TLP127(DEL-TPR,F) Equivalent & Substitute Parts

Part Overview

The TLP127(DEL-TPR,F) is a single-channel optoisolator with Darlington output manufactured by Toshiba Semiconductor and Storage. This component provides 2500Vrms isolation voltage and is designed for DC input applications requiring galvanic isolation. The part is currently obsolete, making identification of compatible substitutes essential for ongoing system support and new design implementations.

Substiute Parts

TLP127(DEL-TPR,F)

Toshiba Semiconductor and StorageIn Stock: 740TLP127(DEL-TPR,F) Datasheet

Current PartRFQ

TLP187(TPR,E

Toshiba Semiconductor and StorageIn Stock: 3734TLP187(TPR,E Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLP127(DEL-TPR,F) is determined by the following critical parameters:

• Number of Channels: Must be 1 channel
• Output Type: Must be Darlington output
• Current Transfer Ratio (Min): Must be 1000% @ 1mA or higher
• Voltage - Output (Max): Must be 300V or greater
• Current - Output / Channel: Must be 150mA or greater
• Input Type: Must be DC
• Mounting Type: Must be Surface Mount

The TLP187(TPR,E) qualifies as a direct substitute based on matching all critical electrical parameters. While the isolation voltage is higher (3750Vrms vs 2500Vrms) and the operating temperature range is extended (-55°C ~ 110°C vs -55°C ~ 100°C), these represent improvements that maintain backward compatibility. The primary difference is the package configuration: TLP187 uses 6-SOP versus TLP127's 6-SMD (Gull Wing), requiring PCB layout verification.

Parameter Comparison

Engineering Selection Recommendations

The TLP187(TPR,E) is a qualified substitute for the obsolete TLP127(DEL-TPR,F) based on electrical parameter equivalence. The substitute maintains all critical functional specifications including isolation voltage, current transfer ratio, output voltage and current ratings, and timing characteristics.

The TLP187(TPR,E) offers two advantages over the original part: higher isolation voltage (3750Vrms vs 2500Vrms) and extended operating temperature range (-55°C ~ 110°C vs -55°C ~ 100°C). Both represent performance improvements that do not compromise backward compatibility.

The primary consideration for substitution is package configuration. The TLP127 uses a 6-SMD (Gull Wing) package while the TLP187 uses a 6-SOIC package. PCB footprint and land pattern verification is required before implementation. Pin-to-pin electrical compatibility is maintained; however, physical placement and soldering process parameters may require adjustment.

The TLP187(TPR,E) is currently in active production with ROHS3 compliance and REACH unaffected status, ensuring long-term availability and regulatory compliance for new designs and ongoing system support.

Frequently Asked Questions (FAQ)

Q: Can the TLP187(TPR,E) directly replace the TLP127(DEL-TPR,F) without circuit modification?

A: Electrical substitution is direct. All critical parameters including isolation voltage, current transfer ratio, output specifications, and timing characteristics are equivalent or superior. However, package configuration differs (6-SOIC vs 6-SMD Gull Wing), requiring PCB footprint verification and potential layout adjustment.

Q: What is the impact of the higher isolation voltage in the TLP187?

A: The TLP187 provides 3750Vrms isolation versus 2500Vrms in the TLP127. This represents a performance improvement that maintains full backward compatibility. Applications designed for 2500Vrms isolation will operate safely with the higher-rated substitute.

Q: Are there any differences in input or output characteristics?

A: Input and output characteristics are equivalent. Both parts feature DC input, Darlington output, 150mA output current capability, and 300V maximum output voltage. Forward voltage differs slightly (1.25V vs 1.15V typical), which is within normal component tolerance and does not affect circuit operation.

Q: Why is the TLP127 listed as obsolete?

A: The TLP127(DEL-TPR,F) has been discontinued by Toshiba. The TLP187 series represents the current production equivalent, offering improved specifications and compliance with modern environmental standards.

Q: What package considerations apply to this substitution?

A: The TLP127 uses a 6-SMD (4 Leads) Gull Wing package while the TLP187 uses a 6-SOIC (0.173", 4.40mm Width) package. Both are surface-mount configurations with 4 leads. PCB land pattern, footprint dimensions, and soldering process parameters must be verified for compatibility with existing designs.

Q: Is the TLP187(TPR,E) RoHS compliant?

A: Yes, the TLP187(TPR,E) is ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronic components.