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TLP700F(TP,F) Equivalent & Substitute Parts
Part Overview
The TLP700F(TP,F) is a 5000Vrms optical isolation gate driver manufactured by Toshiba Semiconductor and Storage. This component integrates a single-channel optoisolator with 2A peak output current capability, designed for gate driving applications requiring high-voltage isolation. The device operates across a temperature range of -40°C to 100°C and features a 6-SDIP gull wing surface mount package.
The TLP700F(TP,F) is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications currently utilizing this component.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Isolation | 5000 | Vrms |
| Number of Channels | 1 | — |
| Common Mode Transient Immunity (Min) | 15 | kV/µs |
| Propagation Delay tpLH / tpHL (Max) | 500 / 500 | ns |
| Current - Peak Output | 2 | A |
| Voltage - Output Supply | 15 ~ 30 | V |
| Operating Temperature | -40 ~ 100 | °C |
| Mounting Type | Surface Mount | — |
| Package / Case | 6-SOIC (0.268", 6.80mm Width) | — |
| Product Status | Obsolete | — |
Substitute Part Grouping Explanation
Substitution of the TLP700F(TP,F) is determined by the following critical electrical and mechanical parameters:
Isolation Voltage: The substitute part must maintain 5000Vrms isolation capability to preserve the high-voltage isolation integrity required in the original application.
Number of Channels: Single-channel configuration (1 channel) is mandatory for direct substitution.
Common Mode Transient Immunity (CMTI): The substitute must meet or exceed the minimum CMTI specification to ensure stable operation during rapid voltage transitions.
Propagation Delay: The substitute must not exceed the maximum propagation delay specifications to maintain timing performance in gate driver circuits.
Output Current Capability: Peak output current must be sufficient for the application's gate driving requirements.
Supply Voltage Range: The substitute must operate within the 15V to 30V supply voltage window.
Operating Temperature Range: The substitute must support the required temperature operating window.
Package Compatibility: Surface mount packages with compatible pinout and mechanical dimensions are required for direct board-level substitution.
Product Status: Active product status ensures ongoing availability and manufacturer support.
The TLP5702(TP4,E) meets all these substitution criteria and is classified as an active product with enhanced performance characteristics.
Parameter Comparison
| Parameter | TLP700F(TP,F) | TLP5702(TP4,E) | Unit |
|---|---|---|---|
| Manufacturer | Toshiba Semiconductor and Storage | Toshiba Semiconductor and Storage | — |
| Number of Channels | 1 | 1 | — |
| Voltage - Isolation | 5000 | 5000 | Vrms |
| Common Mode Transient Immunity (Min) | 15 | 20 | kV/µs |
| Propagation Delay tpLH / tpHL (Max) | 500 / 500 | 200 / 200 | ns |
| Rise / Fall Time (Typ) | — | 15 / 8 | ns |
| Voltage - Supply | 15 ~ 30 | 15 ~ 30 | V |
| Operating Temperature | -40 ~ 100 | -40 ~ 110 | °C |
| Mounting Type | Surface Mount | Surface Mount | — |
| Package / Case | 6-SOIC (0.268", 6.80mm Width) | 6-SOIC (0.295", 7.50mm Width) | — |
| Product Status | Obsolete | Active | — |
| Moisture Sensitivity Level (MSL) | — | 1 (Unlimited) | — |
Engineering Selection Recommendations
The TLP5702(TP4,E) is the qualified substitute for the obsolete TLP700F(TP,F) based on the following engineering criteria:
Electrical Compatibility: Both components maintain identical 5000Vrms isolation voltage and single-channel configuration. The TLP5702(TP4,E) provides enhanced performance with 20kV/µs CMTI (versus 15kV/µs) and reduced propagation delay of 200ns (versus 500ns), delivering improved transient response and timing precision.
Supply Voltage Alignment: Both parts operate within the identical 15V to 30V supply voltage range, ensuring direct compatibility with existing power supply designs.
Temperature Operating Range: The TLP5702(TP4,E) extends the upper operating temperature limit to 110°C (versus 100°C), providing broader thermal margin for demanding applications.
Product Status and Support: The TLP5702(TP4,E) is classified as active, ensuring ongoing manufacturer support, continued availability, and compliance with current quality and reliability standards.
Packaging Consideration: Both components use 6-SOIC surface mount packages. The TLP5702(TP4,E) package width is 7.50mm (versus 6.80mm for the TLP700F(TP,F)). Board layout verification is required to confirm mechanical fit within existing PCB footprints.
Regulatory Compliance: Both components carry identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications, maintaining regulatory consistency.
Frequently Asked Questions (FAQ)
Q: Can the TLP5702(TP4,E) directly replace the TLP700F(TP,F) in existing designs?
A: The TLP5702(TP4,E) is electrically compatible as a substitute. Both components maintain 5000Vrms isolation, single-channel configuration, and identical supply voltage range (15V ~ 30V). However, the package width differs (7.50mm versus 6.80mm). PCB layout verification is required to confirm the substitute component fits within the existing footprint.
Q: What are the key performance improvements in the TLP5702(TP4,E)?
A: The TLP5702(TP4,E) provides three measurable performance enhancements: (1) Common Mode Transient Immunity increases from 15kV/µs to 20kV/µs, improving noise immunity during rapid voltage transitions; (2) Propagation delay reduces from 500ns to 200ns, enabling faster gate driver response; (3) Operating temperature range extends to 110°C, providing additional thermal headroom.
Q: Are there any output current limitations when substituting?
A: The TLP700F(TP,F) specifies 2A peak output current. The TLP5702(TP4,E) is specified as a push-pull, totem pole output configuration. Verify that the substitute component's output current capability meets the gate driving requirements of the target application.
Q: What is the impact of the different package dimensions?
A: The TLP5702(TP4,E) uses a 6-SOIC package with 7.50mm width, compared to the TLP700F(TP,F) at 6.80mm width. This 0.70mm difference may affect PCB layout, particularly in space-constrained designs. Confirm that the substitute component's footprint is compatible with existing PCB routing and component placement.
Q: Is the TLP5702(TP4,E) available in the same packaging format?
A: The TLP5702(TP4,E) is supplied in Tape & Reel (TR) packaging, whereas the TLP700F(TP,F) was supplied in 6-SDIP gull wing format. Both are surface mount configurations. Verify that the reel packaging is compatible with your assembly process and equipment.
Q: What is the Moisture Sensitivity Level (MSL) of the substitute?
A: The TLP5702(TP4,E) carries MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. This provides flexibility in storage, handling, and assembly processes without requiring special moisture control measures.
Q: Are both components compliant with the same regulatory standards?
A: Yes. Both the TLP700F(TP,F) and TLP5702(TP4,E) carry identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications, ensuring consistent regulatory compliance across substitution.
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