TLV2241IP Equivalent & Substitute Parts

Part Overview

The TLV2241IP is a general-purpose operational amplifier manufactured by Texas Instruments, featuring rail-to-rail output capability in an 8-DIP through-hole package. This device is classified as Last Time Buy, indicating discontinued production with limited remaining inventory. The TLV2241IP serves applications requiring low-power, single-circuit amplification across supply voltages from 2.5V to 12V with operating temperatures spanning -40°C to 85°C.

Identification of equivalent and substitute parts is necessary due to the Last Time Buy status of the TLV2241IP. Alternative components with identical electrical specifications and compatible packaging options ensure design continuity and long-term supply chain reliability.

Substiute Parts

TLV2241IP
Texas InstrumentsIn Stock: 1054TLV2241IP Datasheet
TLV2241IP
Current Part
TLV2241IDR
Texas InstrumentsIn Stock: 3480TLV2241IDR Datasheet
TLV2241IDR
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type General Purpose
Number of Circuits 1
Output Type Rail-to-Rail
Slew Rate 0.002 V/µs
Gain Bandwidth Product 5.5 kHz
Current - Input Bias 100 pA
Voltage - Input Offset 600 µV
Current - Supply 1 µA
Current - Output / Channel 200 µA
Voltage - Supply Span (Min) 2.5 V
Voltage - Supply Span (Max) 12 V
Operating Temperature Range -40 to 85 °C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)

Substitute Part Grouping Explanation

Substitution of the TLV2241IP is determined by electrical parameter equivalence and mechanical compatibility. The primary substitute identified is the TLV2241IDR, which maintains identical electrical specifications across all critical parameters: slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, and supply voltage range.

The key differentiator between the TLV2241IP and TLV2241IDR is packaging format and mounting technology:

  • TLV2241IP: Through-hole mounting, 8-DIP package, tube packaging
  • TLV2241IDR: Surface-mount technology, 8-SOIC package, tape & reel packaging

Both devices share the identical base product number (TLV2241) and maintain full electrical parameter compatibility. The TLV2241IDR is classified as Active product status, ensuring continued availability and supply chain support.

Parameter Comparison

Parameter TLV2241IP TLV2241IDR Unit
Manufacturer Texas Instruments Texas Instruments
Amplifier Type General Purpose General Purpose
Number of Circuits 1 1
Output Type Rail-to-Rail Rail-to-Rail
Slew Rate 0.002 0.002 V/µs
Gain Bandwidth Product 5.5 5.5 kHz
Current - Input Bias 100 100 pA
Voltage - Input Offset 600 600 µV
Current - Supply 1 1 µA
Current - Output / Channel 200 200 µA
Voltage - Supply Span (Min) 2.5 2.5 V
Voltage - Supply Span (Max) 12 12 V
Operating Temperature Range -40 to 85 -40 to 85 °C
Product Status Last Time Buy Active
Mounting Type Through Hole Surface Mount
Package / Case 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width)
RoHS Status ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

The TLV2241IDR is the direct electrical equivalent of the TLV2241IP and serves as the primary substitute component. Selection between these two parts is determined by circuit board design requirements and manufacturing process:

TLV2241IP Selection Criteria:

  • Through-hole assembly processes
  • Existing PCB designs with DIP footprints
  • Manual insertion or wave soldering manufacturing
  • Last Time Buy status requires immediate procurement for legacy designs

TLV2241IDR Selection Criteria:

  • Surface-mount assembly processes
  • New PCB designs or redesigns
  • Reflow soldering manufacturing
  • Active product status ensures long-term availability
  • Higher inventory availability (3400 pcs vs. 990 pcs)

Both components maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements for industrial and commercial applications. The electrical performance is identical across all specified parameters, ensuring functional interchangeability within the constraints of physical package compatibility.

Frequently Asked Questions (FAQ)

Q: Can TLV2241IDR replace TLV2241IP in existing designs?

A: Electrical replacement is complete. Physical replacement requires PCB redesign from 8-DIP through-hole footprint to 8-SOIC surface-mount footprint. Manufacturing process must transition from through-hole to surface-mount assembly.

Q: What are the package dimension differences?

A: TLV2241IP uses 8-DIP with 0.300" (7.62mm) body width. TLV2241IDR uses 8-SOIC with 0.154" (3.90mm) body width. These packages are not pin-compatible without PCB redesign.

Q: Are electrical specifications identical between TLV2241IP and TLV2241IDR?

A: Yes. All electrical parameters are identical: slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, and supply voltage range (-40°C to 85°C operating temperature).

Q: Why is TLV2241IP classified as Last Time Buy?

A: Last Time Buy status indicates Texas Instruments has discontinued production. Remaining inventory is limited to 990 pcs. The TLV2241IDR (Active status) is the recommended long-term alternative.

Q: What is the moisture sensitivity level difference?

A: TLV2241IP lists MSL as Not Applicable. TLV2241IDR specifies MSL 1 (Unlimited), indicating the surface-mount package has standard moisture handling requirements.

Q: Are both parts RoHS and REACH compliant?

A: Yes. Both TLV2241IP and TLV2241IDR are ROHS3 compliant and REACH unaffected, meeting environmental and regulatory standards.

Q: Which part should be selected for new designs?

A: TLV2241IDR is recommended for new designs due to Active product status, higher inventory availability, and surface-mount compatibility with modern manufacturing processes.

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