TLC25L2BCP Equivalent & Substitute Parts

Part Overview

The TLC25L2BCP is a CMOS linear amplifier integrated circuit manufactured by Texas Instruments, featuring two independent amplifier circuits in an 8-pin DIP package. This device is classified as a Last Time Buy product, indicating that it is no longer in active production. The TLC25L2BCP operates as a low-power, single-ended output amplifier suitable for applications requiring minimal supply current and low input bias characteristics.

Due to its Last Time Buy status, identifying equivalent and substitute parts is necessary for design continuity, long-term product support, and inventory planning. Substitute parts must maintain functional compatibility while accommodating differences in packaging, performance characteristics, and product availability.

Substiute Parts

TLC25L2BCP

Texas InstrumentsIn Stock: 2153TLC25L2BCP Datasheet

Current PartRFQ

TLC27L2BCDR

Texas InstrumentsIn Stock: 10039TLC27L2BCDR Datasheet

MFR RecommendedRFQ

NJM13404D#

Nisshinbo Micro Devices Inc.In Stock: 817NJM13404D# Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC25L2BCP is determined by the following critical parameters:

Functional Requirements:

• Dual-circuit amplifier configuration (2 circuits minimum)
• CMOS amplifier technology
• Single-ended output topology
• Gain bandwidth product of 110 kHz
• Low input bias current (sub-nanoampere range)
• Low input offset voltage (sub-millivolt range)

Electrical Operating Range:

• Supply voltage span: 1.4 V to 16 V minimum compatibility
• Supply current per channel: 29 µA or lower preferred
• Operating temperature range: 0°C to 70°C minimum

Physical and Compliance Requirements:

• Through-hole or surface-mount packaging options acceptable
• 8-pin package configuration
• RoHS3 compliance mandatory
• REACH unaffected status

Two substitute parts meet these criteria with varying trade-offs:

1. TLC27L2BCDR — Same manufacturer (Texas Instruments), LinCMOS™ series, surface-mount alternative with improved supply current efficiency and active product status
2. NJM13404D# — Alternative manufacturer (Nisshinbo Micro Devices Inc.), general-purpose amplifier topology, through-hole package matching, extended temperature range, higher gain bandwidth product

Parameter Comparison

Engineering Selection Recommendations

TLC27L2BCDR Selection Criteria:

The TLC27L2BCDR is the manufacturer-recommended substitute within the Texas Instruments LinCMOS™ product family. This part maintains identical gain bandwidth product (110 kHz) and series classification, ensuring functional equivalence for applications designed around the TLC25L2BCP. The TLC27L2BCDR offers superior supply current efficiency (20 µA versus 29 µA) and lower input offset voltage (204 µV versus 235 µV), making it suitable for power-constrained applications.

The primary trade-off is packaging: the TLC27L2BCDR uses 8-SOIC surface-mount configuration rather than through-hole DIP. This substitution is appropriate for new designs or PCB redesigns that accommodate surface-mount technology. The TLC27L2BCDR holds Active product status and maintains ROHS3 compliance, ensuring long-term availability and regulatory alignment.

NJM13404D# Selection Criteria:

The NJM13404D# provides a through-hole package alternative (8-DIP) matching the original TLC25L2BCP form factor, eliminating PCB redesign requirements. This part is manufactured by Nisshinbo Micro Devices Inc. and maintains Active product status with extended operating temperature range (-40°C to 85°C).

The NJM13404D# operates as a general-purpose amplifier with significantly higher gain bandwidth product (2 MHz versus 110 kHz) and substantially higher supply current (2 mA versus 29 µA). Input bias current is elevated (25 nA versus 0.7 pA), and input offset voltage is higher (500 µV versus 235 µV). This part is suitable for applications where higher bandwidth and output current capability (35 mA per channel) are beneficial, or where the extended temperature range is required. The supply voltage span minimum is lower (2 V versus 1.4 V), providing broader compatibility with certain power supply configurations.

Compliance and Availability:

Both substitute parts maintain RoHS compliance and REACH unaffected status. The TLC27L2BCDR and NJM13404D# both hold Active product status, ensuring continued manufacturing and supply chain availability, contrasting with the Last Time Buy status of the original TLC25L2BCP.

Frequently Asked Questions (FAQ)

Q: Can the TLC27L2BCDR directly replace the TLC25L2BCP without circuit modification?

A: The TLC27L2BCDR maintains electrical compatibility in terms of gain bandwidth product, input bias current, and supply voltage range. However, the packaging differs (8-SOIC surface-mount versus 8-DIP through-hole). Direct socket replacement is not possible; PCB redesign is required. Electrical performance is equivalent for applications operating within the specified parameter ranges.

Q: What are the key performance differences between TLC27L2BCDR and NJM13404D#?

A: The TLC27L2BCDR maintains the original 110 kHz gain bandwidth product and ultra-low supply current (20 µA), making it suitable for low-power applications. The NJM13404D# provides 2 MHz gain bandwidth product with higher supply current (2 mA) and elevated input bias current (25 nA), making it suitable for higher-frequency applications or where increased output current is required. The NJM13404D# offers extended temperature range (-40°C to 85°C) compared to the standard 0°C to 70°C range.

Q: Is the NJM13404D# a pin-compatible replacement for the TLC25L2BCP?

A: Both the TLC25L2BCP and NJM13404D# use 8-DIP through-hole packaging with 0.300" (7.62mm) spacing, providing physical pin compatibility. However, electrical characteristics differ significantly. The NJM13404D# exhibits higher input bias current, higher supply current, and higher gain bandwidth product. Circuit validation is required to confirm functional compatibility for specific applications.

Q: Which substitute part should be selected for new product designs?

A: For new designs prioritizing low power consumption and maintaining the original performance envelope, the TLC27L2BCDR is recommended. This part offers improved efficiency and maintains the LinCMOS™ series characteristics. For applications requiring higher bandwidth, extended temperature range, or where through-hole packaging is mandatory without PCB redesign, the NJM13404D# is appropriate.

Q: Are both substitute parts RoHS compliant?

A: Yes. The TLC27L2BCDR is ROHS3 compliant. The NJM13404D# is RoHS compliant. Both parts maintain REACH unaffected status, meeting current regulatory requirements for electronic component manufacturing and distribution.

Q: What is the impact of the TLC25L2BCP Last Time Buy status?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of the TLC25L2BCP and will not accept new orders beyond a specified cutoff date. Existing inventory is limited (2100 pieces noted). For applications currently using this part, transition planning to either the TLC27L2BCDR or NJM13404D# is necessary to ensure long-term supply continuity and product support.

Q: Can the TLC27L2BCDR be used in applications requiring ultra-low supply voltage (below 3 V)?

A: No. The TLC27L2BCDR minimum supply voltage is 3 V, whereas the original TLC25L2BCP operates down to 1.4 V. For applications requiring operation below 3 V, the TLC25L2BCP or NJM13404D# (minimum 2 V) must be used. The NJM13404D# provides a compromise with 2 V minimum supply voltage.

Q: What packaging considerations apply when selecting between these parts?

A: The TLC25L2BCP and NJM13404D# both use through-hole 8-DIP packaging suitable for breadboard prototyping and traditional PCB assembly. The TLC27L2BCDR uses surface-mount 8-SOIC packaging, requiring SMT assembly equipment and PCB design modifications. Packaging selection depends on manufacturing capability, PCB design constraints, and production volume requirements.