TLE9832-2QX Equivalent & Substitute Parts

Part Overview

The TLE9832-2QX is an embedded motor driver IC manufactured by Infineon Technologies, designed for automotive applications with integrated power management and control capabilities. This device features an XC800 core processor with 36kB FLASH memory and operates across a 3V to 27V supply range, supporting temperatures from -40°C to 150°C. The product is currently classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new designs.

Substiute Parts

TLE9832-2QX
Infineon TechnologiesIn Stock: 828TLE9832-2QX Datasheet
TLE9832-2QX
Current Part
TLE98422QXXUMA1
Infineon TechnologiesIn Stock: 5896TLE98422QXXUMA1 Datasheet
TLE98422QXXUMA1
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Infineon Technologies
Core Processor XC800
Program Memory FLASH (36kB)
RAM Size 3.25K x 8
Interface LIN, SSI, UART
Number of I/O 11
Voltage Supply Range 3V ~ 27V
Operating Temperature -40°C ~ 150°C (TJ)
Grade Automotive
Package / Case 48-VFQFN Exposed Pad
Mounting Type Surface Mount
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

The TLE98422QXXUMA1 qualifies as a manufacturer-recommended substitute based on the following critical parameters:

Electrical Compatibility:

  • Identical package specification (48-VFQFN Exposed Pad)
  • Matching supplier device package (PG-VQFN-48-31)
  • Compatible voltage supply range (3V ~ 28V encompasses the original 3V ~ 27V)
  • Identical operating temperature range (-40°C ~ 150°C)
  • Equivalent interface support (LIN, SSI, UART)

Mechanical Compatibility:

  • Surface mount configuration maintained
  • Identical moisture sensitivity level (MSL 3, 168 Hours)
  • Same exposed pad thermal management design

Automotive Grade Compliance:

  • Both devices meet automotive-grade requirements
  • Substitute includes AEC-Q100 qualification

The substitute maintains functional equivalence through compatible memory architecture, I/O count, and communication interfaces, enabling direct replacement in motor driver applications.

Parameter Comparison

Parameter TLE9832-2QX TLE98422QXXUMA1 Compatibility
Manufacturer Infineon Technologies Infineon Technologies Identical
Core Processor XC800 ARM® Cortex®-M0 Different architecture
Program Memory FLASH (36kB) FLASH (40kB) Compatible (increased capacity)
RAM Size 3.25K x 8 2K x 8 Reduced capacity
Number of I/O 11 10 Reduced by 1
Voltage Supply Range 3V ~ 27V 3V ~ 28V Compatible (extended upper limit)
Operating Temperature -40°C ~ 150°C (TJ) -40°C ~ 150°C (TJ) Identical
Package / Case 48-VFQFN Exposed Pad 48-VFQFN Exposed Pad Identical
Mounting Type Surface Mount Surface Mount Identical
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours) Identical
Product Status Obsolete Active Substitute is in active production
Qualification Not specified AEC-Q100 Substitute includes automotive qualification

Engineering Selection Recommendations

The TLE98422QXXUMA1 is the manufacturer-recommended substitute for the obsolete TLE9832-2QX. Selection of this alternative is justified by:

Product Availability: The original TLE9832-2QX is obsolete with no ongoing production. The TLE98422QXXUMA1 is actively manufactured with substantial inventory availability (5810 units in stock).

Compliance & Certification: The substitute includes AEC-Q100 qualification, providing enhanced automotive-grade assurance beyond the original specification.

Physical & Electrical Compatibility: Identical package footprint (48-VFQFN Exposed Pad) and supplier device package (PG-VQFN-48-31) enable direct PCB compatibility. Voltage supply range and operating temperature specifications are equivalent or superior.

Design Considerations: Applications requiring the full 11 I/O pins or 3.25K RAM of the original device must evaluate the substitute's reduced I/O count (10) and RAM capacity (2K x 8). The increased FLASH memory (40kB vs. 36kB) provides additional program storage.

Regulatory Status: Both devices maintain REACH compliance and equivalent ECCN classifications for export control purposes.

Frequently Asked Questions (FAQ)

Q: Can the TLE98422QXXUMA1 replace the TLE9832-2QX in existing designs?

A: Direct replacement is possible for applications that do not require all 11 I/O pins or the full 3.25K RAM capacity of the original device. The identical package footprint and pin configuration enable PCB-level compatibility. Firmware validation is required to confirm functional equivalence within your specific application.

Q: What are the key differences between these devices?

A: The primary differences are processor architecture (XC800 vs. ARM Cortex-M0), RAM capacity (3.25K vs. 2K), I/O count (11 vs. 10), and FLASH memory (36kB vs. 40kB). The substitute offers increased program memory and AEC-Q100 qualification.

Q: Are the packages identical?

A: Yes. Both devices use the 48-VFQFN Exposed Pad package with the same supplier device package designation (PG-VQFN-48-31), ensuring identical PCB footprints and thermal characteristics.

Q: What is the voltage supply compatibility?

A: The TLE98422QXXUMA1 supports 3V to 28V, which encompasses the original device's 3V to 27V range. The extended upper limit provides additional design margin.

Q: Is the substitute qualified for automotive applications?

A: Yes. The TLE98422QXXUMA1 includes AEC-Q100 qualification and maintains automotive-grade classification, meeting the same application requirements as the original device.

Q: What is the moisture sensitivity level for both devices?

A: Both devices are classified as MSL 3 with a 168-hour floor life, requiring identical handling and storage protocols during assembly and deployment.

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