TLP2066(TPL,F) Equivalent & Substitute Parts

Part Overview

The TLP2066(TPL,F) is a Logic Output Optoisolator manufactured by Toshiba Semiconductor and Storage, designed for high-speed digital isolation applications. This device features a single-channel push-pull totem pole output configuration with 3750Vrms isolation voltage and 15kV/µs common mode transient immunity. The part operates at data rates up to 20Mbps with propagation delays of 60ns maximum.

The TLP2066(TPL,F) is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support long-term product maintenance where this component is currently deployed.

Substiute Parts

TLP2066(TPL,F)
Toshiba Semiconductor and StorageIn Stock: 1142TLP2066(TPL,F) Datasheet
TLP2066(TPL,F)
Current Part
TLP2366(TPL,E
Toshiba Semiconductor and StorageIn Stock: 8564TLP2366(TPL,E Datasheet
TLP2366(TPL,E
MFR Recommended

Key Parameters

Parameter Value
Number of Channels 1
Voltage - Isolation 3750Vrms
Common Mode Transient Immunity (Min) 15kV/µs
Output Type Push-Pull, Totem Pole
Data Rate 20Mbps
Current - Output / Channel 10 mA
Propagation Delay tpLH / tpHL (Max) 60ns / 60ns
Voltage - Supply 3V ~ 3.6V
Operating Temperature -40°C ~ 100°C
Mounting Type Surface Mount
Package / Case 6-SOIC, 5 Leads

Substitute Part Grouping Explanation

Substitution of the TLP2066(TPL,F) is determined by the following critical parameters that must remain equivalent or superior:

Mandatory Equivalence Parameters:

  • Number of Channels: 1 channel configuration
  • Voltage - Isolation: 3750Vrms minimum
  • Output Type: Push-Pull, Totem Pole topology
  • Data Rate: 20Mbps minimum
  • Current - Output / Channel: 10 mA minimum
  • Mounting Type: Surface Mount
  • Package / Case: 6-SOIC, 5 Leads form factor

Allowable Improvement Parameters:

  • Common Mode Transient Immunity: 15kV/µs or higher
  • Propagation Delay: 60ns or lower
  • Voltage - Supply: Range that encompasses 3V ~ 3.6V
  • Operating Temperature: Range that encompasses -40°C ~ 100°C

The TLP2366(TPL,E) qualifies as a direct substitute based on these criteria, offering enhanced performance specifications while maintaining full functional and physical compatibility.

Parameter Comparison

Parameter TLP2066(TPL,F) TLP2366(TPL,E) Compatibility
Number of Channels 1 1 Equivalent
Voltage - Isolation 3750Vrms 3750Vrms Equivalent
Common Mode Transient Immunity (Min) 15kV/µs 20kV/µs Improved
Output Type Push-Pull, Totem Pole Push-Pull, Totem Pole Equivalent
Data Rate 20Mbps 20MBd Equivalent
Current - Output / Channel 10 mA 10 mA Equivalent
Propagation Delay tpLH / tpHL (Max) 60ns / 60ns 40ns / 40ns Improved
Voltage - Supply 3V ~ 3.6V 2.7V ~ 5.5V Expanded Range
Operating Temperature -40°C ~ 100°C -40°C ~ 125°C Expanded Range
Mounting Type Surface Mount Surface Mount Equivalent
Package / Case 6-SOIC (0.173", 4.40mm Width), 5 Leads 6-SOIC (0.179", 4.55mm Width), 5 Leads Compatible
Product Status Obsolete Active Active Alternative Available

Engineering Selection Recommendations

TLP2366(TPL,E) as Primary Substitute:

The TLP2366(TPL,E) is the manufacturer-recommended substitute for the obsolete TLP2066(TPL,F). This part maintains all critical functional parameters while providing measurable performance enhancements and expanded operational ranges.

Compliance and Certification Status:

The TLP2366(TPL,E) carries active product status with RoHS3 compliance, MSL Level 1 (Unlimited), and REACH Unaffected designation. These certifications support long-term supply chain reliability and regulatory compliance for new designs and production continuity.

Performance Advantages:

The substitute part delivers superior common mode transient immunity (20kV/µs versus 15kV/µs) and faster propagation delays (40ns versus 60ns), providing improved noise immunity and timing performance. The expanded supply voltage range (2.7V ~ 5.5V) and extended operating temperature range (-40°C ~ 125°C) accommodate broader application requirements.

Physical Compatibility:

Both parts utilize 6-SOIC surface mount packages with 5-lead configurations. Package dimensions show minor variation (0.173" versus 0.179" width), which remains within standard PCB layout tolerances for SOIC footprints.

Frequently Asked Questions (FAQ)

Q: Can the TLP2366(TPL,E) directly replace the TLP2066(TPL,F) in existing designs?

A: Yes. The TLP2366(TPL,E) maintains equivalent channel count, isolation voltage, output topology, data rate, and output current specifications. The substitute part is physically compatible with standard 6-SOIC 5-lead footprints. Minor package width variation (0.179" versus 0.173") falls within standard PCB design tolerances.

Q: What are the key performance improvements in the TLP2366(TPL,E)?

A: The substitute part provides three measurable improvements: common mode transient immunity increases from 15kV/µs to 20kV/µs, propagation delay decreases from 60ns to 40ns, and operating temperature range extends to 125°C. Supply voltage range expands from 3V ~ 3.6V to 2.7V ~ 5.5V.

Q: Is the TLP2366(TPL,E) suitable for new product designs?

A: Yes. The TLP2366(TPL,E) carries active product status with RoHS3 compliance and MSL Level 1 rating, making it appropriate for new designs requiring long-term supply chain support and regulatory compliance.

Q: Are there any electrical parameter differences that affect circuit operation?

A: No critical differences exist. All mandatory electrical parameters—isolation voltage, output current, data rate, and output topology—remain equivalent. The improved propagation delay and CMTI represent performance enhancements that do not require circuit redesign.

Q: What is the inventory status of the substitute part?

A: The TLP2366(TPL,E) has 8485 pieces in stock as new original inventory, compared to 1099 pieces for the obsolete TLP2066(TPL,F). This availability supports immediate procurement for design transitions and production requirements.

Q: Are there packaging or moisture sensitivity considerations?

A: The TLP2366(TPL,E) carries MSL Level 1 (Unlimited) rating, indicating no moisture sensitivity limitations during storage or handling. Standard surface mount assembly processes apply without special moisture control requirements.

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