TLP754(D4-TP1,F) Equivalent & Substitute Parts

Part Overview

The TLP754(D4-TP1,F) is a logic output optoisolator manufactured by Toshiba Semiconductor and Storage, designed for high-speed isolation applications requiring 5000Vrms isolation voltage and 20kV/µs common mode transient immunity. This component features an open collector output with Schottky clamping, operating at 1Mbps data rate across a single channel.

The TLP754(D4-TP1,F) is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications currently utilizing this optoisolator.

Substiute Parts

TLP754(D4-TP1,F)

Toshiba Semiconductor and StorageIn Stock: 834TLP754(D4-TP1,F) Datasheet

Current PartRFQ

TLP2704(D4-TP,E

Toshiba Semiconductor and StorageIn Stock: 2671TLP2704(D4-TP,E Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the TLP754(D4-TP1,F) are identified based on strict electrical and mechanical parameter matching within the optoisolator category. The following parameters establish substitution eligibility:

Critical Matching Parameters:

• Isolation voltage: 5000Vrms
• Common mode transient immunity: 20kV/µs minimum
• Number of channels: 1
• Input type: DC
• Output configuration: Open collector topology
• Supply voltage range: 4.5V ~ 30V
• Operating temperature range: -40°C ~ 125°C
• Output current capability: 15 mA per channel
• Mounting type: Surface mount

The TLP2704(D4-TP,E) qualifies as a substitute based on matching all critical electrical parameters. Differences in package configuration (6-SO versus 8-SMD) and propagation delay timing characteristics do not preclude substitution when physical board layout and timing margins accommodate the alternative package form factor.

Parameter Comparison

Engineering Selection Recommendations

The TLP2704(D4-TP,E) is the manufacturer-recommended substitute for the obsolete TLP754(D4-TP1,F). Both components are manufactured by Toshiba Semiconductor and Storage and share identical electrical specifications for isolation voltage, common mode transient immunity, supply voltage range, operating temperature, and output current capability.

Selection Basis:

The TLP2704(D4-TP,E) maintains active product status, ensuring long-term availability and supply chain continuity. The substitute component is ROHS3 compliant and carries MSL Level 1 (Unlimited) moisture sensitivity rating, meeting modern manufacturing and environmental standards.

Package configuration differs between the main part (8-SMD, Gull Wing) and substitute (6-SOIC). This difference requires physical board layout modification and PCB footprint redesign. The 6-SOIC package occupies less board area than the 8-SMD configuration.

Propagation delay timing characteristics are reversed between the two parts: the TLP754 specifies tpLH/tpHL as 550ns/400ns maximum, while the TLP2704 specifies 400ns/550ns maximum. Both configurations support the 1Mbps data rate requirement. Circuit timing analysis must confirm that the reversed delay profile remains within system timing margins.

The TLP2704(D4-TP,E) is suitable for new designs and production transitions from the obsolete TLP754(D4-TP1,F) when board layout modifications and timing verification are completed.

Frequently Asked Questions (FAQ)

Q: Can the TLP2704(D4-TP,E) directly replace the TLP754(D4-TP1,F) without circuit modifications?

A: Electrical substitution is valid based on matching isolation voltage, CMTI, supply voltage, operating temperature, and output current specifications. However, package configuration differs (6-SOIC versus 8-SMD), requiring PCB footprint redesign. Propagation delay timing is reversed; circuit timing analysis must confirm compatibility with system requirements.

Q: What is the primary reason for substituting the TLP754(D4-TP1,F)?

A: The TLP754(D4-TP1,F) is classified as obsolete. The TLP2704(D4-TP,E) is the active equivalent from the same manufacturer, ensuring continued supply availability and compliance with current manufacturing standards.

Q: Are there differences in isolation voltage or CMTI between these parts?

A: No. Both components provide 5000Vrms isolation voltage and 20kV/µs common mode transient immunity. These critical parameters are identical.

Q: How do the propagation delay specifications differ?

A: The TLP754 specifies tpLH/tpHL as 550ns/400ns maximum. The TLP2704 specifies 400ns/550ns maximum. The timing characteristics are reversed. System timing margins must accommodate this difference.

Q: What packaging considerations apply to this substitution?

A: The TLP754 uses an 8-SMD Gull Wing package; the TLP2704 uses a 6-SOIC package. PCB footprint redesign is required. The 6-SOIC package is smaller and may reduce board area requirements.

Q: Does the TLP2704(D4-TP,E) meet current compliance standards?

A: Yes. The TLP2704(D4-TP,E) is ROHS3 compliant and carries MSL Level 1 (Unlimited) moisture sensitivity rating, meeting current manufacturing and environmental requirements.

Q: Is the data rate specification identical between both parts?

A: The TLP754 specifies 1Mbps data rate. The TLP2704 does not specify a data rate parameter in the provided documentation. Both components support high-speed logic output isolation applications. The TLP2704 is classified as a high-speed logic output coupler.

Q: What is the inventory status of the substitute part?

A: The TLP2704(D4-TP,E) has 2563 pieces in stock as new original inventory, compared to 736 pieces for the obsolete TLP754(D4-TP1,F).