TLP105(TPL,F) Equivalent & Substitute Parts

Part Overview

The TLP105(TPL,F) is a Logic Output Optoisolator featuring Push-Pull, Totem Pole output configuration with 3750Vrms isolation rating and 10kV/µs Common Mode Transient Immunity (CMTI). This single-channel photocoupler operates at data rates up to 5Mbps and is housed in a 6-MFSOP, 5-lead surface mount package.

The TLP105(TPL,F) is classified as Obsolete. Identification of equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this optoisolator.

Substiute Parts

TLP105(TPL,F)

Toshiba Semiconductor and StorageIn Stock: 4182TLP105(TPL,F) Datasheet

Current PartRFQ

TLP2355(TPL,E

Toshiba Semiconductor and StorageIn Stock: 2493TLP2355(TPL,E Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLP105(TPL,F) is determined by the following critical parameters that must be maintained or exceeded:

Mandatory Matching Parameters:

• Number of Channels: 1
• Voltage - Isolation: 3750Vrms (minimum)
• Output Type: Push-Pull, Totem Pole
• Current - Output / Channel: 25 mA (minimum)
• Propagation Delay tpLH / tpHL (Max): 250ns or better
• Mounting Type: Surface Mount
• Package Configuration: 6-lead SOIC family

Parameters Allowing Improvement:

• Common Mode Transient Immunity (CMTI): 10kV/µs or higher
• Rise / Fall Time: 30ns or faster
• Voltage - Supply: 4.5V ~ 20V or wider range
• Operating Temperature: -40°C ~ 100°C or wider range

The TLP2355(TPL,E) qualifies as a direct substitute by meeting or exceeding all mandatory parameters while providing enhanced performance characteristics in CMTI, rise/fall time, and operating temperature range.

Parameter Comparison

Engineering Selection Recommendations

TLP2355(TPL,E) as Primary Substitute:

The TLP2355(TPL,E) is the manufacturer-recommended substitute for the obsolete TLP105(TPL,F). This part maintains electrical equivalence across all critical parameters while providing enhanced performance specifications.

Product Status Consideration: The TLP105(TPL,F) carries Obsolete status with limited inventory availability (4100 pcs). The TLP2355(TPL,E) is classified as Active with established supply chain support (2400 pcs in stock), ensuring long-term availability for production and maintenance applications.

Compliance and Certification: The TLP2355(TPL,E) is RoHS Compliant with Moisture Sensitivity Level (MSL) 1 (Unlimited) and REACH Unaffected status. These certifications support regulatory compliance requirements for modern manufacturing and distribution environments. The TLP105(TPL,F) does not specify these compliance attributes.

Performance Enhancement: The TLP2355(TPL,E) provides measurable improvements in Common Mode Transient Immunity (25kV/µs versus 10kV/µs), rise/fall time performance (15ns/12ns versus 30ns/30ns), and extended operating temperature range (-40°C to 125°C versus -40°C to 100°C). These enhancements do not compromise backward compatibility and support more demanding application environments.

Package Compatibility: Both parts utilize 6-SOIC, 5-lead surface mount packages with minor dimensional variation (0.173" versus 0.179" width). This variation is within standard PCB layout tolerances for SOIC family components and does not require design modification.

Frequently Asked Questions (FAQ)

Q: Can the TLP2355(TPL,E) directly replace the TLP105(TPL,F) in existing designs?

A: Yes. The TLP2355(TPL,E) maintains electrical equivalence across all critical parameters including isolation voltage, output current, propagation delay, and supply voltage range. The 6-SOIC, 5-lead package configuration is compatible with existing PCB layouts designed for the TLP105(TPL,F).

Q: What are the key differences between these parts?

A: The TLP2355(TPL,E) provides enhanced Common Mode Transient Immunity (25kV/µs versus 10kV/µs), faster rise/fall times (15ns/12ns versus 30ns/30ns), lower minimum supply voltage (3V versus 4.5V), and extended operating temperature range (-40°C to 125°C versus -40°C to 100°C). Data rate specification is not provided for the TLP2355(TPL,E).

Q: Are there package dimension concerns when substituting?

A: The TLP2355(TPL,E) package width is 4.55mm compared to 4.40mm for the TLP105(TPL,F). This 0.15mm difference is within standard SOIC family tolerances and does not require PCB redesign. Both parts use identical 5-lead configurations and pin spacing.

Q: What is the product status difference and why does it matter?

A: The TLP105(TPL,F) is Obsolete with limited remaining inventory. The TLP2355(TPL,E) is Active with established manufacturing and distribution support. For new designs and ongoing production, the TLP2355(TPL,E) ensures supply chain continuity and eliminates obsolescence risk.

Q: Does the TLP2355(TPL,E) meet current regulatory requirements?

A: Yes. The TLP2355(TPL,E) is RoHS Compliant and REACH Unaffected, meeting current regulatory standards for electronic components. The TLP105(TPL,F) does not specify these compliance certifications.

Q: Is the lower minimum supply voltage of the TLP2355(TPL,E) a concern?

A: No. The TLP2355(TPL,E) operates from 3V minimum, which is lower than the TLP105(TPL,F) minimum of 4.5V. This provides greater design flexibility and is not a compatibility issue for applications already operating at 4.5V or higher.

Q: What is the Moisture Sensitivity Level (MSL) of the TLP2355(TPL,E)?

A: The TLP2355(TPL,E) has MSL 1 (Unlimited), indicating no moisture sensitivity restrictions for storage, handling, or reflow processes. This simplifies supply chain management and manufacturing operations.