TLP781F(D4-Y-LF7,F Equivalent & Substitute Parts

Part Overview

The TLP781F(D4-Y-LF7,F is a single-channel optoisolator with transistor output manufactured by Toshiba Semiconductor and Storage. This component provides 5000Vrms isolation and is designed for DC input applications requiring galvanic isolation in industrial and consumer electronics. The part is classified as obsolete, making identification of equivalent and substitute components essential for ongoing design support and production continuity.

Substiute Parts

TLP781F(D4-Y-LF7,F

Toshiba Semiconductor and StorageIn Stock: 805TLP781F(D4-Y-LF7,F Datasheet

Current PartRFQ

TLP785F(D4Y-F7,F

Toshiba Semiconductor and StorageIn Stock: 915TLP785F(D4Y-F7,F Datasheet

DirectRFQ

TLP785F(Y-LF7,F

Toshiba Semiconductor and StorageIn Stock: 821TLP785F(Y-LF7,F Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the TLP781F(D4-Y-LF7,F are identified based on strict electrical and mechanical parameter matching. The primary substitution criteria are:

Electrical Parameters (Must Match):

• Single-channel configuration
• 5000Vrms isolation voltage
• Current Transfer Ratio range: 50% to 150% @ 5mA
• Transistor output type
• DC input type
• Maximum output voltage: 80V
• Maximum output current: 50mA per channel
• Timing characteristics: 3µs turn-on/off, 2µs/3µs rise/fall times
• Operating temperature range: -55°C to 110°C

Mechanical Parameters (Allowed Variations):

• Mounting type may vary (Surface Mount or Through Hole)
• Package configuration may differ (4-SMD or 4-DIP)

Substitutes are grouped into two categories: direct manufacturer equivalents with different packaging, and parametric equivalents with identical electrical specifications but alternative mounting solutions.

Parameter Comparison

Engineering Selection Recommendations

TLP785F(D4Y-F7,F (Direct Manufacturer Equivalent): This substitute is an active product from Toshiba with identical electrical specifications to the obsolete TLP781F(D4-Y-LF7,F. The primary difference is the package configuration: 4-DIP through-hole mounting versus 4-SMD surface mount. Selection of this part is appropriate for applications where through-hole assembly is preferred or where PCB redesign to accommodate through-hole components is feasible. Both parts carry identical MSL rating and compliance certifications.

TLP785F(Y-LF7,F (Parametric Equivalent): This substitute maintains the same surface-mount package format (4-SMD, Gull Wing) as the original TLP781F(D4-Y-LF7,F while offering active product status from Toshiba. All electrical parameters are identical, including isolation voltage, current transfer ratio, timing characteristics, and operating temperature range. This part provides direct form-factor compatibility with existing PCB designs without requiring layout modifications.

Selection between the two substitutes depends on assembly methodology and PCB design constraints. Both are manufactured by Toshiba and carry equivalent compliance and reliability ratings.

Frequently Asked Questions (FAQ)

Q: Can TLP785F parts directly replace the obsolete TLP781F(D4-Y-LF7,F? A: Yes. Both TLP785F variants (D4Y-F7,F and Y-LF7,F) are electrically equivalent to the TLP781F(D4-Y-LF7,F. All critical parameters including isolation voltage, current transfer ratio, timing characteristics, and operating temperature range are identical. The difference lies in package type and mounting method.

Q: What is the difference between the two TLP785F substitutes? A: TLP785F(D4Y-F7,F uses 4-DIP through-hole packaging, while TLP785F(Y-LF7,F uses 4-SMD surface-mount packaging. The TLP785F(Y-LF7,F maintains the same surface-mount form factor as the original TLP781F(D4-Y-LF7,F, requiring no PCB redesign.

Q: Are there any electrical performance differences between these parts? A: No. All three parts share identical electrical specifications: 5000Vrms isolation, 50-150% current transfer ratio at 5mA, 3µs switching times, and 80V maximum output voltage. Substitution is based on complete electrical equivalence.

Q: What are the packaging implications for PCB design? A: The original TLP781F(D4-Y-LF7,F and substitute TLP785F(Y-LF7,F both use 4-SMD gull-wing packages and are footprint-compatible. The TLP785F(D4Y-F7,F requires a through-hole footprint and necessitates PCB layout modification.

Q: Are all three parts available from the same manufacturer? A: Yes. All parts are manufactured by Toshiba Semiconductor and Storage. The TLP785F variants are active products, while the TLP781F(D4-Y-LF7,F is obsolete.

Q: What is the moisture sensitivity level for these parts? A: All three parts carry MSL rating 1 (Unlimited), indicating no moisture sensitivity restrictions during storage or handling.