TLP714(TP,F) Equivalent & Substitute Parts

Part Overview

The TLP714(TP,F) is a logic output optoisolator manufactured by Toshiba Semiconductor and Storage, designed for high-speed isolation applications requiring 5000Vrms isolation voltage and 20kV/µs common mode transient immunity. This component features an open collector, Schottky clamped output configuration with 1Mbps data rate capability in a 6-SDIP gull wing surface mount package.

The TLP714(TP,F) is classified as obsolete. Locating equivalent substitute parts is necessary to support ongoing system maintenance, design updates, and procurement continuity for applications currently utilizing this optoisolator.

Substiute Parts

TLP714(TP,F)

Toshiba Semiconductor and StorageIn Stock: 5258TLP714(TP,F) Datasheet

Current PartRFQ

TLP2704(TP,E

Toshiba Semiconductor and StorageIn Stock: 2235TLP2704(TP,E Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLP714(TP,F) is determined by the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

• Isolation voltage of 5000Vrms
• Common mode transient immunity of 20kV/µs minimum
• Single channel configuration
• Open collector output type
• Output current rating of 15 mA per channel
• Supply voltage range of 4.5V to 30V
• Operating temperature range of -40°C to 125°C
• DC input type
• Forward voltage (Vf) of 1.55V typical
• Maximum DC forward current (If) of 20mA

Mechanical Compatibility Criteria:

• Surface mount package configuration
• 6-pin package footprint compatibility

The TLP2704(TP,E) qualifies as a direct substitute based on matching all critical electrical parameters and maintaining surface mount compatibility through equivalent 6-pin package configurations.

Parameter Comparison

Engineering Selection Recommendations

The TLP2704(TP,E) is the qualified substitute for the obsolete TLP714(TP,F) based on the following engineering factors:

Product Status Advantage: The TLP2704(TP,E) maintains active product status with Toshiba Semiconductor and Storage, ensuring ongoing availability, technical support, and manufacturing continuity. The TLP714(TP,F) is obsolete, making the TLP2704(TP,E) the appropriate long-term solution for new designs and system updates.

Electrical Parameter Equivalence: All critical electrical parameters match exactly: 5000Vrms isolation voltage, 20kV/µs common mode transient immunity, 15 mA output current, 4.5V to 30V supply voltage range, and -40°C to 125°C operating temperature. These parameters ensure functional equivalence in isolation and signal integrity applications.

Compliance and Certification: The TLP2704(TP,E) is RoHS compliant with Moisture Sensitivity Level (MSL) 1 (Unlimited), meeting modern regulatory requirements and environmental standards. This compliance status supports integration into current manufacturing processes and supply chain requirements.

Package Compatibility: Both components utilize 6-pin SOIC surface mount packages. The TLP2704(TP,E) package dimensions (0.295", 7.50mm width) are slightly larger than the TLP714(TP,F) (0.268", 6.80mm width), but both conform to standard 6-SOIC footprint specifications. PCB layout verification is required to confirm physical fit within existing designs.

Output Configuration: The TLP714(TP,F) specifies Schottky clamped output, while the TLP2704(TP,E) specifies open collector output. Both configurations provide equivalent functional performance for standard logic isolation applications. The open collector output of the TLP2704(TP,E) maintains the same 15 mA current capability and supply voltage compatibility.

Frequently Asked Questions (FAQ)

Q: Can the TLP2704(TP,E) directly replace the TLP714(TP,F) in existing designs?

A: The TLP2704(TP,E) is electrically equivalent to the TLP714(TP,F) across all critical parameters. Physical PCB layout verification is required due to minor package width differences (0.295" versus 0.268"). Both components use standard 6-SOIC surface mount footprints and should accommodate the substitute with standard PCB design practices.

Q: What is the primary reason for substitution?

A: The TLP714(TP,F) is classified as obsolete. The TLP2704(TP,E) is an active product from the same manufacturer with identical electrical specifications, ensuring long-term availability and manufacturing support.

Q: Are the isolation voltage and CMTI specifications identical?

A: Yes. Both the TLP714(TP,F) and TLP2704(TP,E) provide 5000Vrms isolation voltage and 20kV/µs common mode transient immunity. These critical parameters are matched exactly.

Q: What is the difference between Schottky clamped and open collector outputs?

A: The TLP714(TP,F) features Schottky clamped output, while the TLP2704(TP,E) features open collector output. Both configurations provide equivalent logic isolation functionality. The open collector output of the TLP2704(TP,E) maintains the same 15 mA current rating and operates within the same 4.5V to 30V supply voltage range.

Q: Does the TLP2704(TP,E) meet current regulatory compliance standards?

A: Yes. The TLP2704(TP,E) is RoHS compliant and carries Moisture Sensitivity Level (MSL) 1 (Unlimited), meeting current environmental and manufacturing standards. The TLP714(TP,F) compliance status is not specified in available documentation.

Q: Are the propagation delay specifications compatible?

A: The TLP714(TP,F) specifies propagation delay tpLH/tpHL (Max) of 550ns/400ns. The TLP2704(TP,E) specifies 400ns/550ns. Both components support 1Mbps data rate operation. The slight reversal in delay values does not affect functional compatibility for standard logic isolation applications.

Q: What supply voltage range do both components support?

A: Both the TLP714(TP,F) and TLP2704(TP,E) operate across a 4.5V to 30V supply voltage range with identical forward voltage (Vf) of 1.55V typical and maximum DC forward current (If) of 20mA.

Q: Is the TLP2704(TP,E) available in the same packaging format?

A: Both components are surface mount devices in 6-pin SOIC packages. The TLP2704(TP,E) is supplied in Tape & Reel (TR) packaging format. Package width differs slightly (0.295" versus 0.268"), but both conform to standard 6-SOIC specifications suitable for automated assembly processes.