TLV2322IP Equivalent & Substitute Parts

Part Overview

The TLV2322IP is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, designed for low-power analog signal processing applications. This device integrates two independent amplifier circuits in an 8-pin DIP package with through-hole mounting configuration. The TLV2322IP operates across a wide supply voltage range of 2V to 8V and maintains ultra-low input bias current characteristics suitable for high-impedance signal sources.

The TLV2322IP carries a Last Time Buy product status, indicating that Texas Instruments has discontinued active production. This status necessitates identification of equivalent substitute components to ensure design continuity and procurement availability for new production runs and ongoing support of existing applications.

Key Parameters

Parameter	Value	Unit
Amplifier Type	CMOS	—
Number of Circuits	2	—
Slew Rate	0.03	V/µs
Gain Bandwidth Product	85	kHz
Current - Input Bias	0.6	pA
Voltage - Input Offset	1.1	mV
Current - Supply (per Channel)	20	µA
Current - Output per Channel	30	mA
Voltage - Supply Span (Min)	2	V
Voltage - Supply Span (Max)	8	V
Operating Temperature Range	-40 to 85	°C
Package Type	8-DIP (0.300", 7.62mm)	—
Mounting Type	Through Hole	—

Substitute Part Grouping Explanation

Substitution eligibility for the TLV2322IP is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Criteria:

Amplifier Type: CMOS technology
Number of Circuits: Dual-channel (2 circuits)
Slew Rate: 0.03 V/µs
Gain Bandwidth Product: 85 kHz
Input Bias Current: 0.6 pA
Input Offset Voltage: 1.1 mV
Supply Current: 20 µA per channel
Output Current Capability: 30 mA per channel
Supply Voltage Range: 2V to 8V minimum and maximum
Operating Temperature: -40°C to 85°C

Mechanical and Packaging Considerations: Substitute parts must maintain the same base product number (TLV2322) to ensure identical die and electrical performance. Packaging format differences (DIP versus SOIC) are permissible when circuit board layout and assembly process accommodate the alternative mounting technology. Pin configuration and functional pinout must remain identical.

Compliance Requirements: All substitute parts must maintain RoHS3 compliance and REACH unaffected status to satisfy regulatory requirements equivalent to the original component.

Parameter Comparison

Parameter	TLV2322IP (Main Part)	TLV2322IDR (Substitute)	Match Status
Manufacturer	Texas Instruments	Texas Instruments	Identical
Base Product Number	TLV2322	TLV2322	Identical
Amplifier Type	CMOS	CMOS	Identical
Number of Circuits	2	2	Identical
Slew Rate	0.03 V/µs	0.03 V/µs	Identical
Gain Bandwidth Product	85 kHz	85 kHz	Identical
Input Bias Current	0.6 pA	0.6 pA	Identical
Input Offset Voltage	1.1 mV	1.1 mV	Identical
Supply Current per Channel	20 µA	20 µA	Identical
Output Current per Channel	30 mA	30 mA	Identical
Supply Voltage Range (Min)	2 V	2 V	Identical
Supply Voltage Range (Max)	8 V	8 V	Identical
Operating Temperature	-40°C to 85°C	-40°C to 85°C	Identical
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	Identical
REACH Status	REACH Unaffected	REACH Unaffected	Identical
Mounting Type	Through Hole	Surface Mount	Different
Package Type	8-DIP (0.300", 7.62mm)	8-SOIC (0.154", 3.90mm)	Different
Product Status	Last Time Buy	Active	Different

Engineering Selection Recommendations

TLV2322IDR as Primary Substitute:

The TLV2322IDR is the manufacturer-recommended substitute for the TLV2322IP. Both components share identical electrical specifications, including amplifier type, circuit count, slew rate, gain bandwidth product, bias current, offset voltage, supply current, output current capability, and operating temperature range. Both maintain RoHS3 compliance and REACH unaffected status.

The primary distinction between these components is packaging format and mounting technology. The TLV2322IP utilizes through-hole DIP packaging suitable for breadboard prototyping and legacy PCB designs. The TLV2322IDR employs surface-mount SOIC packaging, which is standard in modern manufacturing environments and provides superior board density and automated assembly compatibility.

The TLV2322IDR carries Active product status, ensuring ongoing availability and manufacturing support from Texas Instruments. This status provides supply chain continuity for new designs and production requirements where the TLV2322IP Last Time Buy status presents procurement constraints.

Selection Criteria:

For new designs and production: Select TLV2322IDR to leverage active product status and surface-mount manufacturing advantages.
For through-hole PCB designs: The TLV2322IP remains functional until inventory depletion; transition planning to TLV2322IDR with PCB redesign is recommended.
For existing applications: Electrical equivalence permits direct functional substitution; mechanical integration requires PCB layout modification to accommodate SOIC footprint.

Frequently Asked Questions (FAQ)

Q: Are the TLV2322IP and TLV2322IDR electrically interchangeable?

A: Yes. Both components are manufactured by Texas Instruments using identical die technology and share all electrical specifications including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, and operating temperature range. Electrical performance is identical across all specified parameters.

Q: What is the primary difference between these two parts?

A: The TLV2322IP uses through-hole DIP packaging (8-DIP, 0.300" width), while the TLV2322IDR uses surface-mount SOIC packaging (8-SOIC, 0.154" width). This packaging difference affects PCB layout, assembly process, and board density but does not impact electrical function.

Q: Can I use TLV2322IDR as a direct replacement on a PCB designed for TLV2322IP?

A: No. The different package types (DIP versus SOIC) require different PCB footprints and mounting techniques. Through-hole DIP components use vertical pin insertion, while SOIC components mount flat on the PCB surface. PCB redesign is necessary to accommodate the TLV2322IDR footprint.

Q: Why is the TLV2322IP marked as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments has discontinued active production of this component. The TLV2322IDR, which shares identical electrical specifications, is the active product recommended for new designs and ongoing production requirements.

Q: Are there any compliance differences between these parts?

A: No. Both the TLV2322IP and TLV2322IDR maintain RoHS3 compliance and REACH unaffected status. Regulatory and environmental compliance requirements are identical.

Q: What is the moisture sensitivity level for each part?

A: The TLV2322IP has moisture sensitivity level not applicable. The TLV2322IDR has moisture sensitivity level 1 (unlimited), which represents the lowest moisture sensitivity classification and requires no special handling precautions during storage or assembly.

Q: Can I use TLV2322IDR in high-temperature applications?

A: Yes. The TLV2322IDR maintains the same operating temperature range as the TLV2322IP: -40°C to 85°C. Both components are rated for identical thermal performance across this range.

Q: What supply voltage range do these components support?

A: Both the TLV2322IP and TLV2322IDR operate across a supply voltage range of 2V minimum to 8V maximum. This wide range accommodates battery-powered applications and low-voltage signal processing circuits.

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