TLP781(D4-BL-LF6,F Equivalent & Substitute Parts

Part Overview

The TLP781(D4-BL-LF6,F is a single-channel optoisolator with transistor output manufactured by Toshiba Semiconductor and Storage. This component provides 5000Vrms isolation and is designed for DC input applications requiring galvanic isolation in surface mount configurations. The part is currently listed as obsolete, necessitating identification of active equivalent alternatives to maintain design continuity and ensure supply chain availability.

Key Parameters

Parameter	Value
Number of Channels	1
Voltage - Isolation	5000Vrms
Current Transfer Ratio (Min)	200% @ 5mA
Current Transfer Ratio (Max)	600% @ 5mA
Turn On / Turn Off Time (Typ)	3µs, 3µs
Rise / Fall Time (Typ)	2µs, 3µs
Input Type	DC
Output Type	Transistor
Voltage - Output (Max)	80V
Current - Output / Channel	50mA
Voltage - Forward (Vf) (Typ)	1.15V
Current - DC Forward (If) (Max)	60mA
Vce Saturation (Max)	400mV
Operating Temperature	-55°C ~ 110°C
Mounting Type	Surface Mount
Package / Case	4-SMD, Gull Wing
Moisture Sensitivity Level (MSL)	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution for the TLP781(D4-BL-LF6,F is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Criteria:

Single channel configuration
5000Vrms isolation voltage
Current transfer ratio range: 200% to 600% @ 5mA
Switching times: 3µs turn-on/off, 2µs/3µs rise/fall
DC input with transistor output
Maximum output voltage: 80V
Maximum output current: 50mA per channel
Forward voltage: 1.15V typical
Maximum forward current: 60mA
Saturation voltage: 400mV maximum
Operating temperature range: -55°C to 110°C

Mechanical Compatibility Considerations:

Package type determines board layout compatibility
Surface mount (4-SMD) packages maintain identical PCB footprints
Through-hole (4-DIP) packages require different board layouts but maintain electrical equivalence

The substitute parts identified below meet all electrical parameters while differing in package configuration and product status.

Parameter Comparison

Parameter	TLP781(D4-BL-LF6,F	TLP785(D4BL-F6,F	TLP785F(D4BLF7,F
Manufacturer	Toshiba	Toshiba	Toshiba
Number of Channels	1	1	1
Voltage - Isolation	5000Vrms	5000Vrms	5000Vrms
Current Transfer Ratio (Min)	200% @ 5mA	200% @ 5mA	200% @ 5mA
Current Transfer Ratio (Max)	600% @ 5mA	600% @ 5mA	600% @ 5mA
Turn On / Turn Off Time (Typ)	3µs, 3µs	3µs, 3µs	3µs, 3µs
Rise / Fall Time (Typ)	2µs, 3µs	2µs, 3µs	2µs, 3µs
Input Type	DC	DC	DC
Output Type	Transistor	Transistor	Transistor
Voltage - Output (Max)	80V	80V	80V
Current - Output / Channel	50mA	50mA	50mA
Voltage - Forward (Vf) (Typ)	1.15V	1.15V	1.15V
Current - DC Forward (If) (Max)	60mA	60mA	60mA
Vce Saturation (Max)	400mV	400mV	400mV
Operating Temperature	-55°C ~ 110°C	-55°C ~ 110°C	-55°C ~ 110°C
Mounting Type	Surface Mount	Through Hole	Surface Mount
Package / Case	4-SMD, Gull Wing	4-DIP (0.300", 7.62mm)	4-SMD, Gull Wing
Product Status	Obsolete	Active	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)

Engineering Selection Recommendations

For Direct Surface Mount Replacement: The TLP785F(D4BLF7,F is the primary substitute for the obsolete TLP781(D4-BL-LF6,F. Both components share identical electrical specifications and surface mount package configuration (4-SMD, Gull Wing), enabling direct PCB footprint compatibility. The TLP785F(D4BLF7,F maintains active product status, ensuring long-term supply chain availability and compliance with current manufacturing standards.

For Through-Hole Applications: The TLP785(D4BL-F6,F provides electrical equivalence with a through-hole package option (4-DIP). This substitute is appropriate for designs utilizing through-hole assembly methods or legacy board layouts. The through-hole configuration requires different PCB layout and assembly processes compared to the original surface mount design.

Product Status Consideration: Both substitute parts maintain active product status with Toshiba Semiconductor and Storage, providing supply chain continuity and access to current manufacturing batches. The obsolete status of the original TLP781(D4-BL-LF6,F necessitates transition to one of these active alternatives.

Frequently Asked Questions (FAQ)

Q: Can TLP785F(D4BLF7,F directly replace TLP781(D4-BL-LF6,F on existing PCBs? A: Yes. Both components use identical 4-SMD, Gull Wing surface mount packages with matching electrical specifications. No circuit modifications are required.

Q: What is the primary difference between TLP785(D4BL-F6,F and TLP785F(D4BLF7,F? A: The TLP785(D4BL-F6,F uses a through-hole 4-DIP package, while TLP785F(D4BLF7,F uses a surface mount 4-SMD package. Electrical performance is identical. Package selection depends on assembly method and board layout requirements.

Q: Why is the original TLP781(D4-BL-LF6,F listed as obsolete? A: Product obsolescence is determined by the manufacturer. Active alternatives with identical electrical specifications are available to maintain design continuity.

Q: Are all three parts electrically interchangeable? A: The TLP785F(D4BLF7,F and TLP781(D4-BL-LF6,F are directly interchangeable for surface mount applications. The TLP785(D4BL-F6,F is electrically equivalent but requires different board layout due to its through-hole package.

Q: What certifications apply to these optoisolators? A: All three parts share identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications with MSL rating of 1 (Unlimited).

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