TLP700(TP,F) Equivalent & Substitute Parts

Part Overview

The TLP700(TP,F) is a 5000Vrms optical isolation gate driver with 2A output capability in a 6-SDIP gull wing surface mount package. This component is classified as Obsolete and is no longer in active production. The TLP700(TP,F) provides single-channel galvanic isolation suitable for gate driving applications requiring high common mode transient immunity and fast propagation characteristics.

Due to its obsolete status, locating replacement inventory becomes increasingly difficult. Equivalent substitute parts maintain the core isolation voltage, channel configuration, and operating temperature range while offering improved performance characteristics and active product status.

Substiute Parts

TLP700(TP,F)

Toshiba Semiconductor and StorageIn Stock: 2496TLP700(TP,F) Datasheet

Current PartRFQ

TLP5702(TP,E

Toshiba Semiconductor and StorageIn Stock: 2328TLP5702(TP,E Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLP700(TP,F) is determined by the following critical parameters that must remain constant or improve:

Mandatory Matching Parameters:

• Voltage - Isolation: 5000Vrms (no reduction permitted)
• Number of Channels: 1 (single channel configuration)
• Mounting Type: Surface Mount
• Voltage - Output Supply Range: 15V ~ 30V (compatible supply voltage)

Performance Enhancement Parameters:

• Common Mode Transient Immunity: Substitute must meet or exceed 15kV/µs
• Propagation Delay: Substitute may equal or improve (lower values acceptable)
• Rise / Fall Time: Substitute may equal or improve (lower values acceptable)
• Operating Temperature Range: Substitute must support -40°C minimum and 100°C maximum

The TLP5702(TP,E) qualifies as a direct substitute because it maintains all mandatory parameters while providing superior performance in CMTI, propagation delay, and rise/fall time characteristics. The substitute operates across an extended temperature range (-40°C ~ 110°C) and carries active product status with RoHS compliance.

Parameter Comparison

Engineering Selection Recommendations

Substitution Feasibility: TLP5702(TP,E) as Direct Replacement

The TLP5702(TP,E) serves as a qualified substitute for the obsolete TLP700(TP,F) based on the following engineering criteria:

Compliance and Product Status: The TLP5702(TP,E) carries active product status with RoHS compliance certification, ensuring long-term availability and regulatory alignment. The TLP700(TP,F) obsolete classification creates supply chain risk and limits future procurement options.

Electrical Compatibility: Both devices maintain identical 5000Vrms isolation voltage, single-channel configuration, and 15V ~ 30V supply voltage range. The substitute demonstrates superior performance with 20kV/µs CMTI (versus 15kV/µs), 200ns propagation delay (versus 500ns), and faster rise/fall times (15ns/8ns versus 50ns/50ns).

Package Consideration: The TLP5702(TP,E) uses a 6-SOIC package with 0.295" width compared to the TLP700(TP,F) 6-SOIC package with 0.268" width. Both are surface mount 6-pin configurations. PCB layout verification is required to confirm the 0.027" width difference accommodates existing footprints.

Output Current Limitation: The TLP5702(TP,E) provides 1A per channel output current versus the TLP700(TP,F) 2A capability. Applications requiring the full 2A output specification must evaluate whether 1A output meets functional requirements or if alternative solutions are necessary.

Temperature Range: The TLP5702(TP,E) extends the upper operating temperature to 110°C (versus 100°C), providing additional thermal margin for high-temperature environments.

Frequently Asked Questions (FAQ)

Q: Can the TLP5702(TP,E) directly replace the TLP700(TP,F) in existing designs?

A: The TLP5702(TP,E) is electrically compatible for applications requiring up to 1A output current per channel. The primary design consideration is the package width difference (0.295" versus 0.268"). PCB footprint verification is necessary before implementation. Applications requiring 2A output current must evaluate alternative solutions.

Q: What is the significance of the Common Mode Transient Immunity (CMTI) improvement from 15kV/µs to 20kV/µs?

A: The 20kV/µs CMTI in the TLP5702(TP,E) provides enhanced noise immunity during high-speed switching transients. This improvement reduces the risk of false triggering in gate driver applications with steep voltage transitions, particularly in high-power switching circuits.

Q: Are there any certifications or compliance differences between these parts?

A: The TLP700(TP,F) carries CSA, cUL, UL, and VDE approvals. The TLP5702(TP,E) is RoHS Compliant with Moisture Sensitivity Level 1 (Unlimited). Both devices share the same ECCN (EAR99) and HTSUS classification. Regulatory requirements for your application determine whether RoHS compliance is mandatory.

Q: How does the propagation delay difference affect circuit timing?

A: The TLP5702(TP,E) provides 200ns propagation delay compared to 500ns for the TLP700(TP,F). This 300ns improvement results in faster signal transmission through the optical isolation barrier. Applications with tight timing requirements benefit from this reduction, while applications with relaxed timing tolerances experience no functional impact.

Q: What is the impact of reduced output current from 2A to 1A?

A: The 1A output current in the TLP5702(TP,E) is suitable for gate driving applications with moderate current requirements. High-power MOSFET or IGBT gate drivers requiring rapid charge/discharge cycles may need the full 2A capability. Evaluate your specific gate charge requirements and switching frequency to determine if 1A output is sufficient.

Q: Is the package width difference critical for PCB redesign?

A: The 0.027" width difference between 6-SOIC packages may require PCB footprint adjustment. Verify that existing PCB layouts accommodate the TLP5702(TP,E) 0.295" width specification. In many cases, standard 6-SOIC footprints with adequate clearance will accept both package variants without modification.

Q: Why is the TLP700(TP,F) classified as obsolete?

A: Obsolete classification indicates that Toshiba Semiconductor and Storage has discontinued production and will not manufacture additional units. Existing inventory may be available through authorized distributors, but long-term supply cannot be guaranteed. The TLP5702(TP,E) active status ensures continued availability and manufacturing support.