TLP250(D4-LF1) Equivalent & Substitute Parts

Part Overview

The TLP250(D4-LF1) is a photocoupler gate driver manufactured by Toshiba Semiconductor and Storage, designed for single-channel gate driving applications. This component features galvanic isolation and is classified as a gate driver channel optoisolator. The product is currently obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, maintenance, and new design implementations where legacy compatibility is required.

Substiute Parts

TLP250(D4-LF1)

Toshiba Semiconductor and StorageIn Stock: 869TLP250(D4-LF1) Datasheet

Current PartRFQ

TLP250H(LF1,F)

Toshiba Semiconductor and StorageIn Stock: 1120TLP250H(LF1,F) Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

The TLP250H(LF1,F) qualifies as a direct substitute for the TLP250(D4-LF1) based on the following substitution criteria:

• Manufacturer Continuity: Both parts are manufactured by Toshiba Semiconductor and Storage, ensuring design heritage and reliability standards alignment
• Base Product Family: Both share the TLP250 base product number, indicating they belong to the same product line with compatible functional architecture
• Isolation Classification: Both are optoisolators designed for gate driver applications with galvanic isolation capability
• Regulatory Compliance: Both maintain identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications, ensuring export and tariff consistency
• Moisture Sensitivity: Both carry MSL 1 (Unlimited) rating, indicating equivalent environmental robustness
• Product Status Advantage: The TLP250H(LF1,F) maintains Active product status, providing ongoing manufacturer support and availability

Parameter Comparison

Engineering Selection Recommendations

The TLP250H(LF1,F) is the qualified substitute for the obsolete TLP250(D4-LF1) based on manufacturer lineage, product family alignment, and regulatory compliance consistency. The substitute maintains identical ECCN and HTSUS classifications, ensuring no changes to export control or tariff treatment. The active product status of the TLP250H(LF1,F) provides supply chain continuity and ongoing manufacturer technical support. Both components carry MSL 1 rating, confirming equivalent moisture sensitivity performance. The substitute meets ROHS3 and REACH compliance requirements, supporting modern environmental and regulatory standards.

Frequently Asked Questions (FAQ)

Q: Why is the TLP250(D4-LF1) being replaced? A: The TLP250(D4-LF1) has reached obsolete status. The TLP250H(LF1,F) is the active equivalent from the same manufacturer and product family, ensuring continued availability and support.

Q: Are the TLP250(D4-LF1) and TLP250H(LF1,F) pin-compatible? A: Both components are single-channel gate driver optoisolators from the TLP250 product family. Verify pinout compatibility against your specific application schematic and the respective datasheets before implementation.

Q: What is the difference in packaging between these parts? A: The TLP250(D4-LF1) packaging is not specified in available documentation. The TLP250H(LF1,F) uses 8-SMD Gull Wing surface mount packaging. Confirm package compatibility with your PCB design requirements.

Q: Do both parts have the same isolation voltage rating? A: The TLP250(D4-LF1) isolation voltage is not specified. The TLP250H(LF1,F) provides 3750Vrms isolation. Verify this specification meets your application requirements.

Q: Are there any regulatory or compliance differences? A: Both parts share identical ECCN (EAR99) and HTSUS (8541.49.8000) classifications. The TLP250H(LF1,F) is ROHS3 compliant and REACH unaffected, supporting current environmental regulations.

Q: What is the supply voltage range for the substitute? A: The TLP250H(LF1,F) operates with a supply voltage range of 10V to 30V. Confirm this range is compatible with your system power architecture.

Q: Can I use the TLP250H(LF1,F) as a direct drop-in replacement? A: The TLP250H(LF1,F) is functionally equivalent within the TLP250 product family. Perform electrical and mechanical verification against your specific application requirements, including pinout, package footprint, and performance specifications before implementation.