TLC27M2BIP Equivalent & Substitute Parts

Part Overview

The TLC27M2BIP is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, housed in an 8-pin DIP package for through-hole mounting applications. This device belongs to the LinCMOS™ series and is designated as Last Time Buy, indicating discontinued production with limited inventory availability. The TLC27M2BIP serves applications requiring low-power CMOS amplification with dual independent circuits in a through-hole configuration. Identifying equivalent substitute parts is essential for design continuity, long-term supply chain planning, and transition to active product lines.

Substiute Parts

TLC27M2BIP
Texas InstrumentsIn Stock: 2164TLC27M2BIP Datasheet
TLC27M2BIP
Current Part
TLC27M2BIDR
Texas InstrumentsIn Stock: 3557TLC27M2BIDR Datasheet
TLC27M2BIDR
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type CMOS
Number of Circuits 2
Slew Rate 0.62 V/µs
Gain Bandwidth Product 635 kHz
Current - Input Bias 0.7 pA
Voltage - Input Offset 224 µV
Current - Supply (x2 Channels) 285 µA
Current - Output / Channel 30 mA
Voltage - Supply Span (Min) 4 V
Voltage - Supply Span (Max) 16 V
Operating Temperature Range -40 to 85 °C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the TLC27M2BIP is determined by electrical and mechanical parameter equivalence within the TLC27M2 base product family. The primary substitute identified is the TLC27M2BIDR, which maintains identical electrical specifications across all critical performance parameters: slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current capability, and supply voltage range. Both devices operate within the same temperature range (-40°C to 85°C) and share ROHS3 compliance and REACH unaffected status.

The key differentiator between these parts is packaging and mounting technology. The TLC27M2BIP uses through-hole 8-DIP packaging, while the TLC27M2BIDR uses surface-mount 8-SOIC packaging. This distinction affects board layout, assembly process, and mechanical integration but does not alter electrical functionality or performance characteristics. The TLC27M2BIDR is designated as Active product status with higher inventory availability (3500 Pcs), compared to the Last Time Buy status of the TLC27M2BIP (2100 Pcs).

Substitution is valid when:

  • Electrical specifications match exactly across all operating parameters
  • Supply voltage range compatibility is confirmed
  • Temperature operating range requirements are met
  • Package/mounting technology change is acceptable for the application design
  • Board assembly process supports the alternative mounting method

Parameter Comparison

Parameter TLC27M2BIP (Main Part) TLC27M2BIDR (Substitute) Match Status
Manufacturer Texas Instruments Texas Instruments Identical
Series LinCMOS™ LinCMOS™ Identical
Base Product Number TLC27M2 TLC27M2 Identical
Amplifier Type CMOS CMOS Identical
Number of Circuits 2 2 Identical
Slew Rate 0.62 V/µs 0.62 V/µs Identical
Gain Bandwidth Product 635 kHz 635 kHz Identical
Current - Input Bias 0.7 pA 0.7 pA Identical
Voltage - Input Offset 224 µV 224 µV Identical
Current - Supply (x2 Channels) 285 µA 285 µA Identical
Current - Output / Channel 30 mA 30 mA Identical
Voltage - Supply Span (Min) 4 V 4 V Identical
Voltage - Supply Span (Max) 16 V 16 V Identical
Operating Temperature Range -40°C to 85°C -40°C to 85°C Identical
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
REACH Status REACH Unaffected REACH Unaffected Identical
Mounting Type Through Hole Surface Mount Different
Package / Case 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width) Different
Product Status Last Time Buy Active Different
Inventory Availability 2100 Pcs 3500 Pcs Different

Engineering Selection Recommendations

The TLC27M2BIDR serves as the direct electrical equivalent to the TLC27M2BIP with complete parameter parity across all functional specifications. Selection between these parts depends on design and manufacturing constraints rather than electrical performance.

For Through-Hole Applications: The TLC27M2BIP remains the appropriate choice when board design, assembly equipment, or application requirements mandate through-hole mounting. However, given Last Time Buy status, long-term availability is limited to current inventory levels (2100 Pcs).

For Surface-Mount Applications or New Designs: The TLC27M2BIDR is the recommended selection. This part carries Active product status, ensuring continued availability and manufacturing support from Texas Instruments. Higher inventory (3500 Pcs) provides improved supply chain security. Surface-mount technology enables smaller board footprint, automated assembly compatibility, and alignment with modern PCB manufacturing standards.

Compliance Considerations: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements for industrial and commercial applications across the -40°C to 85°C operating range.

Supply Chain Planning: Organizations currently using TLC27M2BIP should evaluate transition timelines to TLC27M2BIDR to ensure design compatibility and manufacturing process adaptation before through-hole inventory depletion.

Frequently Asked Questions (FAQ)

Q: Can TLC27M2BIDR directly replace TLC27M2BIP in existing designs?

A: Electrical substitution is complete. The TLC27M2BIDR provides identical performance across all specified parameters. However, physical substitution requires board redesign to accommodate surface-mount 8-SOIC packaging instead of through-hole 8-DIP. Pin-to-pin electrical functionality is equivalent, but mechanical integration differs.

Q: What are the package dimension differences?

A: The TLC27M2BIP uses 8-DIP with 0.300" (7.62mm) body width for through-hole insertion. The TLC27M2BIDR uses 8-SOIC with 0.154" (3.90mm) body width for surface mounting. These packages are not mechanically interchangeable on the same PCB layout.

Q: Are there any electrical performance differences between these parts?

A: No. Both parts share identical electrical specifications: 0.62 V/µs slew rate, 635 kHz gain bandwidth product, 0.7 pA input bias current, 224 µV input offset voltage, 285 µA supply current, and 30 mA output current per channel. Supply voltage range (4V to 16V) and operating temperature range (-40°C to 85°C) are identical.

Q: Why is TLC27M2BIP designated Last Time Buy?

A: Last Time Buy status indicates Texas Instruments has discontinued production of this part number. Existing inventory is available for purchase, but no future manufacturing runs are planned. This designation reflects industry transition from through-hole to surface-mount technology for new product development.

Q: What is the inventory status for each part?

A: TLC27M2BIP (Last Time Buy) has 2100 Pcs available. TLC27M2BIDR (Active) has 3500 Pcs available with ongoing manufacturing support.

Q: Are both parts RoHS and REACH compliant?

A: Yes. Both TLC27M2BIP and TLC27M2BIDR are ROHS3 compliant and REACH unaffected, meeting environmental and regulatory requirements for industrial applications.

Q: What assembly process changes are required to use TLC27M2BIDR instead of TLC27M2BIP?

A: Transition from through-hole to surface-mount assembly requires: PCB layout redesign for 8-SOIC footprint, reflow soldering process instead of wave soldering, and updated assembly equipment programming. Electrical circuit design remains unchanged.

Q: Can both parts operate across the full -40°C to 85°C temperature range?

A: Yes. Both TLC27M2BIP and TLC27M2BIDR maintain specified electrical performance across the complete -40°C to 85°C operating temperature range.

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