TLP781F(GR-LF7,F) Equivalent & Substitute Parts

Part Overview

The TLP781F(GR-LF7,F) is a single-channel optoisolator with transistor output manufactured by Toshiba Semiconductor and Storage. This component provides 5000Vrms isolation and is designed for DC input applications requiring galvanic isolation in surface mount configurations. The part is currently classified as obsolete, making identification of functionally equivalent alternatives necessary for ongoing design support and production continuity.

Substiute Parts

TLP781F(GR-LF7,F)

Toshiba Semiconductor and StorageIn Stock: 930TLP781F(GR-LF7,F) Datasheet

Current PartRFQ

TLP785F(GR-LF7,F

Toshiba Semiconductor and StorageIn Stock: 1143TLP785F(GR-LF7,F Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TLP781F(GR-LF7,F) is determined by the following critical parameters:

• Isolation Voltage: 5000Vrms (must match exactly)
• Number of Channels: 1 (single channel requirement)
• Output Type: Transistor output configuration
• Input Type: DC input
• Current Transfer Ratio Range: Minimum 100% @ 5mA
• Maximum Output Voltage: 80V
• Maximum Output Current: 50mA per channel
• Operating Temperature Range: -55°C ~ 110°C
• Vce Saturation: 400mV maximum

The TLP785F(GR-LF7,F) meets all critical electrical parameters for substitution. The primary difference is the package format: TLP785F uses through-hole 4-DIP packaging instead of surface mount 4-SMD. This distinction affects board layout and assembly process but does not alter electrical performance or isolation characteristics.

Parameter Comparison

Engineering Selection Recommendations

The TLP785F(GR-LF7,F) is the direct functional equivalent for the obsolete TLP781F(GR-LF7,F). Both components share identical electrical specifications for isolation voltage, output current capability, switching characteristics, and operating temperature range. The TLP785F maintains active product status with Toshiba, ensuring continued availability and supply chain reliability.

Selection between these parts depends on board design requirements:

• Surface Mount Requirement: TLP781F (4-SMD package) is necessary for high-density surface mount assemblies
• Through-Hole Requirement: TLP785F (4-DIP package) is suitable for through-hole designs or mixed-technology boards
• Supply Continuity: TLP785F is preferred due to active product status

Both parts carry identical export classification (EAR99) and tariff codes, with no compliance restrictions affecting substitution.

Frequently Asked Questions (FAQ)

Q: Can TLP785F replace TLP781F in all applications?

A: Electrical substitution is complete. The TLP785F meets all electrical parameters of the TLP781F. Package format differs: TLP785F uses through-hole 4-DIP versus TLP781F surface mount 4-SMD. Board layout and assembly process must accommodate the package change.

Q: What is the difference in Current Transfer Ratio between these parts?

A: TLP781F maximum CTR is 300% @ 5mA; TLP785F maximum CTR is 200% @ 5mA. Both exceed the 100% minimum specification. Applications requiring the upper CTR range of TLP781F should verify TLP785F performance within circuit design margins.

Q: Why is TLP781F obsolete while TLP785F remains active?

A: Product status reflects manufacturer production decisions. TLP785F through-hole packaging maintains market demand, while TLP781F surface mount variant has been discontinued. Both are functionally equivalent Toshiba optoisolator designs.

Q: Are there any compliance or certification differences?

A: Both parts carry identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications. No compliance restrictions affect substitution between these components.

Q: What are the switching time characteristics?

A: Both parts specify identical turn-on/turn-off times of 3µs typical and rise/fall times of 2µs/3µs typical. Switching performance is equivalent.