TLP700AF(TP,F) Equivalent & Substitute Parts

Part Overview

The TLP700AF(TP,F) is a 5000Vrms optical isolation gate driver optocoupler manufactured by Toshiba Semiconductor and Storage. This component integrates a 2.5A peak output gate driver with single-channel optical coupling in a 6-SDIP gull wing surface mount package. The device is designed for high-voltage isolation applications requiring fast switching and high common mode transient immunity.

The TLP700AF(TP,F) is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications currently utilizing this component.

Substiute Parts

TLP700AF(TP,F)

Toshiba Semiconductor and StorageIn Stock: 772TLP700AF(TP,F) Datasheet

Current PartRFQ

TLP5702(TP4,E

Toshiba Semiconductor and StorageIn Stock: 2499TLP5702(TP4,E Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLP700AF(TP,F) is determined by strict equivalence across the following critical parameters:

Isolation Voltage: 5000Vrms isolation rating is mandatory for applications requiring high-voltage galvanic separation.

Channel Configuration: Single-channel (1 Channel) topology must be maintained for circuit compatibility.

Common Mode Transient Immunity: 20kV/µs minimum CMTI ensures the substitute can handle rapid voltage transitions without false triggering.

Propagation Delay: Maximum 200ns for both rising and falling edges ensures timing-critical gate drive applications remain within specification.

Output Current Capability: Peak output current of 2.5A and continuous output currents of 2A (high and low) define the load-driving capacity.

Supply Voltage Range: 15V to 30V output supply compatibility is required for circuit integration.

Operating Temperature: -40°C to 110°C operating range must be supported.

Mounting and Package: Surface mount technology with compatible pinout and footprint considerations.

Substitute parts must satisfy all these parameters without exception. Parts meeting these criteria are functionally equivalent for direct replacement in the original application circuit.

Parameter Comparison

Engineering Selection Recommendations

TLP5702(TP4,E) as Primary Substitute

The TLP5702(TP4,E) is the manufacturer-recommended substitute for the obsolete TLP700AF(TP,F). This part maintains electrical equivalence across all critical isolation, timing, and output drive parameters. The TLP5702(TP4,E) is classified as Active product status, ensuring ongoing availability and manufacturing support from Toshiba Semiconductor and Storage.

Both parts carry identical regulatory approvals (CQC, CSA, cUL, UL, VDE) and share the same ECCN and HTSUS classifications, confirming compliance equivalence for export and procurement purposes.

Package Consideration

The TLP5702(TP4,E) is supplied in 6-SO (Tape & Reel) packaging with a 6-SOIC case measuring 0.295" (7.50mm width), compared to the original 6-SDIP gull wing package at 0.268" (6.80mm width). Both are 6-pin surface mount packages with compatible pinout. PCB layout verification is required to confirm footprint compatibility in the target application, as the slight width difference may affect placement in space-constrained designs.

Supply Chain Status

The TLP5702(TP4,E) maintains higher inventory availability (2409 pieces in stock) compared to the obsolete TLP700AF(TP,F) (736 pieces), supporting long-term production continuity and reducing procurement lead times.

Frequently Asked Questions (FAQ)

Q: Can the TLP5702(TP4,E) directly replace the TLP700AF(TP,F) in existing designs?

A: The TLP5702(TP4,E) is electrically equivalent across all specified parameters including isolation voltage, propagation delay, output current, and operating temperature range. However, PCB layout verification is required due to package width differences (7.50mm vs. 6.80mm). Pinout compatibility must be confirmed for the specific application circuit.

Q: What are the key electrical parameters that determine substitution eligibility?

A: Substitution eligibility is determined by equivalence in isolation voltage (5000Vrms), single-channel configuration, common mode transient immunity (20kV/µs), propagation delay (200ns maximum), output current capability (2.5A peak), supply voltage range (15V–30V), and operating temperature range (-40°C to 110°C).

Q: Why is the TLP700AF(TP,F) classified as obsolete?

A: The TLP700AF(TP,F) is obsolete due to product lifecycle management by Toshiba Semiconductor and Storage. The TLP5702(TP4,E) represents the active replacement in the product family, offering equivalent functionality with improved supply chain availability.

Q: Are there regulatory or compliance differences between the two parts?

A: Both parts carry identical regulatory approvals (CQC, CSA, cUL, UL, VDE) and share the same ECCN (EAR99) and HTSUS (8541.49.8000) classifications. No compliance differences exist for procurement or export purposes.

Q: What is the moisture sensitivity level (MSL) of the substitute part?

A: The TLP5702(TP4,E) carries an MSL rating of 1 (Unlimited), indicating no moisture sensitivity restrictions during storage or handling. This simplifies logistics and inventory management compared to parts with higher MSL ratings.

Q: How do the output characteristics compare between the two parts?

A: Both parts feature identical forward voltage (1.55V typical), DC forward current (20mA maximum), and supply voltage range (15V–30V). The TLP5702(TP4,E) is specified as a push-pull, totem pole output configuration, ensuring compatible gate drive performance for MOSFET and IGBT applications.

Q: What packaging format is the TLP5702(TP4,E) supplied in?

A: The TLP5702(TP4,E) is supplied in Tape & Reel (TR) format, standard for high-volume surface mount assembly. The 6-SO package accommodates automated pick-and-place equipment used in modern PCB manufacturing.