range (−40°C to 85°C).

Q: What PCB design considerations apply when substituting the TLV2342IPW for the TLV2342IDRG4?

A: The TSSOP package requires a different footprint pattern than the SOIC package. PCB layout must be modified to accommodate the TSSOP pin spacing and pad geometry. Trace routing, via placement, and component placement around the device may require adjustment. Electrical schematic connections remain unchanged.

Q: Can I use the TLV2342IDRG4 footprint for the TLV2342IPW?

A: No. The 8-SOIC and 8-TSSOP packages have different pin pitch and pad dimensions. Using an SOIC footprint for a TSSOP device will result in misalignment and connection failure. A new PCB layout with the correct TSSOP footprint is required.