TLP627MF(LF2,E Equivalent & Substitute Parts

Part Overview

The TLP627MF(LF2,E is a Darlington output optoisolator manufactured by Toshiba Semiconductor and Storage, designed for high-voltage isolation applications. This component provides 5000Vrms isolation with a single channel configuration in a 4-DIP package. The part is currently in active product status with 1011 units available in stock. Alternative equivalent parts are necessary to support supply chain flexibility, design redundancy, and procurement optimization across different packaging and distribution formats.

Substiute Parts

TLP627MF(LF2,E
Toshiba Semiconductor and StorageIn Stock: 1092TLP627MF(LF2,E Datasheet
TLP627MF(LF2,E
Current Part
TLP627MF(D4,E
Toshiba Semiconductor and StorageIn Stock: 1190TLP627MF(D4,E Datasheet
TLP627MF(D4,E
Parametric Equivalent
TLP627MF(D4-F4,E
Toshiba Semiconductor and StorageIn Stock: 1064TLP627MF(D4-F4,E Datasheet
TLP627MF(D4-F4,E
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Toshiba Semiconductor and Storage
Category Optoisolators
Number of Channels 1
Voltage - Isolation 5000Vrms
Current Transfer Ratio (Min) 1000% @ 1mA
Output Type Darlington
Voltage - Output (Max) 300V
Current - Output / Channel 150mA
Operating Temperature -55°C ~ 110°C
Package / Case 4-DIP (0.400", 10.16mm)
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the TLP627MF(LF2,E is determined by strict equivalence across the following critical parameters:

  • Isolation Voltage: 5000Vrms (mandatory match)
  • Number of Channels: 1 channel (mandatory match)
  • Output Configuration: Darlington output (mandatory match)
  • Package Type: 4-DIP (0.400", 10.16mm) (mandatory match)
  • Mounting Technology: Through Hole (mandatory match)
  • Current Transfer Ratio: 1000% @ 1mA minimum (mandatory match)
  • Maximum Output Voltage: 300V (mandatory match)
  • Maximum Output Current: 150mA per channel (mandatory match)
  • Operating Temperature Range: -55°C ~ 110°C (mandatory match)

The identified substitute parts TLP627MF(D4,E and TLP627MF(D4-F4,E meet all electrical and mechanical parameters identically. Differences exist only in packaging format (Tube vs. standard packaging) and supplier device package designation, which do not affect functional compatibility or circuit performance.

Parameter Comparison

Parameter TLP627MF(LF2,E TLP627MF(D4,E TLP627MF(D4-F4,E
Manufacturer Toshiba Semiconductor and Storage Toshiba Semiconductor and Storage Toshiba Semiconductor and Storage
Number of Channels 1 1 1
Voltage - Isolation 5000Vrms 5000Vrms 5000Vrms
Current Transfer Ratio (Min) 1000% @ 1mA 1000% @ 1mA 1000% @ 1mA
Turn On / Turn Off Time (Typ) 110µs, 30µs 110µs, 30µs 110µs, 30µs
Rise / Fall Time (Typ) 60µs, 30µs 60µs, 30µs 60µs, 30µs
Input Type DC DC DC
Output Type Darlington Darlington Darlington
Voltage - Output (Max) 300V 300V 300V
Current - Output / Channel 150mA 150mA 150mA
Voltage - Forward (Vf) (Typ) 1.25V 1.25V 1.25V
Current - DC Forward (If) (Max) 50 mA 50 mA 50 mA
Vce Saturation (Max) 1.2V 1.2V 1.2V
Operating Temperature -55°C ~ 110°C -55°C ~ 110°C -55°C ~ 110°C
Package / Case 4-DIP (0.400", 10.16mm) 4-DIP (0.400", 10.16mm) 4-DIP (0.400", 10.16mm)
Mounting Type Through Hole Through Hole Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
ECCN EAR99 EAR99 EAR99
HTSUS 8541.49.8000 8541.49.8000 8541.49.8000

Engineering Selection Recommendations

All three part numbers—TLP627MF(LF2,E, TLP627MF(D4,E, and TLP627MF(D4-F4,E—are manufactured by Toshiba Semiconductor and Storage and maintain active product status. The substitute parts TLP627MF(D4,E and TLP627MF(D4-F4,E carry ROHS3 compliance and REACH Unaffected status certifications, providing additional regulatory assurance for applications requiring environmental compliance documentation.

Selection between these equivalent parts should be based on:

  • Packaging Format: TLP627MF(D4,E and TLP627MF(D4-F4,E are supplied in Tube packaging, while TLP627MF(LF2,E uses standard packaging
  • Inventory Availability: TLP627MF(D4,E (1119 units), TLP627MF(D4-F4,E (972 units), and TLP627MF(LF2,E (1011 units) are all in stock
  • Regulatory Requirements: Applications requiring explicit ROHS3 and REACH documentation should specify TLP627MF(D4,E or TLP627MF(D4-F4,E

All parts are functionally interchangeable in circuit applications without modification to PCB layout, component footprint, or electrical design parameters.

Frequently Asked Questions (FAQ)

Q: Can TLP627MF(D4,E be used as a direct replacement for TLP627MF(LF2,E in existing designs?

A: Yes. Both parts are electrically and mechanically identical. The only difference is packaging format (Tube vs. standard). No circuit modifications, PCB changes, or design alterations are required.

Q: What is the difference between TLP627MF(D4,E and TLP627MF(D4-F4,E?

A: Both parts are parametrically equivalent with identical electrical specifications and 4-DIP package dimensions. The designation difference reflects supplier device package coding only and does not affect functional performance or compatibility.

Q: Are all three parts suitable for high-voltage isolation applications?

A: Yes. All three parts provide 5000Vrms isolation voltage, supporting high-voltage isolation requirements across industrial, automotive, and power management applications.

Q: Do the substitute parts require different PCB footprints?

A: No. All three parts use the same 4-DIP (0.400", 10.16mm) package with Through Hole mounting. PCB layouts and footprints are identical.

Q: Which part should be selected for new designs?

A: Any of the three parts can be selected for new designs. If regulatory compliance documentation is required, TLP627MF(D4,E or TLP627MF(D4-F4,E provide explicit ROHS3 and REACH certifications. Selection may also be influenced by supplier availability and packaging preferences.

Q: Are there any temperature or operating condition differences between these parts?

A: No. All three parts share identical operating temperature ranges (-55°C ~ 110°C) and electrical performance specifications across the full operating envelope.

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