TLE75602EMDXUMA1 Equivalent & Substitute Parts

Part Overview

The TLE75602EMDXUMA1 is a Power Management Integrated Circuit (PMIC) functioning as a Power Switch/Driver with 1:8 N-Channel configuration, rated for 330mA maximum output current. This device is designed for relay and solenoid driver applications with SPI interface control. The part is currently classified as Obsolete, making identification of suitable substitute components essential for ongoing system support and new design implementations.

Substiute Parts

TLE75602EMDXUMA1
Infineon TechnologiesIn Stock: 13762TLE75602EMDXUMA1 Datasheet
TLE75602EMDXUMA1
Current Part
TLE75602ESDXUMA1
Infineon TechnologiesIn Stock: 3997TLE75602ESDXUMA1 Datasheet
TLE75602ESDXUMA1
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number TLE75602EMDXUMA1
Manufacturer Infineon Technologies
Category Power Management (PMIC)
Product Status Obsolete
Number of Outputs 8
Output Type N-Channel
Current - Output (Max) 330mA
Voltage - Load 3V ~ 28V
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Interface SPI
Rds On (Typ) 1Ohm
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Surface Mount
Package / Case 24-LSSOP (0.154", 3.90mm Width) Exposed Pad

Substitute Part Grouping Explanation

Substitution eligibility for the TLE75602EMDXUMA1 is determined by strict equivalence across the following critical parameters:

  • Number of Outputs: 8 channels
  • Output Type: N-Channel configuration
  • Maximum Output Current: 330mA
  • Load Voltage Range: 3V ~ 28V
  • Supply Voltage Range: 3V ~ 5.5V
  • Interface Protocol: SPI
  • On-Resistance (Rds On): 1Ohm typical
  • Operating Temperature Range: -40°C ~ 150°C
  • Mounting Type: Surface Mount
  • Base Product Number: TLE75602

The TLE75602ESDXUMA1 qualifies as a direct substitute based on identical electrical specifications and functional parameters. Packaging differences (LSSOP vs. TSSOP) represent the primary distinction, with both packages maintaining the same 24-pin configuration and 3.90mm width specification.

Parameter Comparison

Parameter TLE75602EMDXUMA1 (Main) TLE75602ESDXUMA1 (Substitute)
Manufacturer Infineon Technologies Infineon Technologies
Base Product Number TLE75602 TLE75602
Number of Outputs 8 8
Output Type N-Channel N-Channel
Current - Output (Max) 330mA 330mA
Voltage - Load 3V ~ 28V 3V ~ 28V
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V
Interface SPI SPI
Rds On (Typ) 1Ohm 1Ohm
Operating Temperature -40°C ~ 150°C (TJ) -40°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
Package / Case 24-LSSOP (0.154", 3.90mm Width) Exposed Pad 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Supplier Device Package PG-SSOP-24-9 PG-TSDSO-24-21
Moisture Sensitivity Level (MSL) 3 (168 Hours) 2A (4 Weeks)
RoHS Status Not specified ROHS3 Compliant
Grade Not specified Automotive
Qualification Not specified AEC-Q100

Engineering Selection Recommendations

The TLE75602ESDXUMA1 is the recommended substitute for the obsolete TLE75602EMDXUMA1. This recommendation is based on:

  • Active product status ensuring continued availability and manufacturing support
  • Identical electrical and functional specifications across all critical parameters
  • ROHS3 compliance and AEC-Q100 automotive qualification, providing enhanced regulatory alignment
  • Improved moisture sensitivity level (2A vs. 3), reducing handling and storage requirements
  • Equivalent pin configuration and footprint compatibility with package-level differences limited to TSSOP vs. LSSOP variants

PCB layout modifications may be required to accommodate the TSSOP package geometry, though both packages maintain identical lead pitch and overall dimensions of 3.90mm width.

Frequently Asked Questions (FAQ)

Q: Can the TLE75602ESDXUMA1 directly replace the TLE75602EMDXUMA1 without circuit modifications?

A: Electrical and functional compatibility is complete. PCB layout review is necessary due to package variant differences (LSSOP vs. TSSOP). Footprint dimensions are equivalent, but land pattern geometry may differ. Consult package datasheets for specific land pattern specifications.

Q: What is the significance of the product status change from Obsolete to Active?

A: Active status indicates the TLE75602ESDXUMA1 is in current production with guaranteed long-term availability. This eliminates supply chain risk associated with obsolete components and ensures access to manufacturing support and technical documentation.

Q: Are there differences in thermal or reliability performance between these parts?

A: Both parts share identical electrical specifications and operating temperature ranges. The substitute part carries AEC-Q100 automotive qualification, indicating enhanced reliability testing and qualification standards. Moisture sensitivity level improvement (2A vs. 3) reduces environmental stress during storage and handling.

Q: What packaging options are available for the TLE75602 base product?

A: The TLE75602 base product is available in multiple package variants. The EMDXUMA1 variant uses PG-SSOP-24-9 (LSSOP package), while the ESDXUMA1 variant uses PG-TSDSO-24-21 (TSSOP package). Both maintain 24-pin configuration with 3.90mm width and exposed pad thermal management.

Q: Is the SPI interface protocol identical between both parts?

A: Yes. Both the TLE75602EMDXUMA1 and TLE75602ESDXUMA1 implement identical SPI interface specifications. No firmware or software modifications are required for interface compatibility.

Q: What are the compliance and regulatory differences?

A: The substitute part (TLE75602ESDXUMA1) is ROHS3 compliant and carries AEC-Q100 automotive qualification. The main part status does not specify these certifications. Both parts are REACH Unaffected and classified under ECCN EAR99 and HTSUS 8542.39.0001.

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