TLC3702IP Equivalent & Substitute Parts

Part Overview

The TLC3702IP is a dual general-purpose comparator IC manufactured by Texas Instruments, housed in an 8-pin DIP package for through-hole mounting. This device operates across a wide supply voltage range of 3V to 16V and features CMOS push-pull TTL output architecture. The TLC3702IP is currently in Last Time Buy status, making identification of active equivalent and substitute parts essential for ongoing design support and procurement planning.

Substiute Parts

TLC3702IP

Texas InstrumentsIn Stock: 1476TLC3702IP Datasheet

Current PartRFQ

TLC3702IDR

Texas InstrumentsIn Stock: 37260TLC3702IDR Datasheet

MFR RecommendedRFQ

MAX962ESA+T

Analog Devices Inc./Maxim IntegratedIn Stock: 3691MAX962ESA+T Datasheet

MFR RecommendedRFQ

TC75W56FU,LF

Toshiba Semiconductor and StorageIn Stock: 3878TC75W56FU,LF Datasheet

MFR RecommendedRFQ

TC75W57FU,LF

Toshiba Semiconductor and StorageIn Stock: 24822TC75W57FU,LF Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC3702IP is determined by the following critical parameters:

Electrical Compatibility Requirements:

• Number of comparator elements: 2
• Output type: CMOS, Push-Pull, TTL
• Supply voltage range: Must encompass or overlap with 3V ~ 16V
• Input offset voltage, input bias current, output current, and propagation delay must remain within acceptable design tolerances
• Operating temperature range: -40°C ~ 85°C

Package and Mounting Considerations:

• The TLC3702IP uses through-hole 8-DIP packaging. Direct pin-compatible substitutes maintain this package type.
• Surface-mount alternatives (8-SOIC, 8-SSOP) require PCB redesign and are classified as functional equivalents rather than direct replacements.

Compliance and Status:

• All substitute parts maintain ROHS3 compliance and EAR99 export classification.
• Active product status is preferred for long-term availability.

Parameter Comparison

Engineering Selection Recommendations

TLC3702IDR (Texas Instruments, 8-SOIC): This is the manufacturer-recommended direct functional equivalent. It maintains identical electrical specifications to the TLC3702IP, including supply voltage range, input offset voltage, input bias current, and propagation delay. The primary difference is package format: 8-SOIC surface-mount versus 8-DIP through-hole. This substitute is suitable for new designs or PCB revisions that accommodate surface-mount technology. Product status is Active, ensuring long-term availability and supply continuity.

MAX962ESA+T (Analog Devices/Maxim Integrated, 8-SOIC): This device provides functional equivalence with notable electrical differences. The supply voltage range is restricted to 2.7V ~ 5.5V, which does not fully encompass the TLC3702IP range of 3V ~ 16V. Input offset voltage is superior at 1.5mV, and propagation delay is significantly faster at 7ns. However, quiescent current is substantially higher at 9mA compared to 65µA. This substitute is applicable only in designs operating within the 2.7V ~ 5.5V window and where lower propagation delay is beneficial. Product status is Active.

TC75W56FU,LF (Toshiba Semiconductor, 8-SSOP): This substitute offers a wider supply voltage range of 1.8V ~ 7V with dual supply option (±0.9V ~ 4.6V), exceeding the lower voltage capability of the TLC3702IP. Input bias current is superior at 1pA. Output current is higher at 25mA, and quiescent current is lower at 40µA. Propagation delay is significantly longer at 680ns. This device is suitable for low-voltage applications and designs prioritizing minimal quiescent current. Product status is Active.

TC75W57FU,LF (Toshiba Semiconductor, 8-SSOP): This substitute shares the same package and supply voltage range as TC75W56FU,LF but offers faster propagation delay at 140ns. Quiescent current is substantially higher at 400µA, making it less suitable for battery-powered or low-power applications. This device is applicable in designs requiring faster response time within the 1.8V ~ 7V supply range. Product status is Active.

All substitute parts maintain ROHS3 compliance and EAR99 export classification, ensuring regulatory consistency with the original TLC3702IP.

Frequently Asked Questions (FAQ)

Q: Can the TLC3702IP be directly replaced with TLC3702IDR on an existing PCB?

A: No. The TLC3702IP uses 8-DIP through-hole packaging, while the TLC3702IDR uses 8-SOIC surface-mount packaging. Direct PCB replacement is not possible without redesign. However, TLC3702IDR is the electrical equivalent and can be used in new designs or PCB revisions.

Q: What is the key difference between TC75W56FU,LF and TC75W57FU,LF?

A: Both devices use identical 8-SSOP packaging and supply voltage ranges. The primary difference is propagation delay: TC75W56FU,LF has a maximum of 680ns, while TC75W57FU,LF is significantly faster at 140ns. TC75W57FU,LF has higher quiescent current at 400µA versus 40µA.

Q: Is MAX962ESA+T suitable as a substitute in all applications using TLC3702IP?

A: No. The MAX962ESA+T supply voltage range is limited to 2.7V ~ 5.5V, which does not cover the full 3V ~ 16V range of the TLC3702IP. This substitute is only applicable in designs operating within the 2.7V ~ 5.5V window.

Q: Which substitute offers the lowest quiescent current?

A: TC75W56FU,LF offers the lowest quiescent current at 40µA, compared to 65µA for the TLC3702IP. This makes it suitable for battery-powered or low-power applications.

Q: Are all substitute parts RoHS compliant?

A: Yes. All substitute parts listed (TLC3702IDR, MAX962ESA+T, TC75W56FU,LF, and TC75W57FU,LF) are ROHS3 compliant, maintaining regulatory consistency with the original TLC3702IP.

Q: What is the fastest substitute in terms of propagation delay?

A: MAX962ESA+T offers the fastest propagation delay at 7ns, followed by TC75W57FU,LF at 140ns. However, MAX962ESA+T has a restricted supply voltage range of 2.7V ~ 5.5V.

Q: Can I use a surface-mount substitute on a through-hole PCB?

A: Surface-mount substitutes (TLC3702IDR, MAX962ESA+T, TC75W56FU,LF, TC75W57FU,LF) require surface-mount footprints and cannot be directly installed on through-hole PCBs. PCB redesign is necessary.