TLC27L2IP Equivalent & Substitute Parts

Part Overview

The TLC27L2IP is a CMOS linear amplifier integrated circuit manufactured by Texas Instruments, featuring two independent amplifier circuits in an 8-pin DIP package. This device is classified as Last Time Buy, indicating discontinued production with limited remaining inventory. The TLC27L2IP operates across a wide supply voltage range of 4V to 16V and is suitable for low-power applications requiring minimal input bias current and low supply current consumption. Due to its Last Time Buy status, identifying equivalent and substitute parts is essential for design continuity and long-term component availability.

Substiute Parts

TLC27L2IP

Texas InstrumentsIn Stock: 3502TLC27L2IP Datasheet

Current PartRFQ

TLC27L2IDR

Texas InstrumentsIn Stock: 20379TLC27L2IDR Datasheet

MFR RecommendedRFQ

NJM13404D#

Nisshinbo Micro Devices Inc.In Stock: 817NJM13404D# Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC27L2IP is determined by strict equivalence across the following critical parameters:

Primary Substitution Criteria:

• Number of circuits: Must equal 2
• Package compatibility: 8-pin DIP form factor for through-hole mounting applications
• Supply voltage range: Minimum 4V, maximum 16V
• Operating temperature range: -40°C to 85°C
• RoHS compliance status

Secondary Compatibility Factors:

• Slew rate, gain bandwidth product, input bias current, input offset voltage, and output current capacity must remain within acceptable ranges for the intended application
• Amplifier topology (CMOS vs. general purpose) affects performance characteristics but does not preclude substitution if electrical parameters are met

Two substitute parts are identified:

1. TLC27L2IDR (Texas Instruments): Direct electrical equivalent with identical performance specifications, differentiated by surface-mount 8-SOIC packaging and Active product status. Suitable for new designs or rework applications requiring SMD components.

2. NJM13404D# (Nisshinbo Micro Devices Inc.): Through-hole 8-DIP package equivalent with different amplifier topology (general purpose vs. CMOS). Electrical parameters differ significantly in slew rate, gain bandwidth product, and supply current, but maintains compatibility with the 8-DIP footprint and supply voltage range.

Parameter Comparison

Engineering Selection Recommendations

For Direct Replacement (Through-Hole Applications):

The NJM13404D# is the only substitute maintaining the 8-DIP through-hole package form factor identical to the TLC27L2IP. This part is suitable for direct PCB substitution in existing designs. However, the NJM13404D# exhibits significantly higher slew rate (1.2 V/µs vs. 0.03 V/µs), higher gain bandwidth product (2 MHz vs. 110 kHz), and substantially higher input bias current (25 nA vs. 0.6 pA). These differences indicate different performance characteristics and may affect circuit behavior in applications sensitive to these parameters.

For New Designs or Surface-Mount Rework:

The TLC27L2IDR is the manufacturer-recommended substitute, offering identical electrical specifications to the TLC27L2IP while maintaining Active product status. This part requires surface-mount assembly capability and PCB redesign to accommodate the 8-SOIC package. The TLC27L2IDR is preferred for long-term design continuity due to its Active status and direct electrical equivalence.

Compliance Considerations:

All three parts maintain RoHS compliance and REACH Unaffected status, suitable for applications requiring environmental regulatory adherence. The TLC27L2IDR and TLC27L2IP both carry ROHS3 Compliant designation, while the NJM13404D# carries standard RoHS Compliant status.

Frequently Asked Questions (FAQ)

Q: Can the NJM13404D# be used as a direct replacement for the TLC27L2IP in existing PCB assemblies?

A: The NJM13404D# shares the 8-DIP through-hole package footprint with the TLC27L2IP, enabling physical substitution without PCB modification. However, electrical performance differs substantially. The NJM13404D# exhibits 40 times higher slew rate, 18 times higher gain bandwidth product, and 41,667 times higher input bias current. Substitution is valid only if the application circuit tolerates these performance differences.

Q: Why is the TLC27L2IDR recommended by the manufacturer despite different packaging?

A: The TLC27L2IDR maintains identical electrical specifications to the TLC27L2IP (slew rate, gain bandwidth product, input bias current, input offset voltage, and supply current). The TLC27L2IDR carries Active product status, ensuring long-term availability, whereas the TLC27L2IP is Last Time Buy. For new designs or redesigns, the TLC27L2IDR provides superior supply chain continuity. Surface-mount assembly is standard in modern manufacturing, making the 8-SOIC package practical for production environments.

Q: What are the key electrical differences between CMOS and general-purpose amplifier topologies in these parts?

A: The TLC27L2IP and TLC27L2IDR employ CMOS topology, characterized by extremely low input bias current (0.6 pA) and low supply current (20 µA per channel). The NJM13404D# uses general-purpose topology with higher input bias current (25 nA) and higher supply current (2 mA per channel). CMOS topology is preferred for applications requiring minimal input loading and ultra-low power consumption. General-purpose topology offers higher speed (slew rate and bandwidth) at the cost of increased power consumption.

Q: Are all three parts suitable for the -40°C to 85°C operating temperature range?

A: Yes. All three parts specify -40°C to 85°C operating temperature range, meeting industrial and extended commercial temperature requirements. Temperature performance is equivalent across all three devices.

Q: What packaging considerations apply when selecting between these substitutes?

A: The TLC27L2IP and NJM13404D# both use 8-DIP through-hole packaging (0.300", 7.62mm), compatible with existing through-hole PCB designs and manual assembly processes. The TLC27L2IDR uses 8-SOIC surface-mount packaging (0.154", 3.90mm width), requiring SMD assembly equipment and PCB redesign. Through-hole packages occupy larger board area but are compatible with legacy manufacturing processes. Surface-mount packages reduce PCB footprint and are standard in modern high-volume production.

Q: Do all parts meet RoHS compliance requirements?

A: Yes. The TLC27L2IP and TLC27L2IDR carry ROHS3 Compliant designation. The NJM13404D# carries RoHS Compliant designation. All three parts are REACH Unaffected. Both compliance levels are acceptable for applications requiring environmental regulatory adherence.