TLV2264IN Equivalent & Substitute Parts

Part Overview

The TLV2264IN is a CMOS operational amplifier featuring four independent circuits in a 14-pin DIP package. This device is classified as Last Time Buy, indicating discontinued production with limited inventory availability. The TLV2264IN operates as a rail-to-rail output amplifier suitable for low-power applications requiring dual or quad-channel amplification in through-hole mounting configurations. Due to its Last Time Buy status, identifying functionally equivalent substitute parts with active production status is essential for design continuity and long-term supply chain reliability.

Substiute Parts

TLV2264IN

Texas InstrumentsIn Stock: 1930TLV2264IN Datasheet

Current PartRFQ

TLV2264IDR

Texas InstrumentsIn Stock: 888929TLV2264IDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2264IN is determined by electrical and mechanical parameter equivalence within the TLV2264 product family. The primary substitution criterion is the base product number TLV2264, which ensures identical electrical characteristics across all variants. The key parameters that define substitutability are:

• Amplifier Type: CMOS architecture
• Number of Circuits: 4 independent channels
• Output Type: Rail-to-Rail configuration
• Electrical Specifications: Slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, and output current per channel
• Supply Voltage Range: 2.7 V to 8 V
• Operating Temperature Range: -40°C to 125°C

The TLV2264IDR is a direct functional equivalent of the TLV2264IN, sharing identical electrical performance specifications. The distinction between these parts lies exclusively in packaging format and mounting technology: the TLV2264IN uses through-hole 14-DIP packaging, while the TLV2264IDR uses surface-mount 14-SOIC packaging. Both parts are manufactured by Texas Instruments under the LinCMOS™ series and comply with identical regulatory standards (ROHS3, REACH Unaffected, EAR99).

Parameter Comparison

Engineering Selection Recommendations

The TLV2264IDR is the recommended substitute for the TLV2264IN based on the following engineering criteria:

Electrical Equivalence: All electrical specifications are identical between the two parts. The TLV2264IDR maintains the same CMOS amplifier architecture, four-channel configuration, rail-to-rail output capability, slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current capability, and supply voltage range.

Regulatory Compliance: Both parts carry identical compliance certifications: ROHS3 Compliant, REACH Unaffected, and EAR99 classification. No additional compliance verification is required for substitution.

Product Status: The TLV2264IDR holds Active product status with significantly higher inventory availability (888,900 pieces) compared to the TLV2264IN (1,900 pieces, Last Time Buy). This ensures long-term supply chain continuity and eliminates obsolescence risk.

Packaging Consideration: The primary difference between these parts is packaging format. The TLV2264IN uses through-hole 14-DIP mounting, while the TLV2264IDR uses surface-mount 14-SOIC packaging. Selection between these variants depends on the printed circuit board design and assembly process capability. Through-hole designs require the TLV2264IN or equivalent DIP-packaged alternatives. Surface-mount designs should transition to the TLV2264IDR to leverage active production status and improved supply availability.

Frequently Asked Questions (FAQ)

Q: Are the TLV2264IN and TLV2264IDR electrically identical?

A: Yes. Both parts share the base product number TLV2264 and possess identical electrical specifications, including slew rate (0.55 V/µs), gain bandwidth product (710 kHz), input bias current (50 pA), input offset voltage (300 µV), supply current (1.5 mA for four channels), output current per channel (50 mA), and supply voltage range (2.7 V to 8 V). Operating temperature range is identical at -40°C to 125°C.

Q: What is the primary difference between TLV2264IN and TLV2264IDR?

A: The primary difference is packaging and mounting technology. The TLV2264IN uses through-hole 14-DIP packaging (0.300", 7.62mm pitch), while the TLV2264IDR uses surface-mount 14-SOIC packaging (0.154", 3.90mm width). Pin count and electrical function remain identical.

Q: Why is the TLV2264IN classified as Last Time Buy?

A: The TLV2264IN has been discontinued by Texas Instruments. Last Time Buy status indicates that existing inventory is available for purchase, but no future production is planned. The TLV2264IDR, with Active product status, represents the current production alternative.

Q: Can I use the TLV2264IDR as a direct replacement for the TLV2264IN in my existing design?

A: Electrical substitution is direct and complete. However, physical substitution requires PCB redesign to accommodate surface-mount 14-SOIC packaging instead of through-hole 14-DIP. If your design uses through-hole mounting, the TLV2264IN must remain in use until PCB redesign is feasible. For new designs, the TLV2264IDR is the recommended choice.

Q: Are there any compliance or regulatory differences between these parts?

A: No. Both parts carry identical compliance certifications: ROHS3 Compliant, REACH Unaffected, and EAR99 classification. HTSUS code is identical (8542.33.0001). No additional compliance documentation or verification is required for substitution.

Q: What is the inventory status of each part?

A: The TLV2264IN has 1,900 pieces available (Last Time Buy status). The TLV2264IDR has 888,900 pieces available (Active product status). For long-term supply chain planning, the TLV2264IDR offers significantly greater availability and production continuity.

Q: Do these parts require different PCB layout or design considerations?

A: Yes. The TLV2264IN requires through-hole mounting with 0.300" (7.62mm) DIP spacing. The TLV2264IDR requires surface-mount soldering with 14-SOIC footprint (0.154", 3.90mm width). PCB layout, via placement, and assembly process differ between these packaging formats. Electrical circuit design remains unchanged.