TLV2264AMJB Equivalent & Substitute Parts

Part Overview

The TLV2264AMJB is a CMOS operational amplifier manufactured by Texas Instruments, featuring four independent circuits with rail-to-rail output capability and low power consumption. This device is classified as a Last Time Buy component, indicating that the original manufacturer has discontinued or will discontinue production. The TLV2264AMJB is packaged in a 14-CDIP through-hole configuration and is qualified to automotive standards (AEC-Q100), making it suitable for automotive and industrial applications requiring low-voltage operation.

Due to its Last Time Buy status, identifying equivalent substitute parts is essential for design continuity and long-term supply chain management. Substitute parts must maintain electrical compatibility while potentially offering alternative packaging options or extended product lifecycle status.

Substiute Parts

TLV2264AMJB

Texas InstrumentsIn Stock: 722TLV2264AMJB Datasheet

Current PartRFQ

TLV2264AIDR

Texas InstrumentsIn Stock: 1982TLV2264AIDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2264AMJB is determined by strict equivalence of core electrical parameters that define operational compatibility. The following parameters establish the substitution criteria:

Electrical Equivalence Parameters:

• Amplifier Type: CMOS
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 0.55 V/µs
• Gain Bandwidth Product: 710 kHz
• Current - Input Bias: 1 pA
• Voltage - Input Offset: 300 µV
• Current - Supply: 800 µA (x4 Channels)
• Current - Output / Channel: 50 mA
• Voltage - Supply Span: 2.7 V to 8 V

Mechanical and Compliance Parameters:

• Series: LinCMOS™
• RoHS Status: ROHS3 Compliant
• ECCN: EAR99
• HTSUS: 8542.33.0001

The TLV2264AIDR qualifies as a direct electrical substitute, maintaining all core electrical specifications while differing in mounting technology (Surface Mount vs. Through Hole) and operating temperature range. This substitution is valid for applications where the package form factor change is acceptable.

Parameter Comparison

Engineering Selection Recommendations

Electrical Compatibility: The TLV2264AIDR maintains complete electrical equivalence with the TLV2264AMJB across all specified operational parameters. Both devices operate within the 2.7 V to 8 V supply range, deliver identical slew rate and bandwidth characteristics, and exhibit matching input bias current and offset voltage specifications.

Product Lifecycle Considerations: The TLV2264AMJB carries Last Time Buy status, indicating production discontinuation. The TLV2264AIDR is designated as Active, ensuring continued availability and long-term supply chain viability. Selection of the TLV2264AIDR is appropriate for new designs or production runs requiring extended component availability.

Operating Temperature Range: The TLV2264AMJB operates from -55°C to 125°C, while the TLV2264AIDR operates from -40°C to 125°C. Applications requiring operation below -40°C must retain the TLV2264AMJB or identify alternative solutions. Applications within the -40°C to 125°C range are compatible with the substitute.

Automotive and Compliance Status: The TLV2264AMJB is explicitly qualified to AEC-Q100 automotive standards with Automotive grade designation. The TLV2264AIDR does not specify automotive qualification in the provided data. Applications requiring automotive qualification must verify compliance documentation or retain the TLV2264AMJB.

Packaging and Board Integration: The primary difference between these devices is packaging technology. The TLV2264AMJB uses through-hole 14-CDIP packaging, while the TLV2264AIDR uses surface-mount 14-SOIC packaging. PCB redesign is required to accommodate the TLV2264AIDR. Through-hole designs must retain the TLV2264AMJB or implement board-level modifications.

Compliance and Environmental: Both devices are ROHS3 compliant and share identical ECCN and HTSUS classifications, ensuring regulatory equivalence for export and environmental compliance purposes.

Frequently Asked Questions (FAQ)

Q: Can the TLV2264AIDR directly replace the TLV2264AMJB in an existing PCB design?

A: Direct PCB replacement is not possible without board redesign. The TLV2264AMJB uses through-hole 14-CDIP packaging, while the TLV2264AIDR uses surface-mount 14-SOIC packaging. The physical footprints are incompatible. PCB layout modification is required to accommodate the TLV2264AIDR.

Q: Are the electrical specifications identical between these two parts?

A: Yes. The TLV2264AIDR maintains electrical equivalence with the TLV2264AMJB for all specified parameters: slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, and supply voltage range are identical.

Q: What is the significance of the Last Time Buy status on the TLV2264AMJB?

A: Last Time Buy status indicates that Texas Instruments has discontinued or will discontinue production of the TLV2264AMJB. Existing inventory will be depleted, and the part will no longer be available for new orders after the Last Time Buy date. The TLV2264AIDR, with Active status, provides continued availability for future production requirements.

Q: Does the operating temperature range difference affect substitution suitability?

A: The TLV2264AMJB operates from -55°C to 125°C, while the TLV2264AIDR operates from -40°C to 125°C. For applications requiring operation below -40°C, the TLV2264AIDR is not suitable. For applications within the -40°C to 125°C range, the narrower temperature range of the substitute does not present a limitation.

Q: Is the TLV2264AIDR suitable for automotive applications?

A: The provided data does not specify automotive qualification or AEC-Q100 certification for the TLV2264AIDR. The TLV2264AMJB is explicitly qualified to AEC-Q100 standards. Applications requiring automotive qualification must verify compliance documentation for the TLV2264AIDR or retain the TLV2264AMJB.

Q: What is the difference between 14-CDIP and 14-SOIC packaging?

A: 14-CDIP (Ceramic Dual In-line Package) is a through-hole package with 0.300" width and 7.62mm pitch, suitable for breadboarding and through-hole PCB assembly. 14-SOIC (Small Outline Integrated Circuit) is a surface-mount package with 0.154" width and 3.90mm pitch, suitable for automated surface-mount assembly and compact PCB designs. These packages require different PCB footprints and assembly processes.

Q: Are both parts RoHS compliant?

A: Yes. Both the TLV2264AMJB and TLV2264AIDR are ROHS3 compliant, meeting environmental and regulatory requirements for lead-free manufacturing and hazardous substance restrictions.

Q: What inventory status should influence my selection decision?

A: The TLV2264AMJB has 668 pieces in stock with Last Time Buy status, indicating limited future availability. The TLV2264AIDR has 1890 pieces in stock with Active product status, indicating ongoing availability. For long-term production requirements, the TLV2264AIDR provides superior supply chain security.