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TLC271BIDG4 Equivalent & Substitute Parts
Part Overview
The TLC271BIDG4 is a general purpose operational amplifier manufactured by Texas Instruments, housed in an 8-SOIC surface mount package. This device is classified as a LinCMOS™ series amplifier with a single circuit configuration. The TLC271BIDG4 carries an Obsolete product status, making identification of equivalent and substitute parts essential for design continuity and procurement planning. Obsolete components require alternative sourcing strategies to maintain production schedules and system reliability.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Amplifier Type | General Purpose | — |
| Number of Circuits | 1 | — |
| Slew Rate | 5.3 | V/µs |
| Gain Bandwidth Product | 2.2 | MHz |
| Current - Input Bias | 0.7 | pA |
| Voltage - Input Offset | 390 | µV |
| Current - Supply | 950 | µA |
| Current - Output / Channel | 30 | mA |
| Voltage - Supply Span (Min) | 4 | V |
| Voltage - Supply Span (Max) | 16 | V |
| Operating Temperature | -40 to 85 | °C |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | — |
| Mounting Type | Surface Mount | — |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitution of the TLC271BIDG4 is determined by electrical and mechanical parameter compatibility within the operational amplifier category. The following criteria establish valid substitution relationships:
Primary Substitution Criteria:
- Amplifier Type: General Purpose
- Number of Circuits: 1
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Slew Rate: 5.3 V/µs
- Gain Bandwidth Product: 2.2 MHz
- Current - Input Bias: 0.7 pA
- Voltage - Input Offset: 390 µV
- Current - Supply: 950 µA
- Current - Output / Channel: 30 mA
- Voltage - Supply Span (Min): 4 V
- Voltage - Supply Span (Max): 16 V
- Operating Temperature: -40°C to 85°C
Substitute Parts Identified:
Group 1: Direct Electrical Equivalents (Texas Instruments LinCMOS™ Series)
- TLC271BIDR (Tape & Reel packaging)
- TLC271BID (Tube packaging)
These parts maintain identical electrical specifications and package geometry, differing only in supply packaging format.
Group 2: Functional Alternative (Diodes Incorporated)
- TLC27L1CS-13 (Tape & Reel packaging)
This part shares the same package footprint and base product family but operates with different electrical characteristics, including reduced slew rate, lower gain bandwidth product, and reduced supply current.
Parameter Comparison
| Parameter | TLC271BIDG4 | TLC271BIDR | TLC271BID | TLC27L1CS-13 | Unit |
|---|---|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Texas Instruments | Diodes Incorporated | — |
| Amplifier Type | General Purpose | General Purpose | General Purpose | CMOS | — |
| Number of Circuits | 1 | 1 | 1 | 1 | — |
| Slew Rate | 5.3 | 5.3 | 5.3 | 0.04 | V/µs |
| Gain Bandwidth Product | 2.2 | 2.2 | 2.2 | 0.11 | MHz |
| Current - Input Bias | 0.7 | 0.7 | 0.7 | 0.7 | pA |
| Voltage - Input Offset | 390 | 390 | 390 | 10 | µV |
| Current - Supply | 950 | 950 | 950 | 14 | µA |
| Current - Output / Channel | 30 | 30 | 30 | 30 | mA |
| Voltage - Supply Span (Min) | 4 | 4 | 4 | 3 | V |
| Voltage - Supply Span (Max) | 16 | 16 | 16 | 16 | V |
| Operating Temperature | -40 to 85 | -40 to 85 | -40 to 85 | 0 to 70 | °C |
| Package / Case | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC | — |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | — |
| Product Status | Obsolete | Last Time Buy | Last Time Buy | Active | — |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | — |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | — |
Engineering Selection Recommendations
For Direct Replacement (Electrical Equivalence):
The TLC271BIDR and TLC271BID are direct electrical equivalents to the TLC271BIDG4. Both parts maintain identical electrical performance specifications and package geometry. Selection between these two options depends on procurement requirements:
- TLC271BIDR is supplied in Tape & Reel format with 11,656 units in stock and carries Last Time Buy status. This packaging format is suitable for automated assembly processes.
- TLC271BID is supplied in Tube format with 2,260 units in stock and carries Last Time Buy status. This packaging format is suitable for manual assembly or lower-volume applications.
Both parts are ROHS3 compliant and maintain the same moisture sensitivity level as the original component.
For Functional Alternative (Conditional Substitution):
The TLC27L1CS-13 manufactured by Diodes Incorporated is an active product available in Tape & Reel format with 3,600 units in stock. This part shares the same 8-SOIC package footprint and base product family but exhibits significantly different electrical characteristics:
- Slew Rate reduced to 0.04 V/µs (versus 5.3 V/µs)
- Gain Bandwidth Product reduced to 110 kHz (versus 2.2 MHz)
- Supply Current reduced to 14 µA (versus 950 µA)
- Voltage Input Offset improved to 10 µV (versus 390 µV)
- Operating Temperature range limited to 0°C to 70°C (versus -40°C to 85°C)
- Minimum Supply Voltage reduced to 3 V (versus 4 V)
The TLC27L1CS-13 is suitable only for applications where the reduced bandwidth and slew rate performance are acceptable and where the narrower operating temperature range does not conflict with system requirements. This part is ROHS3 compliant and maintains the same moisture sensitivity level.
Frequently Asked Questions (FAQ)
Q: Can TLC271BIDR be used as a direct replacement for TLC271BIDG4?
A: Yes. The TLC271BIDR is electrically identical to the TLC271BIDG4, with all electrical parameters matching exactly. The only difference is the supply packaging format (Tape & Reel versus the original packaging). Both parts are ROHS3 compliant and have identical moisture sensitivity levels.
Q: What is the difference between TLC271BIDR and TLC271BID?
A: Both parts are electrically identical to the TLC271BIDG4. The difference is packaging format: TLC271BIDR is supplied in Tape & Reel format suitable for automated assembly, while TLC271BID is supplied in Tube format suitable for manual assembly or lower-volume applications.
Q: Can TLC27L1CS-13 replace TLC271BIDG4 in all applications?
A: No. While TLC27L1CS-13 shares the same 8-SOIC package footprint, it has significantly different electrical characteristics. The slew rate is reduced from 5.3 V/µs to 0.04 V/µs, and the gain bandwidth product is reduced from 2.2 MHz to 110 kHz. Substitution is only valid for applications where these reduced performance specifications are acceptable.
Q: What is the operating temperature range difference between TLC271BIDG4 and TLC27L1CS-13?
A: TLC271BIDG4 operates from -40°C to 85°C, while TLC27L1CS-13 operates from 0°C to 70°C. Applications requiring operation below 0°C or above 70°C cannot use TLC27L1CS-13 as a substitute.
Q: Are all substitute parts ROHS3 compliant?
A: Yes. TLC271BIDR, TLC271BID, and TLC27L1CS-13 are all ROHS3 compliant, matching the compliance status of the original TLC271BIDG4.
Q: What is the product status of the substitute parts?
A: TLC271BIDR and TLC271BID carry Last Time Buy status, indicating limited future availability. TLC27L1CS-13 carries Active status, indicating ongoing production and availability.
Q: Do the substitute parts have the same package dimensions?
A: Yes. All substitute parts use the 8-SOIC package with 0.154" width (3.90mm), maintaining identical PCB footprint compatibility with the original TLC271BIDG4.
Q: What is the moisture sensitivity level for all parts?
A: All parts, including TLC271BIDG4, TLC271BIDR, TLC271BID, and TLC27L1CS-13, have Moisture Sensitivity Level 1 (Unlimited), indicating no moisture sensitivity restrictions.
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