TLP2766F(F) Equivalent & Substitute Parts

Part Overview

The TLP2766F(F) is a logic output optoisolator manufactured by Toshiba Semiconductor and Storage, designed for high-speed digital isolation applications. This component features a single-channel push-pull totem pole output configuration with 5000Vrms isolation capability and 20kV/µs common mode transient immunity. The device operates at data rates up to 20MBd and is housed in a 6-SDIP gull wing surface mount package.

The TLP2766F(F) is classified as obsolete. Locating equivalent substitute parts is necessary to support ongoing system maintenance, design updates, and procurement continuity for applications currently utilizing this component.

Substiute Parts

TLP2766F(F)

Toshiba Semiconductor and StorageIn Stock: 1085TLP2766F(F) Datasheet

Current PartRFQ

TLP2766A(LF4,E

Toshiba Semiconductor and StorageIn Stock: 1025TLP2766A(LF4,E Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the TLP2766F(F) are identified based on strict electrical and mechanical parameter matching within the optoisolator category. The following parameters define substitution eligibility:

Critical Matching Parameters:

• Number of Channels: 1
• Voltage - Isolation: 5000Vrms
• Common Mode Transient Immunity (Min): 20kV/µs
• Input Type: DC
• Output Type: Push-Pull, Totem Pole
• Current - Output / Channel: 10 mA
• Data Rate: 20MBd
• Voltage - Supply: 2.7V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• ECCN: EAR99
• HTSUS: 8541.49.8000

The TLP2766A(LF4,E) qualifies as a direct substitute based on full alignment with these critical parameters. Minor variations in propagation delay, rise/fall time, forward voltage, and package dimensions do not preclude substitution when the core functional and electrical specifications remain equivalent.

Parameter Comparison

Engineering Selection Recommendations

The TLP2766A(LF4,E) is the qualified substitute for the obsolete TLP2766F(F). Selection of this substitute is based on the following engineering criteria:

Product Status: The TLP2766A(LF4,E) maintains active product status with Toshiba Semiconductor and Storage, ensuring ongoing availability and manufacturing support. The original TLP2766F(F) is obsolete, making the TLP2766A(LF4,E) the appropriate choice for new procurement and system continuity.

Electrical Equivalence: Both parts maintain identical specifications across all critical isolation, switching, and supply parameters. The 5000Vrms isolation voltage, 20kV/µs CMTI, 20MBd data rate, and 2.7V to 5.5V supply range are fully matched.

Compliance and Certifications: Both components carry identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications, confirming regulatory equivalence for export and trade purposes.

Package Compatibility: Both devices employ 6-SOIC surface mount packages suitable for automated assembly. The TLP2766A(LF4,E) package width of 7.50mm versus the TLP2766F(F) width of 6.80mm represents a minor dimensional variation within standard SOIC tolerance ranges and does not preclude PCB-level substitution in most applications.

Frequently Asked Questions (FAQ)

Q: Can the TLP2766A(LF4,E) directly replace the TLP2766F(F) in existing designs?

A: Yes. The TLP2766A(LF4,E) meets all critical electrical and functional specifications of the TLP2766F(F). Both components share identical isolation voltage, CMTI, data rate, output configuration, and supply voltage specifications. PCB layout verification is recommended to confirm package footprint compatibility, as the SOIC width differs by 0.70mm.

Q: What is the primary reason for substitution?

A: The TLP2766F(F) is classified as obsolete. The TLP2766A(LF4,E) is the active equivalent from the same manufacturer, ensuring continued component availability and manufacturing support.

Q: Are there differences in propagation delay or switching speed?

A: Propagation delay specifications are identical at 55ns maximum for both tpLH and tpHL. Rise and fall times differ slightly, with the TLP2766A(LF4,E) exhibiting faster switching characteristics (5ns and 4ns typical versus 15ns typical for the original part). These improvements do not create compatibility issues and enhance overall performance.

Q: How do the package dimensions affect substitution?

A: Both components use 6-SOIC surface mount packages. The TLP2766A(LF4,E) package width is 7.50mm compared to 6.80mm for the TLP2766F(F). This 0.70mm difference falls within standard SOIC package tolerance ranges. PCB footprint verification is necessary to confirm that existing pad layouts accommodate the substitute part.

Q: Are the forward voltage specifications compatible?

A: The TLP2766F(F) specifies 1.55V typical forward voltage, while the TLP2766A(LF4,E) specifies 1.8V maximum. Both values remain within acceptable operating ranges for DC input circuits. Circuit designs accounting for the original 1.55V specification will operate within acceptable margins with the substitute part.

Q: What certifications apply to both parts?

A: Both the TLP2766F(F) and TLP2766A(LF4,E) carry identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications, confirming regulatory equivalence for export control and tariff purposes.

Q: Is moisture sensitivity a consideration?

A: The TLP2766A(LF4,E) carries an MSL rating of 1 (Unlimited), indicating no moisture sensitivity restrictions during storage or handling. This represents an improvement over typical MSL classifications and does not create compatibility concerns.