TLP781(D4GRL-LF6,F Optoisolator Equivalent & Substitute Parts

Part Overview

The TLP781(D4GRL-LF6,F is a photocoupler optoisolator manufactured by Toshiba Semiconductor and Storage, designed for high-voltage isolation applications. This component features transistor output configuration with 5000Vrms isolation voltage rating and single-channel operation in a 4-SMD surface mount package. The part is currently classified as obsolete, making identification of functionally equivalent alternatives necessary for ongoing system support and new design implementations where this isolation topology is required.

Substiute Parts

TLP781(D4GRL-LF6,F

Toshiba Semiconductor and StorageIn Stock: 863TLP781(D4GRL-LF6,F Datasheet

Current PartRFQ

TLP785(D4GL-F6,F

Toshiba Semiconductor and StorageIn Stock: 1174TLP785(D4GL-F6,F Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLP781(D4GRL-LF6,F is determined by the following critical parameters that must remain consistent across alternative components:

Mandatory Matching Parameters:

• Voltage - Isolation: 5000Vrms
• Number of Channels: 1
• Output Type: Transistor
• Voltage - Output (Max): 80V
• Current - Output / Channel: 50mA
• Operating Temperature Range: -55°C ~ 110°C
• Input Type: DC

Allowable Variation Parameters:

• Current Transfer Ratio: Substitute must fall within acceptable range for the application
• Turn On / Turn Off Time: Timing characteristics may vary within application requirements
• Rise / Fall Time: Edge rate characteristics may differ
• Mounting Type: May differ (surface mount vs. through hole) based on PCB design capability
• Package / Case: Alternative packages acceptable if electrical specifications align

The TLP785(D4GL-F6,F meets the mandatory matching criteria while offering active product status and improved current transfer ratio range, making it a valid substitute despite packaging differences.

Parameter Comparison

Engineering Selection Recommendations

The TLP785(D4GL-F6,F serves as a direct functional substitute for the obsolete TLP781(D4GRL-LF6,F based on electrical parameter equivalence. Both components maintain identical isolation voltage, output voltage rating, output current capacity, and operating temperature range. The TLP785 variant offers the advantage of active product status, ensuring continued availability and manufacturing support.

The primary design consideration is the package transition from 4-SMD surface mount to 4-DIP through-hole configuration. This change requires PCB layout modification but does not affect electrical performance or isolation characteristics. The TLP785 exhibits a wider current transfer ratio range (50% to 600% @ 5mA) compared to the TLP781 (100% to 200% @ 5mA), which may require circuit design review to confirm compatibility with existing input drive and output load conditions.

Both components carry identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications and maintain MSL Level 1 moisture sensitivity rating, ensuring equivalent compliance and handling requirements.

Frequently Asked Questions (FAQ)

Q: Can the TLP785(D4GL-F6,F directly replace the TLP781(D4GRL-LF6,F in existing designs?

A: Electrical substitution is valid. The isolation voltage, output ratings, and operating temperature ranges are identical. However, the package change from 4-SMD to 4-DIP requires PCB redesign. The wider current transfer ratio range of the TLP785 must be evaluated against circuit design margins.

Q: What is the primary difference between these two parts?

A: The TLP781 uses surface mount packaging (4-SMD, Gull Wing) while the TLP785 uses through-hole packaging (4-DIP). The TLP781 is obsolete; the TLP785 is active production. Electrical isolation and output specifications are equivalent.

Q: Does the current transfer ratio difference affect substitution compatibility?

A: The TLP785 current transfer ratio range (50% to 600% @ 5mA) is wider than the TLP781 (100% to 200% @ 5mA). Circuit designs must accommodate this variation. Input drive current and output load impedance should be reviewed to confirm the TLP785 operates within acceptable gain margins.

Q: Are there any compliance or certification differences?

A: Both components carry identical ECCN and HTSUS classifications. Moisture sensitivity levels are equivalent (MSL Level 1). No compliance barriers exist for substitution.

Q: What mounting considerations apply to this substitution?

A: The TLP781 is surface mount; the TLP785 is through-hole. PCB layout and assembly process changes are required. Component lead spacing differs: 4-SMD gull wing versus 4-DIP 0.300" (7.62mm) spacing.