TLC372IP Equivalent & Substitute Parts

Part Overview

The TLC372IP is a dual differential comparator IC manufactured by Texas Instruments, utilizing LinCMOS™ technology in an 8-DIP through-hole package. This component operates across a wide supply voltage range (3V to 16V single supply, or ±1.5V to ±8V dual supply) and features CMOS/MOS open-drain TTL-compatible outputs. The TLC372IP is currently in Last Time Buy status, making identification of functionally equivalent alternatives essential for ongoing design support and procurement planning.

Substiute Parts

TLC372IP

Texas InstrumentsIn Stock: 1209TLC372IP Datasheet

Current PartRFQ

TLC372IDR

Texas InstrumentsIn Stock: 30292TLC372IDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC372IP is determined by electrical parameter equivalence across the following criteria:

• Functional Type: Dual differential comparator architecture with identical element count
• Output Configuration: CMOS/MOS open-drain TTL-compatible output stage
• Electrical Performance: Matching input offset voltage, input bias current, output current capability, and quiescent current specifications
• Supply Voltage Compatibility: Identical single and dual supply voltage operating ranges
• Temperature Rating: Matching -40°C to 85°C industrial operating range
• Base Product Number: TLC372 series designation
• Compliance: ROHS3 compliance and REACH unaffected status

The TLC372IDR qualifies as a direct electrical substitute, with the primary distinction being package format and mounting technology (surface mount SOIC versus through-hole DIP).

Parameter Comparison

Engineering Selection Recommendations

The TLC372IDR is the manufacturer-recommended substitute for the TLC372IP. Both components share identical electrical specifications and comply with ROHS3 and REACH requirements. The TLC372IDR maintains active product status with significantly higher inventory availability (30,200 pcs versus 1,129 pcs), providing superior long-term supply chain continuity.

Selection between these parts depends on board-level integration requirements:

• TLC372IP: Retain for existing through-hole PCB designs where DIP package footprints are established and rework compatibility is prioritized.
• TLC372IDR: Adopt for new designs or PCB revisions where surface-mount technology is implemented, offering reduced board space and improved manufacturing efficiency.

Both parts are electrically interchangeable when package constraints are accommodated through appropriate PCB layout modifications.

Frequently Asked Questions (FAQ)

Q: Are the TLC372IP and TLC372IDR electrically identical?

A: Yes. Both components share identical electrical specifications including supply voltage range, input offset voltage, input bias current, output current, quiescent current, and operating temperature range. Differences are limited to package format and mounting technology.

Q: What is the primary difference between these parts?

A: The TLC372IP uses an 8-DIP through-hole package (0.300" width), while the TLC372IDR uses an 8-SOIC surface-mount package (0.154" width). This distinction affects PCB layout, assembly process, and board space requirements.

Q: Can I substitute the TLC372IDR for the TLC372IP in an existing design?

A: Electrical substitution is direct. However, PCB layout modification is required to accommodate the different package footprint. The SOIC package is smaller and requires surface-mount assembly capability.

Q: Why is the TLC372IP listed as Last Time Buy?

A: Last Time Buy status indicates the manufacturer is discontinuing this product variant. The TLC372IDR, with active product status, represents the ongoing production alternative.

Q: Are both parts RoHS and REACH compliant?

A: Yes. Both the TLC372IP and TLC372IDR are ROHS3 compliant and REACH unaffected.

Q: Which part should I specify for new designs?

A: The TLC372IDR is recommended for new designs due to active product status and superior inventory availability. This ensures long-term supply chain support and reduces obsolescence risk.