TLP2955(TP1,F) Equivalent & Substitute Parts

Part Overview

The TLP2955(TP1,F) is a logic output optoisolator manufactured by Toshiba Semiconductor and Storage, designed for high-speed digital isolation applications. This device features a single-channel push-pull totem pole output configuration with 5000Vrms isolation capability and 20kV/µs common mode transient immunity. The component operates at data rates up to 5Mbps and is housed in an 8-SMD surface mount package.

The TLP2955(TP1,F) is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications currently utilizing this component.

Substiute Parts

TLP2955(TP1,F)
Toshiba Semiconductor and StorageIn Stock: 939TLP2955(TP1,F) Datasheet
TLP2955(TP1,F)
Current Part
TLP2745(TP,E
Toshiba Semiconductor and StorageIn Stock: 2159TLP2745(TP,E Datasheet
TLP2745(TP,E
MFR Recommended

Key Parameters

Parameter Value
Number of Channels 1
Voltage - Isolation 5000Vrms
Common Mode Transient Immunity (Min) 20kV/µs
Input Type DC
Output Type Push-Pull, Totem Pole
Current - Output / Channel 25 mA
Data Rate 5Mbps
Propagation Delay tpLH / tpHL (Max) 250ns / 250ns
Voltage - Forward (Vf) (Typ) 1.55V
Current - DC Forward (If) (Max) 25mA
Voltage - Supply 3V ~ 20V
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Package / Case 8-SMD, Gull Wing

Substitute Part Grouping Explanation

Substitution of the TLP2955(TP1,F) is determined by the following critical parameters that must be maintained or exceeded:

Mandatory Matching Parameters:

  • Single-channel configuration
  • 5000Vrms isolation voltage
  • Push-pull totem pole output topology
  • DC input type
  • Surface mount technology

Performance Parameters (Minimum Requirements):

  • Common mode transient immunity of at least 20kV/µs
  • Output current capability of at least 25 mA per channel
  • Propagation delay specifications compatible with 5Mbps data rate operation
  • Supply voltage range encompassing 3V to 20V operation
  • Operating temperature range including -40°C to 125°C

The TLP2745(TP,E) qualifies as a substitute part because it maintains all mandatory matching parameters while providing enhanced performance specifications in common mode transient immunity, output current capability, and propagation delay characteristics.

Parameter Comparison

Parameter TLP2955(TP1,F) TLP2745(TP,E) Notes
Number of Channels 1 1 Identical
Voltage - Isolation 5000Vrms 5000Vrms Identical
Common Mode Transient Immunity (Min) 20kV/µs 30kV/µs Substitute exceeds requirement
Input Type DC DC Identical
Output Type Push-Pull, Totem Pole Push-Pull, Totem Pole Identical
Current - Output / Channel 25 mA 50 mA Substitute exceeds requirement
Data Rate 5Mbps Not specified Original part specified; substitute supports equivalent or higher speeds
Propagation Delay tpLH / tpHL (Max) 250ns / 250ns 120ns / 120ns Substitute exceeds requirement
Voltage - Forward (Vf) (Typ) 1.55V 1.55V Identical
Current - DC Forward (If) (Max) 25mA 15mA Substitute lower; acceptable for DC forward current specification
Voltage - Supply 3V ~ 20V 4.5V ~ 30V Substitute range encompasses original; lower bound differs
Operating Temperature -40°C ~ 125°C -40°C ~ 110°C Substitute upper limit 15°C lower
Mounting Type Surface Mount Surface Mount Identical
Package / Case 8-SMD, Gull Wing 6-SOIC (0.295", 7.50mm Width) Different package; PCB layout modification required

Engineering Selection Recommendations

TLP2745(TP,E) as Primary Substitute:

The TLP2745(TP,E) is classified as an active product with ROHS3 compliance and REACH unaffected status, providing superior long-term supply chain stability compared to the obsolete TLP2955(TP1,F). This substitute demonstrates enhanced electrical performance across multiple parameters: common mode transient immunity increases from 20kV/µs to 30kV/µs, output current capability doubles from 25 mA to 50 mA, and propagation delay improves from 250ns to 120ns.

Design Considerations:

The TLP2745(TP,E) operates within a supply voltage range of 4.5V to 30V, which encompasses the original 3V to 20V specification with the exception of operation below 4.5V. Applications requiring 3V operation require verification of circuit compatibility with the 4.5V minimum supply voltage.

The maximum operating temperature of the TLP2745(TP,E) is 110°C, compared to 125°C for the original part. Applications requiring sustained operation above 110°C require thermal management review or alternative component selection.

The TLP2745(TP,E) is packaged in a 6-SOIC configuration versus the 8-SMD gull wing package of the original part. PCB layout modification is required to accommodate the different package footprint and pin configuration.

Compliance Status:

The TLP2745(TP,E) carries ROHS3 compliance certification and maintains REACH unaffected status, supporting regulatory requirements for new designs and production continuity.

Frequently Asked Questions (FAQ)

Q: Can the TLP2745(TP,E) directly replace the TLP2955(TP1,F) without circuit modification?

A: The TLP2745(TP,E) maintains functional equivalence in isolation voltage, channel count, input type, and output topology. However, the different package type (6-SOIC versus 8-SMD gull wing) requires PCB layout modification. Additionally, the minimum supply voltage increases from 3V to 4.5V, which must be verified for circuit compatibility.

Q: What is the impact of the improved propagation delay in the TLP2745(TP,E)?

A: The TLP2745(TP,E) provides propagation delay of 120ns compared to 250ns in the TLP2955(TP1,F). This improvement reduces signal transition time and supports higher-speed digital isolation applications. Existing designs operating at 5Mbps or lower data rates benefit from improved timing margins.

Q: Does the higher output current capability of the TLP2745(TP,E) affect circuit design?

A: The TLP2745(TP,E) provides 50 mA output current per channel versus 25 mA in the original part. This increased capability allows driving higher-impedance loads or multiple parallel loads without exceeding output current specifications. Existing designs rated for 25 mA operation remain within safe operating limits.

Q: What are the package-related considerations for substitution?

A: The TLP2745(TP,E) uses a 6-SOIC package with 0.295" width and 7.50mm body length, differing from the 8-SMD gull wing package of the TLP2955(TP1,F). PCB footprint redesign is required. Pin configuration differences must be verified against schematic requirements before layout modification.

Q: Are there temperature range limitations with the TLP2745(TP,E)?

A: The TLP2745(TP,E) operates from -40°C to 110°C, compared to -40°C to 125°C for the original part. Applications requiring sustained operation above 110°C require thermal management review or alternative component selection. The lower temperature bound remains identical at -40°C.

Q: What supply voltage considerations apply to the TLP2745(TP,E)?

A: The TLP2745(TP,E) requires a minimum supply voltage of 4.5V, compared to 3V for the TLP2955(TP1,F). Applications operating at 3V to 4.4V require circuit redesign or alternative component selection. The maximum supply voltage increases to 30V, providing greater headroom for higher-voltage applications.

Q: How does the common mode transient immunity improvement affect system design?

A: The TLP2745(TP,E) provides 30kV/µs common mode transient immunity compared to 20kV/µs in the original part. This 50% improvement provides greater noise immunity in high-speed switching environments and reduces susceptibility to ground bounce and power supply transients.

Q: What compliance certifications apply to the TLP2745(TP,E)?

A: The TLP2745(TP,E) carries ROHS3 compliance certification and maintains REACH unaffected status. These certifications support regulatory requirements for new product designs and manufacturing in regulated markets.

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