TLP700H(D4-TP,F) Equivalent & Substitute Parts

Part Overview

The TLP700H(D4-TP,F) is a 2-channel optical coupling gate driver with 5000Vrms isolation, rated for 2A output current per channel. This component is classified as Obsolete and is no longer in active production. The part is designed for high-voltage gate driving applications requiring galvanic isolation between control and power circuits.

Due to its obsolete status, identifying functionally compatible substitute parts is necessary for ongoing design support, maintenance, and new production requirements. Substitute parts must maintain electrical compatibility across isolation voltage, channel count, output current capability, and operating temperature range.

Substiute Parts

TLP700H(D4-TP,F)

Toshiba Semiconductor and StorageIn Stock: 43999TLP700H(D4-TP,F) Datasheet

Current PartRFQ

TLP5752H(D4-TP,E

Toshiba Semiconductor and StorageIn Stock: 749TLP5752H(D4-TP,E Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the TLP700H(D4-TP,F) are identified based on strict electrical and mechanical compatibility criteria. The following parameters define the substitution scope:

Critical Compatibility Parameters:

• Voltage - Isolation: Must equal or exceed 5000Vrms
• Number of Channels: Must equal 2
• Current - Output High, Low: Must equal or exceed 2A per channel
• Voltage - Output Supply: Must encompass or match 15V ~ 30V range
• Operating Temperature: Must encompass or match -40°C ~ 125°C range
• Mounting Type: Must be Surface Mount
• Technology: Must be Optical Coupling

Performance Parameters (Enhancement Allowed):

• Common Mode Transient Immunity: Substitute may exceed minimum 20kV/µs
• Propagation Delay: Substitute may be faster than 500ns maximum
• Pulse Width Distortion: Substitute may be lower than 250ns maximum

Substitute parts that meet or exceed all critical parameters while maintaining backward compatibility are classified as direct functional equivalents.

Parameter Comparison

Engineering Selection Recommendations

TLP5752H(D4-TP,E) as Primary Substitute:

The TLP5752H(D4-TP,E) qualifies as a direct functional substitute for the obsolete TLP700H(D4-TP,F) based on the following engineering criteria:

1. Electrical Compatibility: All critical electrical parameters meet or exceed the original specification. Isolation voltage, channel count, output current capability, supply voltage range, and operating temperature range are identical or superior.

2. Active Product Status: The TLP5752H(D4-TP,E) is classified as Active, ensuring long-term availability, ongoing manufacturing support, and continued compliance with industry standards.

3. Enhanced Performance: The substitute part provides measurable improvements in propagation delay (150ns vs. 500ns), common mode transient immunity (35kV/µs vs. 20kV/µs), and pulse width distortion (50ns vs. 250ns). These enhancements do not introduce compatibility issues and improve overall system performance.

4. Regulatory Compliance: The substitute maintains all original certifications (CSA, cUL, UL, VDE) and adds CQC certification, providing broader regulatory coverage.

5. Package Consideration: Both parts use 6-SOIC surface-mount packages. The TLP5752H(D4-TP,E) has a slightly larger footprint (0.295" vs. 0.268" width). PCB layout verification is required to confirm physical fit within existing designs.

Selection Logic:

• For new designs or redesigns: Use TLP5752H(D4-TP,E) exclusively
• For legacy system maintenance: Verify PCB footprint compatibility before substitution
• For applications requiring the exact original footprint: Consult Toshiba for alternative options

Frequently Asked Questions (FAQ)

Q1: Can the TLP5752H(D4-TP,E) directly replace the TLP700H(D4-TP,F) in existing designs?

A: Electrical substitution is valid. All critical parameters (isolation voltage, channel count, output current, supply voltage, operating temperature) are compatible. However, the package footprint differs slightly (0.295" vs. 0.268" width). PCB layout must be verified to confirm physical fit. If the original PCB has tight spacing constraints, footprint compatibility must be confirmed before implementation.

Q2: What are the key differences between these two parts?

A: The TLP5752H(D4-TP,E) provides enhanced performance specifications: faster propagation delay (150ns vs. 500ns), higher common mode transient immunity (35kV/µs vs. 20kV/µs), and lower pulse width distortion (50ns vs. 250ns). Output current is also increased (2.5A vs. 2A). The original part is obsolete; the substitute is in active production.

Q3: Are there any certifications or compliance differences?

A: Both parts maintain CSA, cUL, UL, and VDE certifications. The TLP5752H(D4-TP,E) adds CQC certification, providing additional regulatory coverage for certain markets.

Q4: What is the significance of the "Obsolete" status for the TLP700H(D4-TP,F)?

A: Obsolete status indicates the part is no longer manufactured by Toshiba. Existing inventory may be available from distributors, but long-term supply cannot be guaranteed. For new production or ongoing support, migration to an active substitute is recommended.

Q5: Can the TLP5752H(D4-TP,E) be used in applications requiring the exact original specifications?

A: Yes. The substitute meets or exceeds all original specifications. Enhanced performance parameters do not create compatibility issues. The substitute is suitable for all applications originally designed for the TLP700H(D4-TP,F).

Q6: What should be verified before implementing the TLP5752H(D4-TP,E) in an existing design?

A: Verify PCB footprint compatibility due to the package width difference (0.295" vs. 0.268"). Confirm that the slightly larger footprint does not create spacing conflicts with adjacent components. Electrical compatibility requires no additional verification.

Q7: Is the TLP5752H(D4-TP,E) available in the same package designation?

A: Both parts use 6-SOIC surface-mount packages. The supplier device package designation differs (6-SDIP for original, 6-SO for substitute), but both are functionally equivalent 6-pin surface-mount packages with different physical dimensions.