TLC7701MDREP Equivalent & Substitute Parts

Part Overview

The TLC7701MDREP is a single-channel power management supervisor IC manufactured by Texas Instruments, designed for reset and power-on reset applications. This device features push-pull totem pole output configuration and operates across an extended temperature range of -55°C to 125°C. The part is classified as Last Time Buy, indicating end-of-life status. Identifying equivalent and substitute parts is necessary to ensure design continuity and maintain supply chain reliability for applications currently utilizing this supervisor IC.

Substiute Parts

TLC7701MDREP

Texas InstrumentsIn Stock: 1106TLC7701MDREP Datasheet

Current PartRFQ

TPS3760A012DYYR

Texas InstrumentsIn Stock: 5508TPS3760A012DYYR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC7701MDREP is determined by the following critical parameters:

• Functional Type: Single-channel supervisor with reset/power-on reset capability
• Voltage Monitoring: Single voltage threshold monitoring
• Output Stage: Push-pull totem pole output (primary requirement for direct substitution)
• Threshold Voltage: 1.1V nominal
• Reset Timeout: 1.1ms minimum
• Temperature Range: -55°C to 125°C operating capability
• Package Compatibility: 8-SOIC surface mount form factor
• Compliance: ROHS3 and REACH compliance maintained

The TPS3760A012DYYR is identified as a manufacturer-recommended substitute. However, this part exhibits differences in output configuration (open drain/open collector versus push-pull totem pole), voltage threshold (0.8V versus 1.1V), reset timeout (100µs maximum versus 1.1ms minimum), operating temperature range (-40°C to 125°C versus -55°C to 125°C), and package type (14-SOT-23-THIN versus 8-SOIC). These differences indicate functional and mechanical incompatibility for direct pin-for-pin replacement.

Parameter Comparison

Engineering Selection Recommendations

Both the TLC7701MDREP and TPS3760A012DYYR maintain ROHS3 compliance and REACH unaffected status, meeting regulatory requirements for electronic component deployment. The TLC7701MDREP carries Last Time Buy status, confirming end-of-life designation. The TPS3760A012DYYR maintains Active product status, indicating ongoing availability and manufacturer support.

Direct substitution between these parts is not supported due to fundamental differences in output stage architecture, voltage threshold specifications, reset timeout characteristics, and package form factor. Any design migration from TLC7701MDREP to TPS3760A012DYYR requires comprehensive circuit redesign, including output stage interface modification, voltage divider network adjustment, timing circuit recalibration, and PCB layout revision to accommodate the different package geometry.

Frequently Asked Questions (FAQ)

Q: Can the TPS3760A012DYYR replace the TLC7701MDREP in existing designs without modification?

A: No. The parts differ in output configuration (push-pull totem pole versus open drain/open collector), voltage threshold (1.1V versus 0.8V), reset timeout (1.1ms minimum versus 100µs maximum), and package type (8-SOIC versus 14-SOT-23-THIN). These differences require circuit redesign and PCB layout changes.

Q: What is the primary functional difference between these supervisor ICs?

A: The TLC7701MDREP provides push-pull totem pole output suitable for direct logic level driving, while the TPS3760A012DYYR uses open drain/open collector output requiring external pull-up resistors. Additionally, the voltage threshold and reset timeout specifications differ significantly.

Q: Are both parts compliant with current regulatory standards?

A: Yes. Both the TLC7701MDREP and TPS3760A012DYYR are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements for electronic component use.

Q: What temperature range considerations apply to each part?

A: The TLC7701MDREP operates from -55°C to 125°C (TA), supporting extended low-temperature applications. The TPS3760A012DYYR operates from -40°C to 125°C (TJ), limiting use in applications requiring operation below -40°C.

Q: How do the package types affect PCB design?

A: The TLC7701MDREP uses 8-SOIC (0.154", 3.90mm width) packaging, while the TPS3760A012DYYR uses 14-SOT-23-THIN packaging. These different form factors require separate PCB footprints and cannot be used interchangeably on existing circuit boards.