TLC27M2BCP Equivalent & Substitute Parts

Part Overview

The TLC27M2BCP is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, classified within the LinCMOS™ series of linear amplifiers. This device integrates two independent amplifier circuits in an 8-pin DIP package configured for through-hole mounting applications.

The TLC27M2BCP is designated as Last Time Buy status, indicating discontinued production with limited inventory availability. Identification of equivalent substitute components is necessary for design continuity, procurement planning, and long-term product support where through-hole or surface-mount alternatives are required.

Substiute Parts

TLC27M2BCP

Texas InstrumentsIn Stock: 2811TLC27M2BCP Datasheet

Current PartRFQ

TLC27M2BCDR

Texas InstrumentsIn Stock: 2709TLC27M2BCDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TLC27M2BCP is determined by electrical and mechanical parameter equivalence within the TLC27M2 product family. The primary substitution criterion is the shared base product number (TLC27M2), which guarantees identical electrical performance specifications across all variants.

The key parameters that establish substitution validity are:

• Amplifier Type: CMOS (identical across all variants)
• Number of Circuits: 2 (dual-channel configuration maintained)
• Slew Rate: 0.62 V/µs (electrical performance identical)
• Gain Bandwidth Product: 635 kHz (electrical performance identical)
• Current - Input Bias: 0.7 pA (electrical performance identical)
• Voltage - Input Offset: 224 µV (electrical performance identical)
• Current - Supply: 285 µA per channel (electrical performance identical)
• Current - Output per Channel: 30 mA (electrical performance identical)
• Voltage - Supply Span: 3 V to 16 V (electrical performance identical)
• Operating Temperature Range: 0°C to 70°C (identical operating conditions)
• RoHS Status: ROHS3 Compliant (regulatory compliance maintained)

Substitution differences are limited to packaging format and mounting technology. The TLC27M2BCP utilizes through-hole mounting in an 8-DIP package, while the TLC27M2BCDR employs surface-mount technology in an 8-SOIC package. Both variants maintain identical electrical specifications and regulatory compliance.

Parameter Comparison

Engineering Selection Recommendations

The TLC27M2BCDR is the manufacturer-recommended substitute for the TLC27M2BCP. Selection between these two variants is determined by circuit board assembly technology and mounting requirements.

TLC27M2BCP Selection Criteria:

• Through-hole mounting applications
• Designs utilizing DIP socket connectors
• Prototyping and breadboard applications
• Legacy PCB designs with through-hole footprints
• Last Time Buy status requires immediate procurement if continued use is planned

TLC27M2BCDR Selection Criteria:

• Surface-mount technology (SMT) assembly processes
• High-density PCB layouts requiring compact footprints
• Production designs with automated pick-and-place assembly
• Active product status ensures long-term availability
• Tape & Reel packaging supports automated manufacturing workflows

Both variants maintain identical electrical performance, regulatory compliance (ROHS3, REACH Unaffected, EAR99), and operational specifications. The choice between TLC27M2BCP and TLC27M2BCDR is purely a function of PCB assembly technology and mechanical mounting requirements, not electrical performance or functional capability.

Frequently Asked Questions (FAQ)

Q: Are the TLC27M2BCP and TLC27M2BCDR electrically interchangeable?

A: Yes. Both devices share the identical base product number (TLC27M2) and maintain identical electrical specifications including slew rate (0.62 V/µs), gain bandwidth product (635 kHz), input bias current (0.7 pA), input offset voltage (224 µV), supply current (285 µA per channel), output current (30 mA per channel), and supply voltage range (3 V to 16 V). Electrical performance is identical across both variants.

Q: What is the primary difference between TLC27M2BCP and TLC27M2BCDR?

A: The primary differences are packaging format and mounting technology. The TLC27M2BCP uses through-hole mounting in an 8-DIP package (0.300", 7.62mm), while the TLC27M2BCDR uses surface-mount technology in an 8-SOIC package (0.154", 3.90mm Width). The TLC27M2BCP is supplied in Tube packaging, while the TLC27M2BCDR is supplied in Tape & Reel format.

Q: Can I use TLC27M2BCDR as a direct replacement for TLC27M2BCP on an existing PCB?

A: No. Direct PCB replacement is not possible without redesign. The TLC27M2BCP requires a through-hole DIP socket or through-hole pad pattern, while the TLC27M2BCDR requires an 8-SOIC surface-mount footprint. PCB layout and assembly process modifications are necessary for substitution.

Q: Why is TLC27M2BCP designated as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of the TLC27M2BCP. Existing inventory is limited to 2770 pieces. The manufacturer recommends transitioning to the TLC27M2BCDR for new designs and future production requirements.

Q: Are both variants RoHS3 compliant?

A: Yes. Both TLC27M2BCP and TLC27M2BCDR are ROHS3 Compliant and REACH Unaffected, meeting current regulatory requirements for electronic component manufacturing and distribution.

Q: What is the operating temperature range for both variants?

A: Both the TLC27M2BCP and TLC27M2BCDR operate across the identical temperature range of 0°C to 70°C (TA).

Q: Can I use either variant in low-power applications?

A: Yes. Both variants are suitable for low-power applications. The input bias current is extremely low at 0.7 pA, and the supply current is 285 µA per channel, making both variants appropriate for battery-powered and low-power circuit designs.

Q: What supply voltage range do both variants support?

A: Both the TLC27M2BCP and TLC27M2BCDR support a supply voltage range of 3 V to 16 V, providing flexibility for single-supply and dual-supply configurations.