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TLC254BCN Equivalent & Substitute Parts
Part Overview
The TLC254BCN is a CMOS amplifier integrated circuit containing four independent operational amplifier circuits in a 14-pin DIP package. This device features open drain output configuration and is manufactured by Texas Instruments under the LinCMOS™ series. The TLC254BCN is designated as Last Time Buy, indicating that the manufacturer has discontinued or will discontinue production. Identifying equivalent and substitute parts is necessary to ensure continued availability for new designs, production runs, and maintenance applications where this component is specified.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Manufacturer Part Number | TLC254BCN | — |
| Manufacturer | Texas Instruments | — |
| Number of Circuits | 4 | — |
| Amplifier Type | CMOS | — |
| Output Type | Open Drain | — |
| Slew Rate | 4.5 | V/µs |
| Gain Bandwidth Product | 2.2 | MHz |
| Current - Input Bias | 0.2 | pA |
| Voltage - Input Offset | 340 | µV |
| Current - Supply (4 Channels) | 2.7 | mA |
| Voltage - Supply Span (Min) | 1.4 | V |
| Voltage - Supply Span (Max) | 16 | V |
| Operating Temperature Range | 0 to 70 | °C |
| Mounting Type | Through Hole | — |
| Package / Case | 14-DIP (0.300", 7.62mm) | — |
| RoHS Status | ROHS3 Compliant | — |
| Product Status | Last Time Buy | — |
Substitute Part Grouping Explanation
Substitution of the TLC254BCN is determined by the following critical parameters:
Circuit Configuration: The part must contain four independent amplifier circuits to maintain functional equivalence in multi-channel applications.
Supply Voltage Compatibility: The substitute must operate within the supply voltage range of 1.4 V to 16 V to ensure compatibility with existing power supply designs.
Output Configuration: The TLC254BCN features open drain outputs. Substitute parts with rail-to-rail output configuration are functionally compatible in applications where the open drain characteristic is not a design requirement, as rail-to-rail outputs provide greater flexibility and higher output current capability.
Packaging and Mounting: The original part uses through-hole 14-DIP packaging. Substitutes may use surface mount packaging (14-SOIC) when board redesign or rework is acceptable.
Electrical Performance: Input bias current, input offset voltage, slew rate, and gain bandwidth product determine suitability for specific signal conditioning applications. Substitutes with improved specifications (lower input bias current, lower offset voltage, higher slew rate, higher bandwidth) are generally compatible with designs specified for the TLC254BCN.
Compliance and Availability: RoHS3 compliance and active product status ensure long-term availability and regulatory compliance.
Parameter Comparison
| Parameter | TLC254BCN | TLV9154IDR | Unit |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | — |
| Number of Circuits | 4 | 4 | — |
| Amplifier Type | CMOS | General Purpose | — |
| Output Type | Open Drain | Rail-to-Rail | — |
| Slew Rate | 4.5 | 20 | V/µs |
| Gain Bandwidth Product | 2.2 | 4.5 | MHz |
| Current - Input Bias | 0.2 | 10 | pA |
| Voltage - Input Offset | 340 | 125 | µV |
| Current - Supply (4 Channels) | 2.7 | 0.56 | mA |
| Current - Output / Channel | — | 75 | mA |
| Voltage - Supply Span (Min) | 1.4 | 2.7 | V |
| Voltage - Supply Span (Max) | 16 | 16 | V |
| Operating Temperature Range | 0 to 70 | -40 to 125 | °C |
| Mounting Type | Through Hole | Surface Mount | — |
| Package / Case | 14-DIP (0.300", 7.62mm) | 14-SOIC (0.154", 3.90mm) | — |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | — |
| Product Status | Last Time Buy | Active | — |
Engineering Selection Recommendations
TLV9154IDR as Primary Substitute
The TLV9154IDR is the manufacturer-recommended substitute for the TLC254BCN. Both devices are manufactured by Texas Instruments and maintain RoHS3 compliance. The TLV9154IDR is in active production status, ensuring long-term availability and supply chain continuity.
