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TLV2302ID Equivalent & Substitute Parts
Part Overview
The TLV2302ID is a dual-channel amplifier and comparator integrated circuit manufactured by Texas Instruments in 8-SOIC surface mount packaging. This device is classified as Last Time Buy, indicating discontinued production with limited remaining inventory of 889 pieces. The TLV2302ID serves applications requiring general-purpose comparison and amplification functions in compact form factors. Identifying equivalent and substitute parts is essential for design continuity, long-term supply chain planning, and alternative sourcing when original inventory becomes unavailable.
Substiute Parts
Key Parameters
| Parameter | TLV2302ID |
|---|---|
| Manufacturer | Texas Instruments |
| Part Number | TLV2302ID |
| Category | Linear, Amplifiers |
| Type | Amplifier, Comparator |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) |
| Mounting Type | Surface Mount |
| Packaging Format | Tube |
| Product Status | Last Time Buy |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
Substitute Part Grouping Explanation
Substitution eligibility for the TLV2302ID is determined by strict alignment of the following parameters:
Primary Substitution Criteria:
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Device Type: Comparator or Amplifier/Comparator
- Number of Elements: 2 channels
- RoHS Compliance: ROHS3 Compliant
- Moisture Sensitivity Level: 1 (Unlimited)
Substitute Parts Identified:
All five substitute parts meet the primary substitution criteria and are organized by manufacturer:
Advanced Linear Devices Inc. (ALD Series):
- ALD2303ASAL
- ALD2303SAL
Analog Devices Inc./Maxim Integrated (MAX Series):
- MAX990ESA+
- MAX990ESA+T
- MAX992ESA+
- MAX992ESA+T
These parts share identical physical packaging, surface mount compatibility, and regulatory compliance status with the TLV2302ID, enabling direct form-fit-function replacement in 8-SOIC applications.
Parameter Comparison
| Parameter | TLV2302ID | ALD2303ASAL | ALD2303SAL | MAX990ESA+ | MAX990ESA+T | MAX992ESA+ | MAX992ESA+T |
|---|---|---|---|---|---|---|---|
| Manufacturer | Texas Instruments | Advanced Linear Devices Inc. | Advanced Linear Devices Inc. | Analog Devices Inc./Maxim Integrated | Analog Devices Inc./Maxim Integrated | Analog Devices Inc./Maxim Integrated | Analog Devices Inc./Maxim Integrated |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC (0.154", 3.90mm Width) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Type | Amplifier, Comparator | General Purpose Comparator | General Purpose Comparator | General Purpose Comparator | General Purpose Comparator | General Purpose Comparator | General Purpose Comparator |
| Number of Elements | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Output Type | Not specified | CMOS, NMOS, Open-Drain, TTL | CMOS, NMOS, Open-Drain, TTL | CMOS, Open-Drain, Rail-to-Rail, TTL | CMOS, Open-Drain, Rail-to-Rail, TTL | CMOS, Open-Drain, Rail-to-Rail, TTL | CMOS, Open-Drain, Rail-to-Rail, TTL |
| Packaging Format | Tube | Tube | Tube | Tube | Tape & Reel (TR) | Tube | Tape & Reel (TR) |
| Product Status | Last Time Buy | Active | Active | Active | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| REACH Status | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected |
| ECCN | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Engineering Selection Recommendations
Product Status Considerations:
The TLV2302ID carries Last Time Buy status, indicating end-of-life production. All identified substitute parts maintain Active product status with established supply chains and ongoing manufacturing support. Selection of substitute parts ensures long-term design viability and eliminates obsolescence risk.
Compliance and Regulatory Alignment:
All substitute parts achieve ROHS3 compliance and REACH Unaffected status, matching the TLV2302ID regulatory profile. This alignment ensures compatibility with environmental and hazardous substance directives applicable to the original component. Moisture Sensitivity Level 1 (Unlimited) is maintained across all alternatives, eliminating special handling requirements during assembly and storage.
Packaging and Manufacturing Compatibility:
The 8-SOIC package format and surface mount mounting type are consistent across all substitute options. This uniformity enables direct PCB layout compatibility without redesign. Tube packaging is available for ALD2303ASAL, ALD2303SAL, MAX990ESA+, and MAX992ESA+. Tape & Reel packaging is available for MAX990ESA+T and MAX992ESA+T, supporting both manual assembly and automated pick-and-place operations.
Supply Chain Availability:
Current inventory levels for substitute parts range from 947 to 3900 pieces, providing robust sourcing alternatives compared to the limited 889-piece inventory of the TLV2302ID. The MAX990ESA+T variant offers the highest inventory position at 3900 pieces in Tape & Reel format.
Frequently Asked Questions (FAQ)
Q: Can the ALD2303ASAL and ALD2303SAL be used interchangeably with the TLV2302ID?
A: Both ALD2303ASAL and ALD2303SAL meet the primary substitution criteria of 8-SOIC packaging, surface mount compatibility, and regulatory compliance. They are functionally equivalent for applications requiring dual-channel comparator operation. The devices differ in quiescent current specifications (40µA for ALD2303ASAL versus 100µA for ALD2303SAL) and input offset voltage (1mV versus 4mV at 5V), which may influence selection based on application power budget and precision requirements.
Q: What is the difference between MAX990ESA+ and MAX992ESA+ variants?
A: Both MAX990 and MAX992 series devices are manufactured by Analog Devices Inc./Maxim Integrated and share identical 8-SOIC packaging and surface mount compatibility. The MAX992 series features faster propagation delay (210ns maximum versus 450ns for MAX990) and lower hysteresis (±2.5mV versus ±3mV). Selection between these variants depends on application timing requirements and noise immunity specifications.
Q: Does packaging format (Tube versus Tape & Reel) affect electrical performance?
A: Packaging format does not affect electrical performance or functional characteristics. Tube packaging (standard format) is suitable for manual assembly and lower-volume applications. Tape & Reel format (TR designation) is optimized for automated pick-and-place assembly in high-volume manufacturing. The MAX990ESA+T and MAX992ESA+T variants provide identical electrical specifications to their Tube-packaged counterparts.
Q: Are all substitute parts ROHS3 compliant?
A: All identified substitute parts maintain ROHS3 compliance status, matching the TLV2302ID regulatory requirement. This ensures compatibility with environmental directives and eliminates the need for separate compliance verification during design transition.
Q: What supply chain advantages do the substitute parts offer?
A: The TLV2302ID is classified as Last Time Buy with 889 pieces available. Substitute parts maintain Active product status with significantly higher inventory levels: ALD2303ASAL (947 pieces), ALD2303SAL (1078 pieces), MAX990ESA+ (1053 pieces), MAX990ESA+T (3900 pieces), MAX992ESA+ (2160 pieces), and MAX992ESA+T (2180 pieces). This inventory depth provides extended design lifecycle support and reduces obsolescence risk.
Q: Can the TLV2302ID be replaced in existing designs without PCB modification?
A: Yes. All substitute parts utilize the identical 8-SOIC (0.154", 3.90mm Width) package and surface mount mounting type. Direct pin-compatible replacement is possible without PCB layout changes. However, application-specific electrical parameter differences should be evaluated before implementation.
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