TLC274BCNG4 Equivalent & Substitute Parts

Part Overview

The TLC274BCNG4 is a general-purpose operational amplifier integrated circuit featuring four independent amplifier circuits in a 14-pin DIP package. This device is designed for low-power analog signal processing applications requiring moderate bandwidth and precision input characteristics. The TLC274BCNG4 is currently discontinued at DiGi Electronics, necessitating identification of functionally equivalent substitute components for ongoing design support and procurement continuity.

Substiute Parts

TLC274BCNG4

Texas InstrumentsIn Stock: 1192TLC274BCNG4 Datasheet

Current PartRFQ

TLC274BCDR

Texas InstrumentsIn Stock: 20259TLC274BCDR Datasheet

MFR RecommendedRFQ

TLC274BCN

Texas InstrumentsIn Stock: 2975TLC274BCN Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC274BCNG4 is determined by electrical and mechanical parameter equivalence within the TLC274 base product family. The critical parameters governing substitution are:

Electrical Equivalence Criteria:

• Amplifier Type: General Purpose
• Number of Circuits: 4
• Slew Rate: 3.6 V/µs
• Gain Bandwidth Product: 2.2 MHz
• Current - Input Bias: 0.6 pA
• Voltage - Input Offset: 340 µV
• Current - Supply: 2.7 mA (x4 Channels)
• Current - Output / Channel: 30 mA
• Voltage - Supply Span: 3 V to 16 V
• Operating Temperature: 0°C ~ 70°C

Mechanical Substitution Variants: Substitute parts maintain identical electrical specifications but differ in packaging format and mounting technology. The TLC274BCNG4 original part uses through-hole mounting in a 14-DIP package. Substitutes are available in surface-mount (14-SOIC) and alternative through-hole packaging configurations, all derived from the same TLC274 base product number.

Parameter Comparison

Engineering Selection Recommendations

TLC274BCDR (14-SOIC Surface Mount)

The TLC274BCDR is the manufacturer-recommended substitute for applications requiring surface-mount technology. This variant maintains complete electrical equivalence to the TLC274BCNG4 while offering reduced board footprint and automated assembly compatibility. The TLC274BCDR carries Active product status with the highest inventory availability (20200 units), ensuring long-term procurement reliability. This part is suitable for new designs or redesigns incorporating surface-mount assembly processes.

TLC274BCN (14-DIP Through Hole)

The TLC274BCN provides direct mechanical and electrical compatibility with the original TLC274BCNG4 for through-hole mounting applications. Both parts use identical 14-DIP packaging, enabling direct socket substitution without PCB redesign. The TLC274BCN is designated Last Time Buy status, indicating limited future availability. This substitute is appropriate for immediate replacement needs in existing through-hole designs where board redesign is not feasible.

Product Status Considerations

The original TLC274BCNG4 is discontinued at DiGi Electronics. The TLC274BCDR (Active status) is the preferred long-term solution for new procurement. The TLC274BCN (Last Time Buy status) provides a transitional option for through-hole applications but should not be selected for designs with extended production timelines.

Frequently Asked Questions (FAQ)

Q: Can the TLC274BCDR replace the TLC274BCNG4 in an existing through-hole PCB design?

A: No. The TLC274BCDR uses 14-SOIC surface-mount packaging, while the TLC274BCNG4 uses 14-DIP through-hole packaging. Direct socket substitution is not possible. PCB redesign is required to accommodate the different package footprint and pin configuration. For through-hole applications, use the TLC274BCN instead.

Q: Are the electrical specifications identical between all three parts?

A: Yes. The TLC274BCNG4, TLC274BCDR, and TLC274BCN share identical electrical specifications, including slew rate (3.6 V/µs), gain bandwidth product (2.2 MHz), input bias current (0.6 pA), input offset voltage (340 µV), supply current (2.7 mA per channel), output current (30 mA per channel), and supply voltage range (3 V to 16 V). Differences are limited to packaging format and product status.

Q: Which substitute should I select for a new design?

A: The TLC274BCDR is the recommended choice for new designs. It carries Active product status, ensuring availability throughout the design lifecycle and production phase. The surface-mount 14-SOIC package also offers advantages in modern manufacturing environments.

Q: What is the difference between Tube and Tape & Reel packaging?

A: Tube packaging is used for manual or semi-automated assembly processes, with components supplied in plastic tubes. Tape & Reel (TR) packaging is designed for fully automated pick-and-place assembly, with components wound on carrier tape and supplied on reels. The TLC274BCDR uses Tape & Reel format, while the TLC274BCNG4 and TLC274BCN use Tube format.

Q: Is the TLC274BCN a viable long-term substitute?

A: The TLC274BCN is designated Last Time Buy status, indicating that Texas Instruments will discontinue production after a specified date. This part is suitable for immediate replacement needs but should not be selected for designs with extended production requirements or long-term support expectations. For long-term applications, the TLC274BCDR (Active status) is the appropriate choice.

Q: Are all three parts RoHS3 compliant?

A: Yes. The TLC274BCNG4, TLC274BCDR, and TLC274BCN are all ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronic components.