TLP759(LF2,J,F) Equivalent & Substitute Parts

Part Overview

The TLP759(LF2,J,F) is an optoisolator transistor with base output manufactured by Toshiba Semiconductor and Storage. This component provides galvanic isolation with a 5000Vrms rating in a single-channel configuration using a through-hole 8-DIP package. The device is classified as obsolete, necessitating identification of active alternative components that maintain functional and electrical compatibility for new designs and production continuity.

Substiute Parts

TLP759(LF2,J,F)
Toshiba Semiconductor and StorageIn Stock: 985TLP759(LF2,J,F) Datasheet
TLP759(LF2,J,F)
Current Part
TLP2719(LF4,E
Toshiba Semiconductor and StorageIn Stock: 864TLP2719(LF4,E Datasheet
TLP2719(LF4,E
MFR Recommended

Key Parameters

Parameter Value
Voltage - Isolation 5000Vrms
Number of Channels 1
Current Transfer Ratio (Min) 20% @ 16mA
Output Type Transistor with Base
Voltage - Output (Max) 20V
Current - Output / Channel 8mA
Voltage - Forward (Vf) (Typ) 1.65V
Current - DC Forward (If) (Max) 25mA
Input Type DC
Operating Temperature -55°C ~ 100°C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)

Substitute Part Grouping Explanation

Substitution of the TLP759(LF2,J,F) is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Criteria:

  • Voltage isolation rating: 5000Vrms (mandatory match)
  • Number of channels: 1 (mandatory match)
  • Current transfer ratio minimum: 20% @ 16mA (mandatory match)
  • Output type: Transistor with base (mandatory match)
  • Maximum output voltage: 20V (mandatory match)
  • Output current per channel: 8mA (mandatory match)
  • Input type: DC (mandatory match)

Functional Compatibility: The TLP2719(LF4,E) maintains all critical electrical parameters required for direct functional substitution. Both devices operate within compatible forward voltage and current specifications, with identical isolation voltage ratings and output characteristics.

Package Consideration: The substitute part utilizes surface-mount technology (6-SOIC) rather than through-hole mounting (8-DIP). This represents a packaging transition that requires circuit board redesign and assembly process modification.

Parameter Comparison

Parameter TLP759(LF2,J,F) TLP2719(LF4,E) Match Status
Manufacturer Toshiba Semiconductor and Storage Toshiba Semiconductor and Storage Identical
Category Optoisolators Optoisolators Identical
Number of Channels 1 1 Identical
Voltage - Isolation 5000Vrms 5000Vrms Identical
Current Transfer Ratio (Min) 20% @ 16mA 20% @ 16mA Identical
Current Transfer Ratio (Max) Not specified 55% @ 16mA Substitute provides specification
Input Type DC DC Identical
Output Type Transistor with Base Transistor with Base Identical
Voltage - Output (Max) 20V 20V Identical
Current - Output / Channel 8mA 8mA Identical
Voltage - Forward (Vf) (Typ) 1.65V 1.6V Compatible
Current - DC Forward (If) (Max) 25mA 25mA Identical
Operating Temperature -55°C ~ 100°C -40°C ~ 100°C Substitute range narrower
Mounting Type Through Hole Surface Mount Different
Package / Case 8-DIP (0.300", 7.62mm) 6-SOIC (0.295", 7.50mm Width) Different
Product Status Obsolete Active Substitute is active
ECCN EAR99 EAR99 Identical
HTSUS 8541.49.8000 8541.49.8000 Identical

Engineering Selection Recommendations

Electrical Compatibility: The TLP2719(LF4,E) provides complete electrical equivalence to the TLP759(LF2,J,F) across all specified parameters. Both components maintain 5000Vrms isolation voltage, identical current transfer ratios, and matching output characteristics. The substitute component is manufactured by the same supplier and carries identical export control and tariff classifications.

Product Status Advantage: The TLP2719(LF4,E) holds active product status, ensuring continued availability, manufacturing support, and compliance with current industry standards. The TLP759(LF2,J,F) is classified as obsolete, presenting supply chain risk and potential discontinuation of technical support.

Operating Temperature Consideration: The substitute component operates across -40°C to 100°C, compared to the original part's -55°C to 100°C range. Applications requiring operation below -40°C require evaluation against specific system requirements.

Packaging and Assembly Impact: Substitution requires transition from through-hole 8-DIP mounting to surface-mount 6-SOIC configuration. This necessitates printed circuit board redesign, assembly process modification, and potential equipment qualification changes. The physical footprint reduction from 0.300" to 0.295" width represents a minor dimensional change.

Moisture Sensitivity: The TLP2719(LF4,E) carries MSL Level 1 (Unlimited), indicating no moisture sensitivity restrictions during storage and handling.

Frequently Asked Questions (FAQ)

Q: Can the TLP2719(LF4,E) directly replace the TLP759(LF2,J,F) without circuit modification?

A: Electrical substitution is direct. However, the packaging difference (surface-mount 6-SOIC versus through-hole 8-DIP) requires printed circuit board layout redesign and assembly process changes. Footprint conversion is necessary.

Q: What are the critical parameters that define substitution eligibility?

A: Substitution is determined by matching isolation voltage (5000Vrms), channel count (1), current transfer ratio minimum (20% @ 16mA), output type (transistor with base), maximum output voltage (20V), output current (8mA), and input type (DC). All these parameters are identical between the two components.

Q: Does the TLP2719(LF4,E) operate across the same temperature range?

A: The substitute operates from -40°C to 100°C, while the original operates from -55°C to 100°C. The substitute has a narrower lower temperature limit. Applications requiring operation below -40°C must evaluate this specification against system requirements.

Q: Are there compliance or export control differences?

A: Both components carry identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications. No compliance differences exist between the two parts.

Q: What is the significance of the current transfer ratio maximum specification on the substitute?

A: The TLP2719(LF4,E) specifies a maximum current transfer ratio of 55% @ 16mA, whereas the original part does not provide this specification. This additional specification provides design margin information but does not affect substitution eligibility, as the minimum requirement (20% @ 16mA) is met by both components.

Q: How does the forward voltage difference affect circuit design?

A: The substitute forward voltage is 1.6V typical compared to 1.65V for the original. This 0.05V difference is negligible for most circuit applications and falls within normal component tolerance ranges.

Q: What is the moisture sensitivity level of the substitute component?

A: The TLP2719(LF4,E) carries MSL Level 1 (Unlimited), indicating no moisture sensitivity restrictions. Standard handling and storage practices apply without special moisture control requirements.

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