TLC254ACN Equivalent & Substitute Parts

Part Overview

The TLC254ACN is a CMOS operational amplifier featuring four independent circuits with open drain output configuration, manufactured by Texas Instruments under the LinCMOS™ series. This device is classified as Obsolete, indicating discontinued production and limited availability in the market. The TLC254ACN is packaged in a 14-pin DIP (Dual In-line Package) format suitable for through-hole mounting applications. Due to its obsolete status and finite inventory levels, identification of functionally equivalent substitute components is necessary for design continuity and procurement planning.

Key Parameters

Parameter	Value
Amplifier Type	CMOS
Number of Circuits	4
Output Type	Open Drain
Slew Rate	4.5 V/µs
Gain Bandwidth Product	2.2 MHz
Current - Input Bias	0.6 pA
Voltage - Input Offset	900 µV
Current - Supply	2.7 mA (x4 Channels)
Voltage - Supply Span (Min)	1.4 V
Voltage - Supply Span (Max)	16 V
Operating Temperature	0°C ~ 70°C
Package / Case	14-DIP (0.300", 7.62 mm)
Mounting Type	Through Hole
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the TLC254ACN is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Criteria:

Amplifier Type: CMOS
Number of Circuits: 4
Output Type: Open Drain
Slew Rate: 4.5 V/µs
Gain Bandwidth Product: 2.2 MHz
Current - Input Bias: 0.6 pA
Voltage - Input Offset: 900 µV
Current - Supply: 2.7 mA (x4 Channels)
Voltage - Supply Span: 1.4 V to 16 V
Operating Temperature Range: 0°C ~ 70°C

Mechanical & Compliance Criteria:

Base Product Number: TLC254
RoHS Status: ROHS3 Compliant
Moisture Sensitivity Level: 1 (Unlimited)
REACH Status: REACH Unaffected

The primary substitute identified is the TLC254ACD, which maintains identical electrical specifications while differing only in packaging format and mounting technology. The TLC254ACD transitions from through-hole DIP packaging to surface-mount SOIC packaging, representing a package-level substitution suitable for redesigned PCB layouts.

Parameter Comparison

Parameter	TLC254ACN	TLC254ACD
Manufacturer	Texas Instruments	Texas Instruments
Amplifier Type	CMOS	CMOS
Number of Circuits	4	4
Output Type	Open Drain	Open Drain
Slew Rate	4.5 V/µs	4.5 V/µs
Gain Bandwidth Product	2.2 MHz	2.2 MHz
Current - Input Bias	0.6 pA	0.6 pA
Voltage - Input Offset	900 µV	900 µV
Current - Supply	2.7 mA (x4 Channels)	2.7 mA (x4 Channels)
Voltage - Supply Span (Min)	1.4 V	1.4 V
Voltage - Supply Span (Max)	16 V	16 V
Operating Temperature	0°C ~ 70°C	0°C ~ 70°C
Mounting Type	Through Hole	Surface Mount
Package / Case	14-DIP (0.300", 7.62 mm)	14-SOIC (0.154", 3.90 mm Width)
Product Status	Obsolete	Last Time Buy
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	1 (Unlimited)	1 (Unlimited)

Engineering Selection Recommendations

TLC254ACD Selection Criteria:

The TLC254ACD is the direct electrical equivalent of the TLC254ACN, maintaining all specified electrical parameters including slew rate, gain bandwidth product, input bias current, and supply voltage range. Both components are ROHS3 compliant and carry identical REACH status classification.

The primary distinction between these components is packaging technology. The TLC254ACN utilizes through-hole DIP packaging, while the TLC254ACD employs surface-mount SOIC packaging. Selection of the TLC254ACD requires PCB redesign to accommodate SOIC footprint and surface-mount assembly processes.

The TLC254ACD carries a Last Time Buy product status, indicating limited future availability. Current inventory levels for the TLC254ACD (3350 pieces) exceed those of the TLC254ACN (875 pieces), providing improved procurement flexibility for new designs.

Both components satisfy identical compliance requirements and environmental classifications, supporting direct substitution from a regulatory and reliability standpoint.

Frequently Asked Questions (FAQ)

Q: Can the TLC254ACD directly replace the TLC254ACN in existing through-hole PCB designs?

A: No. The TLC254ACD requires surface-mount SOIC footprint, incompatible with through-hole DIP socket designs. PCB redesign is necessary for mechanical and electrical integration.

Q: Are the electrical specifications identical between TLC254ACN and TLC254ACD?

A: Yes. Both components share identical electrical parameters across all specified criteria: slew rate, gain bandwidth product, input bias current, voltage offset, supply current, and operating temperature range.

Q: What is the significance of the product status difference between Obsolete and Last Time Buy?

A: Obsolete status indicates the TLC254ACN is no longer manufactured and existing inventory is finite. Last Time Buy status for the TLC254ACD indicates production will cease, but current inventory remains available for procurement. This distinction affects long-term supply chain planning.

Q: Are compliance certifications equivalent between these components?

A: Yes. Both the TLC254ACN and TLC254ACD maintain ROHS3 compliance, REACH unaffected status, and identical moisture sensitivity level classification (MSL 1 - Unlimited).

Q: What mounting considerations apply when transitioning from TLC254ACN to TLC254ACD?

A: The TLC254ACN uses through-hole mounting suitable for manual insertion and wave soldering. The TLC254ACD requires surface-mount assembly processes including pick-and-place equipment and reflow soldering. PCB layout, assembly procedures, and test fixtures require modification.

Q: Can the TLC254ACD be used in new designs as a primary component selection?

A: Yes. The TLC254ACD is electrically and functionally equivalent to the TLC254ACN. New designs should prioritize the TLC254ACD due to improved current inventory availability and surface-mount technology advantages in modern manufacturing environments.

Request Quote (Ships tomorrow)

Part Number

Quantity

Company

Contact Name

E-mail

Message