TLC27M2AIP Equivalent & Substitute Parts

Part Overview

The TLC27M2AIP is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, designed for low-power analog signal processing applications. This device integrates two independent amplifier circuits in a through-hole 8-DIP package configuration. The TLC27M2AIP is designated as Last Time Buy, indicating discontinued production status. Identifying equivalent substitute parts is necessary to ensure continued component availability for maintenance, repair, and new production runs requiring compatible electrical and mechanical specifications.

Substiute Parts

TLC27M2AIP

Texas InstrumentsIn Stock: 2204TLC27M2AIP Datasheet

Current PartRFQ

TLC27M2AIDR

Texas InstrumentsIn Stock: 1407TLC27M2AIDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC27M2AIP is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Criteria:

• Amplifier Type: CMOS
• Number of Circuits: 2 (dual-channel configuration)
• Slew Rate: 0.62 V/µs
• Gain Bandwidth Product: 635 kHz
• Current - Input Bias: 0.7 pA
• Voltage - Input Offset: 900 µV
• Current - Supply: 285 µA (x2 Channels)
• Current - Output / Channel: 30 mA
• Voltage - Supply Span: 4 V to 16 V
• Operating Temperature Range: -40°C to 85°C

Mechanical Compatibility Criteria:

• Base Product Number: TLC27M2 (same silicon die)
• Packaging format and pin configuration

The TLC27M2AIDR substitute part maintains identical electrical specifications and operates from the same silicon base product. The primary difference is packaging format: surface-mount 8-SOIC versus through-hole 8-DIP. This substitution is valid only when the application circuit design can accommodate surface-mount component placement.

Parameter Comparison

Engineering Selection Recommendations

TLC27M2AIDR Substitution Applicability:

The TLC27M2AIDR is a direct electrical equivalent to the TLC27M2AIP with identical functional performance across all specified electrical parameters. Selection of this substitute part is appropriate when the following conditions are met:

1. Circuit Design Compatibility: The application circuit board layout and design accommodate surface-mount 8-SOIC package placement and soldering processes.

2. Production Status: The TLC27M2AIDR maintains Active product status from Texas Instruments, ensuring continued availability and manufacturing support compared to the Last Time Buy status of the TLC27M2AIP.

3. Regulatory Compliance: Both parts maintain ROHS3 compliance and REACH Unaffected status, satisfying equivalent environmental and regulatory requirements.

4. Moisture Handling: The TLC27M2AIDR specifies MSL 1 (Unlimited), indicating no moisture sensitivity constraints during storage and handling.

5. Packaging Format: Substitution requires conversion from through-hole to surface-mount assembly processes. This change affects PCB design, assembly equipment, and manufacturing workflow.

Frequently Asked Questions (FAQ)

Q: Can the TLC27M2AIDR be used as a direct pin-for-pin replacement for the TLC27M2AIP?

A: No. While both parts share identical electrical specifications and the same base product number (TLC27M2), they use different package formats. The TLC27M2AIP uses 8-DIP through-hole packaging, while the TLC27M2AIDR uses 8-SOIC surface-mount packaging. Pin-for-pin replacement requires matching package types. However, both parts are electrically equivalent and can be used interchangeably in circuit designs that accommodate the respective package format.

Q: What are the key electrical parameters that define substitution compatibility for the TLC27M2AIP?

A: Substitution compatibility is determined by matching the following electrical specifications: CMOS amplifier type, dual-circuit configuration, 0.62 V/µs slew rate, 635 kHz gain bandwidth product, 0.7 pA input bias current, 900 µV input offset voltage, 285 µA supply current, 30 mA output current per channel, and 4 V to 16 V supply voltage range. All these parameters must be identical for functional equivalence.

Q: Why is the TLC27M2AIP designated as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of this part number. Existing inventory is available for purchase, but no future manufacturing runs are planned. The TLC27M2AIDR, which maintains Active status, represents the current production alternative with identical electrical performance.

Q: Are there any differences in reliability or performance between the 8-DIP and 8-SOIC packages?

A: The electrical performance and reliability specifications are identical between both package formats, as they use the same silicon die. Package differences affect thermal characteristics, PCB layout requirements, and assembly processes, but not the functional electrical specifications provided in this reference.

Q: What is the significance of the MSL rating difference between the two parts?

A: The TLC27M2AIP lists MSL as Not Applicable, while the TLC27M2AIDR specifies MSL 1 (Unlimited). This indicates that the surface-mount TLC27M2AIDR has no moisture sensitivity constraints during storage and handling, whereas the through-hole TLC27M2AIP does not require MSL classification. This difference does not affect electrical performance or substitution compatibility.

Q: Can the TLC27M2AIDR be used in legacy equipment designed for the TLC27M2AIP?

A: Electrical substitution is possible only if the equipment design can be modified to accommodate surface-mount components. Direct mechanical substitution in through-hole sockets is not possible. Retrofit applications require PCB redesign or the use of adapter modules to convert between package formats.