Functional Compatibility
The TLV9154IDR contains four independent amplifier circuits matching the TLC254BCN configuration. The rail-to-rail output topology of the TLV9154IDR is functionally compatible with open drain output applications in most signal conditioning, buffering, and interface circuits. The rail-to-rail output provides higher output current capability (75 mA per channel) compared to open drain configurations, enabling direct drive of additional circuit stages without external pull-up resistors.
Performance Advantages
The TLV9154IDR demonstrates superior electrical performance across multiple parameters: slew rate is 4.4× higher (20 V/µs vs. 4.5 V/µs), gain bandwidth product is 2.05× higher (4.5 MHz vs. 2.2 MHz), input offset voltage is 63% lower (125 µV vs. 340 µV), and supply current is 79% lower (0.56 mA vs. 2.7 mA for four channels). These improvements result in faster signal response, reduced power consumption, and improved DC accuracy.
Supply Voltage Consideration
The TLV9154IDR minimum supply voltage is 2.7 V, compared to 1.4 V for the TLC254BCN. Applications requiring operation below 2.7 V single supply or below 1.35 V dual supply cannot use the TLV9154IDR as a direct substitute. The maximum supply voltage of 16 V is identical for both devices.
Operating Temperature Range
The TLV9154IDR operates from -40°C to 125°C, extending the lower temperature limit by 40°C and the upper temperature limit by 55°C compared to the TLC254BCN (0°C to 70°C). This extended range accommodates industrial and automotive applications.
Packaging and Board Integration
The TLV9154IDR uses 14-SOIC surface mount packaging (0.154" width, 3.90 mm) versus the 14-DIP through-hole package (0.300" width, 7.62 mm) of the TLC254BCN. Board redesign is required for substitution. Surface mount packaging reduces board area by approximately 60% and enables automated assembly processes.
Frequently Asked Questions (FAQ)
Q: Can the TLV9154IDR directly replace the TLC254BCN in existing PCB designs?
A: No. The TLC254BCN uses 14-DIP through-hole packaging while the TLV9154IDR uses 14-SOIC surface mount packaging. PCB redesign and rework are required. However, the functional and electrical characteristics are compatible for most applications.
Q: What is the key difference between open drain and rail-to-rail output configurations?
A: Open drain outputs require external pull-up resistors to establish output voltage levels and are limited to sinking current. Rail-to-rail outputs can both source and sink current up to the specified output current limit (75 mA per channel for TLV9154IDR) and do not require external pull-up resistors. Rail-to-rail outputs provide greater flexibility and higher output current capability.
Q: Is the TLV9154IDR suitable for applications requiring supply voltages below 2.7 V?
A: No. The TLV9154IDR minimum supply voltage is 2.7 V. Applications requiring operation at 1.4 V to 2.6 V cannot use this substitute. Alternative parts must be evaluated for ultra-low voltage applications.
Q: How does the lower supply current of the TLV9154IDR affect system design?
A: The TLV9154IDR consumes 0.56 mA total supply current (four channels) compared to 2.7 mA for the TLC254BCN, representing a 79% reduction. This lower power consumption reduces thermal load, extends battery life in portable applications, and decreases power supply requirements.
Q: Are both devices RoHS3 compliant?
A: Yes. Both the TLC254BCN and TLV9154IDR are RoHS3 compliant, meeting regulatory requirements for hazardous substance restrictions in electronic equipment.
Q: What is the significance of the TLC254BCN being designated as Last Time Buy?
A: Last Time Buy status indicates that Texas Instruments has discontinued or will discontinue production of the TLC254BCN. Existing inventory will be depleted, and the part will no longer be available from the manufacturer. Substitution with the active-status TLV9154IDR ensures continued access to equivalent functionality and long-term supply chain reliability.
Q: Can the improved slew rate and bandwidth of the TLV9154IDR cause compatibility issues?
A: The higher slew rate (20 V/µs vs. 4.5 V/µs) and bandwidth (4.5 MHz vs. 2.2 MHz) of the TLV9154IDR are performance improvements that do not introduce compatibility issues. Applications designed for the TLC254BCN will function correctly with the TLV9154IDR. The faster response characteristics may improve system performance in bandwidth-limited applications.
Q: What certifications and compliance standards apply to both devices?
A: Both devices are RoHS3 compliant, REACH unaffected, and classified under ECCN EAR99 for export control purposes. HTSUS classification is 8542.33.0001 for both parts.
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