TLC271BCP Equivalent & Substitute Parts

Part Overview

The TLC271BCP is a general-purpose operational amplifier manufactured by Texas Instruments, housed in an 8-DIP through-hole package. This device is classified as a Last Time Buy product, indicating discontinued production with limited remaining inventory. The TLC271BCP belongs to the LinCMOS™ series and is designed for applications requiring low-power, general-purpose amplification with a supply voltage range of 3V to 16V.

Finding equivalent and substitute parts is necessary due to the Last Time Buy status of the TLC271BCP. Organizations requiring long-term component availability or planning new designs must identify functionally compatible alternatives that meet the same electrical specifications and application requirements.

Substiute Parts

TLC271BCP

Texas InstrumentsIn Stock: 2181TLC271BCP Datasheet

Current PartRFQ

TLV9151IDBVR

Texas InstrumentsIn Stock: 2372TLV9151IDBVR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC271BCP is determined by the following critical parameters:

Functional Equivalence Criteria:

• Amplifier Type: General Purpose (single-circuit configuration)
• Number of Circuits: 1
• Supply Voltage Range: Minimum 3V, Maximum 16V
• Operating Temperature Range: Must encompass or exceed 0°C to 70°C
• RoHS Compliance: ROHS3 Compliant

Performance Considerations:

• Slew Rate: 5.3 V/µs (minimum acceptable for general-purpose applications)
• Gain Bandwidth Product: 2.2 MHz (minimum acceptable for general-purpose applications)
• Input Bias Current: 0.7 pA (low-bias characteristic)
• Output Current Capability: 30 mA per channel (minimum acceptable)

Package Compatibility:

• Through-hole mounting (8-DIP) is the primary package form; surface-mount alternatives are acceptable only when board design permits component substitution

The TLC271BCP has one identified manufacturer-recommended substitute: TLV9151IDBVR. This substitute meets all functional equivalence criteria while offering enhanced performance characteristics and active product status.

Parameter Comparison

Engineering Selection Recommendations

For Direct Replacement (Same Package Form):

The TLC271BCP is a Last Time Buy product with limited remaining inventory (2100 pcs). Organizations requiring through-hole 8-DIP mounted general-purpose operational amplifiers should secure inventory immediately if continued use of this specific package form is required. No direct through-hole equivalent is identified in the provided substitute list.

For Design Flexibility (Surface Mount Alternative):

The TLV9151IDBVR is the manufacturer-recommended substitute and is classified as an Active product with higher inventory availability (2339 pcs). This device is suitable for applications where surface-mount technology can be accommodated. The TLV9151IDBVR provides superior electrical performance across multiple parameters: higher slew rate (20 V/µs vs. 5.3 V/µs), higher gain bandwidth product (4.5 MHz vs. 2.2 MHz), lower supply current (560 µA vs. 950 µA), and higher output current capability (75 mA vs. 30 mA).

Compliance and Certification:

Both the TLC271BCP and TLV9151IDBVR are ROHS3 Compliant and REACH Unaffected, meeting current regulatory requirements. Both devices carry ECCN classification EAR99 and HTSUS code 8542.33.0001.

Package Transition Considerations:

Substitution from 8-DIP through-hole to SOT-23-5 surface-mount requires printed circuit board redesign. The TLV9151IDBVR operates across an extended temperature range (-40°C to 125°C) compared to the TLC271BCP (0°C to 70°C), providing additional thermal margin for industrial and extended-temperature applications.

Frequently Asked Questions (FAQ)

Q: Can the TLV9151IDBVR directly replace the TLC271BCP without circuit modification?

A: Electrical substitution is feasible because both devices are single-circuit general-purpose operational amplifiers with compatible supply voltage ranges (3V to 16V for TLC271BCP; 2.7V to 16V for TLV9151IDBVR). However, package form differs: TLC271BCP uses 8-DIP through-hole mounting while TLV9151IDBVR uses SOT-23-5 surface-mount. Printed circuit board redesign is required for physical implementation.

Q: What are the key electrical differences between TLC271BCP and TLV9151IDBVR?

A: The TLV9151IDBVR provides enhanced performance: slew rate of 20 V/µs (versus 5.3 V/µs), gain bandwidth product of 4.5 MHz (versus 2.2 MHz), lower supply current of 560 µA (versus 950 µA), and higher output current of 75 mA (versus 30 mA). The TLV9151IDBVR also features rail-to-rail output capability, whereas the TLC271BCP has standard output type. Input offset voltage is superior in the TLV9151IDBVR at 125 µV compared to 390 µV.

Q: Why is the TLC271BCP classified as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of this device. Existing inventory is available for purchase, but no future manufacturing runs are planned. Organizations dependent on this component should evaluate long-term supply requirements and consider migration to active alternatives such as the TLV9151IDBVR.

Q: Is the TLV9151IDBVR suitable for applications currently using the TLC271BCP?

A: The TLV9151IDBVR is functionally suitable for general-purpose amplification applications. Its superior electrical characteristics (higher slew rate, higher bandwidth, lower power consumption, higher output current) make it compatible with or better than the TLC271BCP for most applications. Extended operating temperature range (-40°C to 125°C) provides additional capability. Package form change requires circuit board modification.

Q: What is the moisture sensitivity level difference between these devices?

A: The TLC271BCP has Moisture Sensitivity Level (MSL) listed as Not Applicable. The TLV9151IDBVR has MSL 1 (Unlimited), indicating minimal moisture sensitivity and no special handling requirements during storage or assembly.

Q: Are both devices RoHS compliant?

A: Yes, both the TLC271BCP and TLV9151IDBVR are ROHS3 Compliant and REACH Unaffected, meeting current environmental and regulatory standards for electronic components.