TLP700H(TP,F) Equivalent & Substitute Parts

Part Overview

The TLP700H(TP,F) is a 2-channel optical coupling gate driver with 5000Vrms isolation, designed for high-voltage switching applications requiring galvanic isolation. Manufactured by Toshiba Semiconductor and Storage, this component integrates two independent gate driver channels in a 6-SDIP package with 2A output current capability.

The TLP700H(TP,F) is classified as obsolete. Identifying functionally compatible substitute parts is necessary to support ongoing design requirements, system maintenance, and production continuity where this component is specified in existing applications.

Substiute Parts

TLP700H(TP,F)

Toshiba Semiconductor and StorageIn Stock: 860TLP700H(TP,F) Datasheet

Current PartRFQ

TLP5752H(TP,E

Toshiba Semiconductor and StorageIn Stock: 1093TLP5752H(TP,E Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the TLP700H(TP,F) must satisfy the following criteria based on allowed electrical and mechanical parameters:

Mandatory Compatibility Parameters:

• Voltage - Isolation: 5000Vrms (exact match required)
• Number of Channels: 2 (exact match required)
• Technology: Optical Coupling (exact match required)
• Voltage - Output Supply: 15V ~ 30V (exact match required)
• Operating Temperature Range: -40°C ~ 125°C (exact match required)
• Mounting Type: Surface Mount (exact match required)

Allowable Substitution Parameters:

• Current - Output High / Low: Equal to or greater than 2A / 2A
• Common Mode Transient Immunity: Equal to or greater than 20kV/µs
• Propagation Delay: Equal to or less than 500ns for both tpLH and tpHL
• Pulse Width Distortion: Equal to or less than 250ns
• Package / Case: 6-pin SOIC variants with compatible pinout and thermal characteristics

The TLP5752H(TP,E) meets all mandatory compatibility parameters and exceeds performance specifications in output current, transient immunity, and timing characteristics, qualifying it as a direct substitute.

Parameter Comparison

Engineering Selection Recommendations

TLP5752H(TP,E) as Primary Substitute:

The TLP5752H(TP,E) is the manufacturer-recommended substitute for the obsolete TLP700H(TP,F). Both components share identical isolation voltage, channel count, output supply range, and operating temperature specifications. The TLP5752H(TP,E) maintains full backward compatibility while providing enhanced performance characteristics.

Product Status Consideration:

The TLP700H(TP,F) is classified as obsolete, whereas the TLP5752H(TP,E) maintains active product status with current manufacturing support. This status difference makes the TLP5752H(TP,E) the appropriate choice for new designs and ongoing production requirements.

Compliance and Certification:

Both parts carry multiple regulatory approvals. The TLP700H(TP,F) holds CSA, cUL, UL, and VDE certifications. The TLP5752H(TP,E) extends compliance coverage to include CQC certification in addition to CSA, cUL, UL, and VDE approvals, providing broader international regulatory acceptance.

Performance Enhancement:

The TLP5752H(TP,E) delivers measurable improvements in propagation delay (150ns versus 500ns), pulse width distortion (50ns versus 250ns), and common mode transient immunity (35kV/µs versus 20kV/µs). Output current capability increases from 2A to 2.5A. These enhancements support applications requiring faster switching response and improved noise immunity without requiring circuit redesign.

Package Consideration:

The TLP5752H(TP,E) uses a 6-SOIC package with 7.50mm width compared to the TLP700H(TP,F) 6-SOIC package with 6.80mm width. Both are surface-mount 6-pin SOIC variants. PCB layout verification is required to confirm package footprint compatibility in existing designs.

Frequently Asked Questions (FAQ)

Q: Can the TLP5752H(TP,E) directly replace the TLP700H(TP,F) in existing applications?

A: The TLP5752H(TP,E) is electrically compatible as a substitute. Both components provide 5000Vrms isolation, 2-channel gate driver functionality, and identical output supply voltage range. However, the package width differs (7.50mm versus 6.80mm), requiring PCB layout verification before implementation.

Q: What are the key differences between these two parts?

A: The primary differences are product status (active versus obsolete), output current (2.5A versus 2A), propagation delay (150ns versus 500ns), pulse width distortion (50ns versus 250ns), and common mode transient immunity (35kV/µs versus 20kV/µs). The TLP5752H(TP,E) provides superior performance across all timing and current specifications.

Q: Are there any circuit modifications required when substituting the TLP5752H(TP,E) for the TLP700H(TP,F)?

A: No circuit modifications are required. Both parts operate within the same 15V to 30V output supply range and maintain identical isolation voltage and channel configuration. The enhanced performance characteristics of the TLP5752H(TP,E) are transparent to the application circuit.

Q: How does the package width difference affect PCB design?

A: The TLP5752H(TP,E) package width is 7.50mm compared to 6.80mm for the TLP700H(TP,F). This 0.70mm difference requires verification that the component footprint fits within the existing PCB layout. If the original design has minimal clearance, PCB modification may be necessary.

Q: What regulatory certifications apply to the TLP5752H(TP,E)?

A: The TLP5752H(TP,E) carries CQC, CSA, cUL, UL, and VDE approvals. This certification set exceeds the TLP700H(TP,F) approvals and supports broader international market requirements.

Q: Is the TLP5752H(TP,E) available in the same packaging format?

A: Both parts use 6-pin SOIC surface-mount packages. The TLP5752H(TP,E) is designated as 6-SO (supplier device package) with 7.50mm width, while the TLP700H(TP,F) is 6-SDIP with 6.80mm width. Both are surface-mount variants suitable for automated assembly.

Q: What is the inventory status of the TLP5752H(TP,E)?

A: The TLP5752H(TP,E) is an active product with 1037 pieces in current stock. The TLP700H(TP,F) is obsolete with 838 pieces available as remaining inventory.