TLP716F(F) Equivalent & Substitute Parts

Part Overview

The TLP716F(F) is a logic output optoisolator manufactured by Toshiba Semiconductor and Storage, designed for high-speed digital isolation applications. This single-channel photocoupler features a push-pull totem pole output configuration with 5000Vrms isolation voltage and 10kV/µs common mode transient immunity. The device operates at data rates up to 15MBd and is housed in a 6-SDIP gull wing surface mount package.

The TLP716F(F) is classified as obsolete. Identifying equivalent and substitute parts is necessary to ensure continued availability for new designs, production continuity, and long-term system support where this component is specified.

Substiute Parts

TLP716F(F)
Toshiba Semiconductor and StorageIn Stock: 939TLP716F(F) Datasheet
TLP716F(F)
Current Part
TLP2766A(LF4,E
Toshiba Semiconductor and StorageIn Stock: 1025TLP2766A(LF4,E Datasheet
TLP2766A(LF4,E
MFR Recommended

Key Parameters

Parameter Value
Number of Channels 1
Voltage - Isolation 5000Vrms
Common Mode Transient Immunity (Min) 10kV/µs
Input Type DC
Output Type Push-Pull, Totem Pole
Current - Output / Channel 10 mA
Data Rate 15MBd
Voltage - Supply 4.5V ~ 5.5V
Operating Temperature -40°C ~ 100°C
Mounting Type Surface Mount
Package / Case 6-SOIC
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the TLP716F(F) is determined by the following critical parameters that must be maintained or exceeded:

Core Functional Requirements:

  • Single-channel configuration (1 input, 0 outputs on side 2)
  • Push-pull totem pole output topology
  • 5000Vrms isolation voltage
  • DC input type
  • 10 mA output current per channel capability

Performance Specifications:

  • Data rate of 15MBd or higher
  • Common mode transient immunity of 10kV/µs or higher
  • Supply voltage range compatibility with 4.5V ~ 5.5V operation
  • Operating temperature range of -40°C to 100°C or wider

Physical Requirements:

  • Surface mount package in 6-pin SOIC form factor
  • Pin-compatible or functionally equivalent pinout

The TLP2766A(LF4,E) meets all substitution criteria by maintaining identical isolation voltage, channel configuration, output type, and output current specifications while providing enhanced performance in data rate, common mode transient immunity, propagation delay, and operating temperature range.

Parameter Comparison

Parameter TLP716F(F) TLP2766A(LF4,E) Compatibility
Number of Channels 1 1 Identical
Inputs - Side 1/Side 2 1/0 1/0 Identical
Voltage - Isolation 5000Vrms 5000Vrms Identical
Common Mode Transient Immunity (Min) 10kV/µs 20kV/µs Substitute Exceeds
Input Type DC DC Identical
Output Type Push-Pull, Totem Pole Push-Pull, Totem Pole Identical
Current - Output / Channel 10 mA 10 mA Identical
Data Rate 15MBd 20MBd Substitute Exceeds
Propagation Delay tpLH / tpHL (Max) 75ns, 75ns 55ns, 55ns Substitute Exceeds
Voltage - Supply 4.5V ~ 5.5V 2.7V ~ 5.5V Substitute Exceeds
Operating Temperature -40°C ~ 100°C -40°C ~ 125°C Substitute Exceeds
Mounting Type Surface Mount Surface Mount Identical
Package / Case 6-SOIC (0.268", 6.80mm Width) 6-SOIC (0.295", 7.50mm Width) Compatible Form Factor
Product Status Obsolete Active Substitute Active

Engineering Selection Recommendations

Primary Substitute: TLP2766A(LF4,E)

The TLP2766A(LF4,E) is the manufacturer-recommended substitute for the obsolete TLP716F(F). This optoisolator maintains all critical functional parameters while providing measurable performance improvements across multiple specifications.

Compliance and Availability: The TLP2766A(LF4,E) carries active product status from Toshiba Semiconductor and Storage, ensuring long-term availability, ongoing manufacturing support, and compliance with current industry standards. The device is classified under the same ECCN (EAR99) and HTSUS (8541.49.8000) codes as the original part, maintaining regulatory equivalence.

Performance Advantages: The substitute part delivers enhanced performance in data rate (20MBd versus 15MBd), common mode transient immunity (20kV/µs versus 10kV/µs), and propagation delay characteristics (55ns versus 75ns maximum). The extended operating temperature range (-40°C to 125°C versus -40°C to 100°C) and wider supply voltage compatibility (2.7V to 5.5V versus 4.5V to 5.5V) provide additional design flexibility.

Package Considerations: Both devices employ 6-SOIC surface mount packaging. The TLP2766A(LF4,E) package width is 7.50mm compared to 6.80mm for the TLP716F(F). PCB layout verification is required to confirm physical fit within existing board designs, though the form factor remains compatible for standard surface mount assembly processes.

Moisture Sensitivity: The TLP2766A(LF4,E) carries MSL 1 (Unlimited) rating, indicating superior moisture resistance compared to typical optoisolator components and supporting extended storage and handling without special environmental controls.

Frequently Asked Questions (FAQ)

Q: Can the TLP2766A(LF4,E) directly replace the TLP716F(F) in existing designs?

A: The TLP2766A(LF4,E) is functionally equivalent for all critical parameters including isolation voltage, channel configuration, output type, and output current. The 6-SOIC package form factor is compatible. However, the package width differs by 0.70mm (7.50mm versus 6.80mm), requiring verification of PCB layout clearances and component placement constraints before implementation.

Q: What are the key performance improvements in the substitute part?

A: The TLP2766A(LF4,E) provides three measurable performance enhancements: data rate increases from 15MBd to 20MBd, common mode transient immunity improves from 10kV/µs to 20kV/µs, and maximum propagation delay decreases from 75ns to 55ns. These improvements support higher-speed applications and greater noise immunity without compromising compatibility with the original specification.

Q: Are there any supply voltage compatibility concerns?

A: The TLP2766A(LF4,E) operates across a wider supply voltage range (2.7V to 5.5V) compared to the TLP716F(F) (4.5V to 5.5V). This expanded range provides additional design flexibility and is fully backward compatible with systems designed for the original 4.5V to 5.5V specification.

Q: What is the significance of the MSL 1 rating on the substitute part?

A: MSL 1 (Unlimited) indicates that the TLP2766A(LF4,E) has no moisture sensitivity limitations. This eliminates the need for special moisture-controlled storage, desiccant packaging, or bake-out procedures before assembly, reducing handling complexity and cost compared to higher MSL-rated components.

Q: How does the extended operating temperature range affect system design?

A: The TLP2766A(LF4,E) operates to 125°C compared to 100°C for the TLP716F(F). This 25°C extension provides additional thermal margin in applications with elevated ambient temperatures or high-power dissipation environments, improving system reliability without design modification.

Q: Is the substitute part available in the same packaging format?

A: Both parts use 6-SOIC surface mount packaging. The physical form factor is identical, supporting standard surface mount assembly processes. The package width difference (0.70mm) requires PCB layout verification but does not affect the fundamental assembly compatibility or soldering process.

Q: What regulatory certifications apply to the substitute part?

A: The TLP2766A(LF4,E) carries identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications as the TLP716F(F), maintaining regulatory equivalence for export control and tariff purposes.

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