TLP621-2BLSM Equivalent & Substitute Parts

Part Overview

The TLP621-2BLSM is a dual-channel optoisolator with transistor output manufactured by Isocom Components 2004 LTD. This 8-SMD surface mount component provides 5300Vrms isolation voltage and is designed for applications requiring galvanic isolation between input and output circuits. The part is currently active in production with 685 units in stock. Substitute parts are identified based on matching electrical specifications, isolation ratings, channel configuration, and package compatibility to ensure direct functional replacement in circuit designs.

Key Parameters

Parameter	Value
Manufacturer Part Number	TLP621-2BLSM
Manufacturer	Isocom Components 2004 LTD
Category	Optoisolators
Number of Channels	2
Voltage - Isolation	5300Vrms
Output Type	Transistor
Voltage - Output (Max)	55V
Current - Output / Channel	50mA
Current Transfer Ratio (Min)	50% @ 5mA
Current Transfer Ratio (Max)	600% @ 5mA
Vce Saturation (Max)	400mV
Operating Temperature	-30°C ~ 100°C
Package / Case	8-SMD, Gull Wing
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Product Status	Active

Substitute Part Grouping Explanation

Substitute parts for the TLP621-2BLSM are qualified based on the following critical parameters that determine functional equivalence:

Isolation Voltage: All substitutes maintain 5300Vrms isolation rating, ensuring equivalent galvanic isolation performance.

Channel Configuration: All substitutes provide dual-channel (2-channel) architecture matching the original part.

Output Type & Ratings: All substitutes feature transistor output with identical maximum output voltage (55V) and per-channel current rating (50mA).

Current Transfer Ratio: All substitutes maintain the same CTR range of 50% to 600% @ 5mA, ensuring consistent input-to-output signal transfer characteristics.

Saturation Voltage: All substitutes specify Vce saturation at 400mV maximum, maintaining equivalent output impedance characteristics.

Package & Mounting: All substitutes use 8-SMD Gull Wing surface mount packaging, enabling direct PCB layout compatibility.

Operating Temperature Range: All substitutes support -30°C to 100°C operation, matching thermal performance requirements.

Compliance & Status: All substitutes are active production parts with ROHS3 compliance and REACH unaffected status.

The three identified substitutes (ISP521-2XSM, ISP621-2XGRSM, ISP621-2XSM) meet all these criteria and are interchangeable with the TLP621-2BLSM in applications where these specifications are required.

Parameter Comparison

Parameter	TLP621-2BLSM	ISP521-2XSM	ISP621-2XGRSM	ISP621-2XSM
Manufacturer	Isocom Components 2004 LTD	Isocom Components 2004 LTD	Isocom Components 2004 LTD	Isocom Components 2004 LTD
Number of Channels	2	2	2	2
Voltage - Isolation	5300Vrms	5300Vrms	5300Vrms	5300Vrms
Current Transfer Ratio (Min)	50% @ 5mA	50% @ 5mA	50% @ 5mA	50% @ 5mA
Current Transfer Ratio (Max)	600% @ 5mA	600% @ 5mA	600% @ 5mA	600% @ 5mA
Turn On / Turn Off Time (Typ)	3µs, 3µs	Not specified	Not specified	Not specified
Rise / Fall Time (Typ)	2µs, 3µs	4µs, 3µs	4µs, 3µs	4µs, 3µs
Output Type	Transistor	Transistor	Transistor	Transistor
Voltage - Output (Max)	55V	55V	55V	55V
Current - Output / Channel	50mA	50mA	50mA	50mA
Voltage - Forward (Vf) (Typ)	1.15V	1.15V	1.15V	1.15V
Current - DC Forward (If) (Max)	50 mA	50 mA	50 mA	50 mA
Vce Saturation (Max)	400mV	400mV	400mV	400mV
Operating Temperature	-30°C ~ 100°C	-30°C ~ 100°C	-30°C ~ 100°C	-30°C ~ 100°C
Package / Case	8-SMD, Gull Wing	8-SMD, Gull Wing	8-SMD, Gull Wing	8-SMD, Gull Wing
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected	REACH Unaffected
Product Status	Active	Active	Active	Active

Engineering Selection Recommendations

All three substitute parts (ISP521-2XSM, ISP621-2XGRSM, ISP621-2XSM) are qualified as direct functional equivalents to the TLP621-2BLSM based on matching electrical specifications and package compatibility. Selection among these options may be based on inventory availability and lead time considerations.

Inventory Status:

TLP621-2BLSM: 685 units in stock
ISP521-2XSM: 1145 units in stock
ISP621-2XGRSM: 921 units in stock
ISP621-2XSM: 957 units in stock

All parts maintain active production status and full compliance with ROHS3 and REACH requirements, ensuring long-term supply chain viability and regulatory conformance for end applications.

Frequently Asked Questions (FAQ)

Q: Can ISP521-2XSM, ISP621-2XGRSM, and ISP621-2XSM be used interchangeably with TLP621-2BLSM?

A: Yes. All three substitute parts match the critical electrical parameters including 5300Vrms isolation voltage, dual-channel configuration, 50% to 600% current transfer ratio, 55V maximum output voltage, and 50mA per-channel current rating. The 8-SMD Gull Wing package ensures identical PCB footprint compatibility.

Q: What is the difference in rise/fall time between TLP621-2BLSM and the substitute parts?

A: The TLP621-2BLSM specifies rise/fall times of 2µs and 3µs respectively. The substitute parts (ISP521-2XSM, ISP621-2XGRSM, ISP621-2XSM) specify 4µs and 3µs. This represents a slower rise time in the substitutes. Applications with strict timing requirements should evaluate this difference against circuit performance needs.

Q: Are all parts RoHS and REACH compliant?

A: Yes. All parts including TLP621-2BLSM and the three substitutes are ROHS3 compliant and REACH unaffected, meeting regulatory requirements for electronics manufacturing and distribution.

Q: What is the moisture sensitivity level for these optoisolators?

A: All parts carry MSL 1 (Unlimited) rating, indicating no moisture sensitivity restrictions during storage or handling.

Q: Can I mix TLP621-2BLSM and substitute parts in the same production run?

A: Yes. All parts are functionally equivalent and share identical package specifications, allowing mixed sourcing from different part numbers without circuit redesign or PCB layout modifications.

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